• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.1
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• pp.27-32
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• 1988

Electron Spectroscopy for Chemical Analysis(ESCA) allowes the determination of the elemental composition and the bonding state of the surface atomes in the interface between two materials. In the binding energies of ESCA spectrum, there are zero error, voltage scaling error and random error. Accurate analysis of the intensity energy response functions and accurate calibration of the energy scale are essential to use X-ray photoelectron spectron meter. At the results of the calibration of the ESCA spectra in the copper and cordierite (Mg2Al4Si5kO18) interfaces, the errors relative to the copper are -3.03 eV for the zero error -z,-197 ppm for the voltage scaling error -V and 6.9 meV for the random error -R. The method of the calibration is able to apply for the binding energy calibration of the another ESCA spectra.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.4
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• pp.78-83
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• 1998

A small size cartrideg for FET type electrolyte sensor is designed and faricated with much simplified process by using micromachining tenchiques such as silicon etching andglass bonding. Size of the whole cartideg is 2.4cm*2.5cm, and the dead volume of a micro flow-channel in the cartrideg is only 8.5.mu.l. The photosensitive polymer(THB 30) is used to define a micropool and to encapsulate the sensor surface for standardizationof electrolyte sensors. To miniaturize micro flow-channel conventional reference electrode(Ag/AgCl) a differential amplification is introduced using REFET and quasi reference electrode. Refet was fabricated using photosensitive polymer(OMR 83). The fabricated cartridge with built-in pH-ISFET showed good operational characteristics such as linearity and high sensitivity (55.4mV/pH) in a wide pH range(pH2-pH12).

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.99-102
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• 2005

Plasma surface coating is applied to the wood powder to improve its bonding and dispersion with the polypropylene(PP). Some mechanical test results and visual inspection indicates the good compatibility between the wood powder and the PP, and relatively good interfacial adhesion between wood powder and PP matrix was seen. Also, this method is considered as a non-toxic process as compared to other direct chemical method.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1832-1835
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• 2003

This paper suggests the selective ultra precision polishing techniques for micro die and mold parts using magnetic-assisted machining. Fabrication of magnetic abrasive particle and their polishing performance are key technology at ultra precision polishing process of micro parts. Conventional magnetic abrasives have disadvantages. which are missing of abrasive particle and inequality between magnetic particle and abrasive particle. So, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Ferrite and carbonyl iron powder are used as magnetic particle where silicon carbide and Al$_2$O$_3$ are abrasive particle. Developed particles are analyzed using measurement device such as SEM. Possibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 2.927 $\mu\textrm{m}$ Rmax to 0.453 $\mu\textrm{m}$ Rmax.

• Computers and Concrete
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• v.1 no.4
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• pp.401-416
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• 2004

This paper presents investigation of a three-dimensional (3-D) nonlinear finite element model analysis to examine the behavior of reinforced concrete beams strengthened with Carbon Fiber Reinforced Polymer (CFRP) composites to enhance the flexural capacity and ductility of the beams. Three-dimensional nonlinear finite element models were developed between the internal reinforcement and concrete using a smeared relationship. In addition, bond models between the concrete surface and CFRP composite were developed using a smeared bond for general analyses and a contact bond for sensitivity analyses. The results of the FEA were compared with the experimental data on full-scale members. The results of two finite-element bonding models showed good agreement with those of the experimental tests.

• Journal of the Korea Safety Management & Science
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• v.16 no.3
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• pp.231-237
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• 2014

Construction of the external wall framing using construction Gang-Form withstand the load of a full lift safety is very important in lifting rings can be a lot of Gang-Form is now fixed in the manner that you are welding and applied, but this study is based on the safety of the lifting ring to seek improvements were bolt type fixing method applied to the bonding type were part of the lifting ring in a manner fixed to the concrete surface and was applied in consideration of safety.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.16-17
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• 2006

We researched by the characteristic of a anisotropic etching of Si wafer and the Si career concerning the flip chip solder bump. Connectors and Anisotropic Conductive Film (ACF) method was already applied to board-to-board interconnection. In place of them, we have focused on board to board interconnection with solder bump by Si carrier, which has been used as Flip chip bonding technology. A major advantage of this technology is that the Flexible Printed Circuit (FPC) is connected in the same solder reflow process with other surface mount devices. This technology can be applied to semiconductors and electronic devices for higher functionality, integration and reliability.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 1999.04b
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• pp.276-281
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• 1999

The surfaces of sheets added with N-chloro-polyacrylamide (N-Cl-PAM) are analyzed using X-ray photoelectron spectroscopy (XPS) to clarify the chemical bonding involved in the paper strength development induced by N-Cl-PAM. The comparison of the observed N1s chemical shift of the sheet with those of the paper strength additives and the model compound, 1-butyryl-3-propyl urea, illustrated the presence of covalent bonds of alkyl acyl urea and urethane on the fiber surfaces. Thus the formation of the covalent bonds by N-Cl-PAM themselves and by N-Cl-PAM with cellulose and hemicellulose may be an explanation for much higher effectiveness of N-Cl-PAM on the improvement of wet strength of paper than A-PAM.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.37 no.4 s.112
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• pp.26-31
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• 2005

The purpose of this study was to confirm paper strengthening properties with recently commercialized polyvinylamine. Because of its high cationic charge density, polyvinylamine has been investigated as a size retention and surface coating aids. In this study, we tried to confirm polyvinylamine as wet-end additives to improve dry and wet strength using LBKP and BCTMP pulps. As a result, we found improvement of dry and wet tensile properties of polyvinylamine with BCTMP were much better than LBKP condition. This phenomena could be explained that ionic bonding of cationic charge of polyvinylamine with abundant anionic substances of BCTMP was a very important factor to improve dry and wet strength of paper.