• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.12
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• pp.2662-2669
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• 2002

Recently structural applications of adhesive bonding method have been increased extensively in automobile industry. Adhesively-bonded joints which are used in automobile field are exposed to various environmental conditions. In this study, several environmental factors were concerned to evaluate their effects on the adhesive strength such as air temperature, water temperature, exposed time in water. The specimens are exposed for 1, 10 and 100 hours at various air temperatures to evaluate the effects of the air and water temperature on the adhesive strength. It is proved that the adhesive strength decrease with rising the air and water temperature, and the adhesive strength decrease steeply at the higher temperature with increasing the exposure time in water.

• Journal of the Korean Wood Science and Technology
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• v.38 no.6
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• pp.541-546
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• 2010

This study was to investigate the dry bond strengths of the plywoods manufactured with 3 hours ozonized soybean oil (SBO)/polymeric methylene diphenyl diisocyanate (pMDI) adhesive at mid and high curing temperature. In results of the dry bonding strengths of the 3 hrs-ozonized SBO mixed with pMDI at high curing temperature were respectively the strengths of weight ratio of 3hrs-ozonized SBO : pMDI, 1 : 0.5, 4.74 kgf/$cm^2$, 1 : 0.75, 7.14 kgf/$cm^2$ 1 : 1, 9.29 kgf/$cm^2$, 1 : 2, 16.53 kgf/$cm^2$, 1 : 3, 17.42 kgf/$cm^2$, and 1 : 4, 16.75 kgf/$cm^2$. Therefore, it was found that the equivalent ratio was formed approximately between 3 hrs-ozonized SBO : pMDI 1 : 2 and 1 : 3. The dry bonding strengths of the 3hrs-ozonized SBO mixed with pMDI at medium curing temperature were respectively the strengths of weight ratio of 3 hrs-ozonized SBO : pMDI, 1 : 0.5, 3.16 kgf/$cm^2$, 1 : 0.75, 6.13 kgf/$cm^2$ 1 : 1, 8.18 kgf/$cm^2$, 1 : 2, 11.82 kgf/$cm^2$. In this experiment the higher bonding strength at high curing temperature was shown approximately between 3 hrs-ozonized SBO : pMDI 1 : 2 and 1 : 3. If this wood adhesive is used at high curing temperature, it is possibile to bond the plywoods.

• Journal of the Korean Wood Science and Technology
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• v.43 no.5
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• pp.682-690
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• 2015

The bonding performance of two types of wood adhesives, namely phenol-resorcinol-formaldehyde (PRF) resin and melamine-urea-formaldehyde (MUF) resin for glued laminated timber manufactured by high frequency (HF) heating was evaluated. The HF heating system consists of HF oscillator with dielectric heating system for curing adhesives, and hydraulic press system for clamping glued laminated timber. The designed frequency and output power of the HF system was as 5 MHz and 60 kW, respectively. To verify dielectric heating mechanism under HF oscillation, the heat loss factors of laminae and adhesives were measured. The results show that it is possible to selectively heat adhesives for their curing due to the remarkably higher loss factor of the adhesives than those of wood laminae. The temperature of adhesive in the bonding line reached up to the set temperature within a few seconds by high frequency oscillating, which advanced the curing of adhesive afterwards. The bonding performance, such as shear strength of bonding line, water soaking delamination, and boiling water soaking delamination of PRF resin met the requirement of Korean Standard (KS), however the MUF resin did not meet the KS requirement of boiling water soaking delamination. These results indicate that the HF heating system is successful to manufacture glued laminated timbers with PRF resins to meet the bonding requirements.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1106-1111
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• 2006

To improve warpage, delamination and the chemical reaction between 2 different co-fired materials, the bonding behavior with common glass was studied. As shown in the previous paper, the phenomenon of the infiltration is different with the composition of the glass. In particular, in the case of low temperature melting glass, infiltration is experimented in this study. GA-1 glass is infiltrated among $BaTiO_3$ particles below $800^{\circ}C$ and is made by glass/ceramic composite. Until the laminate is fired under $850^{\circ}C$, provskite phase is observed. Although in the case of GA-12 glass, the temperature of the glass infiltration is lower than it of GA-l glass, the perovskite phase already disappears at $800^{\circ}C$. As a result, GA-1 and GA-12 glasses are infiltrated among particles at low temperature, however, the chemical reactivity of the glass/ceramic and sintering temperature should be considered.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.533-540
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• 1997

The microwave dielectric properties of ((P $b_{1-x}$ C $a_{x}$)Zr $O_3$ and (P $b_{0.63}$,C $a_{0.37-x}$ $M_{x}$)Zr $O_3$(M=Mg,Sr) ceramics were investigated. In (P $b_{1-x}$ C $a_{x}$)Zr $O_3$ (X=0.33~0.40) ceramics, high quality factor and small temperature coefficient of resonant frequency were obtain in (P $b_{0.63}$C $a_{0.37}$)Zr $O_3$with perovskite structure. In the case of (P $b_{0.63}$C $a_{0.37-x}$M $g_{x}$)Zr $O_3$ dielectric constant temperature coefficient of resonant frequency increased and quality factor decreased due to increase of polarization of A-O bonding. When replacing Ca ion with Sr ion with large ion radius, polarization decreased with increased of bonding length and thus dielectric constant and temperature coefficient of resonant frequency decreased.decreased.creased.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.10a
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• pp.799-804
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• 2013

The sensor/actuator active sensor diagnostics procedure, where the sensors/actuators are confirmed to be functioning properly during operation, is a critical component to successfully complete the structural health monitoring (SHM) process with large numbers of active sensors typically installed in a structure. The basis of this process is to track the changes in the capacitive value of piezoelectric materials, which shows up in measured admittance. Due to the temperature dependent nature of piezoelectric materials, we investigated the effects of temperature variations on sensor diagnostic process. The effect of temperature variations found to be remarkable, modifying the measured capacitive values significantly. In addition we analyzed the effect of bonding agents between a PZT patch and a host structure. This paper summarizes considerations needed to develop such sensor diagnostic processes, experimental procedures and results, and additional issues that can be used as guidelines for future investigations.

• Journal of the Korean Society for Heat Treatment
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• v.31 no.2
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• pp.49-55
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• 2018

A T-shape structure was manufactured by the superplastic forming and diffusion bonding process using two Ti-3Al-2.5V alloy tubes. A Ti-3Al-2.5V tube was prepared for the hydroforming in the superplastic condition until it reaches a surface area such as a roof welded in the hole of another Ti-3Al-2.5V tube. Afterward, the superplastic forming process and the diffusion bonding process were carried out simultaneously until the appropriate bonding along the interface area of two Ti-3Al-2.5V tubes was obtained. The bonding qualities were different at each location of the entire interface according to the applied process conditions such as strain, pressure, temperature, holding time, geometries, etc. The microstructures of bonding interface have been observed to understand the characteristics of the applied processes in this study.

• Korean Journal of Metals and Materials
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• v.50 no.4
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• pp.316-323
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• 2012

The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having $({\epsilon}+{\zeta})+({\zeta}+{\beta}-Ti)$ intermetallic compounds at $700^{\circ}C$ and an $({\zeta}+{\beta}-Ti)$ intermetallic compound at $800^{\circ}C$, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of $500{\sim}600^{\circ}C$ and showed a uniform value until $800^{\circ}C$ and then increased rapidly up to $900^{\circ}C$. The micro Knoop hardness value of the diffusion layer increased up to $700^{\circ}C$ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to $800^{\circ}C$ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were $500{\sim}600^{\circ}C$ to obtain the proper formability for an additional plastic deformation process.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.76-83
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• 2013

This study investigated the effect of bonding temperature and holding time on microstructures and mechanical properties of diffusion bonded joint of Haynes230. The diffusion bonds were performed at the temperature of 950, 1050, and $1150^{\circ}C$ for holding times of 30, 60, 120 and 240 minutes at a pressure of 4MPa under high vacuum condition. The amount of non-bonded area and void observed in the bonded interface decreased with increasing bonding temperature and holding time. Cr-rich precipitates at the linear interface region restrained grain migration at $950^{\circ}C$ and $1050^{\circ}C$. However, the grain migration was observed in spite of short holding time due to the dissolution of precipitates to base metal in the interface region at $1150^{\circ}C$. Three types of the fracture surface were observed after tensile test. The region where the coalesce and migration of grain occurred much showed high fracture load because of base metal fracture whereas the region where those did less due to the precipitates demonstrated low fracture load because of interface fracture. The expected fracture load could be derived with the value of fracture area of base metal ($A_{BF}$) and interface ($A_{IF}$), $Load=201A_{BF}+153A_{IF}$. Based on this equation, strength of base metal and interface fracture were calculated as 201MPa and 153MPa, respectively.