• Carbon letters
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• v.10 no.4
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• pp.314-319
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• 2009

The surface treatment effects of reinforcement filler were investigated based on the dynamic mechanical properties of mutiwalled carbon nanotubes (MWCNTs)/epoxy composites. The as-received MWCNTs(R-MWCNTs) were chemically modified by direct oxyfluorination method to improve the dispersibility and adhesiveness with epoxy resins in composite system. In order to investigate the induced functional groups on MWCNTs during oxyfluorination, X-ray photoelectron spectroscopy was used. The thermo-mechanical property of MWCNTs/epoxy composite was also measured based on effects of oxyfluorination treatment of MWCNTs. The storage modulus of MWCNTs/epoxy composite was enhanced about 1.27 times through oxyfluorination of MWCNTs fillers at $25^{\circ}C$. The storage modulus of oxyfluorinated MWCNTs (OF73-MWCNTs) reinforced epoxy composite was much higher than that of R-MWCNTs/epoxy composite. It revealed that oxygen content led to the efficient carbon-fluorine covalent bonding during oxyfluorination. These functional groups on surface modified MWCNTs induced by oxyfluorination strikingly made an important role for the reinforced epoxy composite.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.34-41
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• 2004

A new method to fabricate the fine magnetic abrasives by using mechanical alloying is proposed. The mechanical alloying process is a solid powder process where the powder particles are subjected to high energetic impact by the balls in a vial. As the powder particles in the vial are continuously impacted by the balls, cold welding between particles and fracturing of the particles take place repeatedly during the ball milling process using a planetary mill. After the manufacturing process, fine magnetic abrasives which the guest abrasive particles c lung to the base metal matrix without bonding material can be obtained. The shape of the newly fabricated fine magnetic abrasives was investigated using SEM and its polishing performance was verified by experiment. It is very helpful to finishing the injection mold steel in final polishing stage. The areal ms surface roughness of the workpiece after several polishing processes has decreased to a few nanometer scales.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.9
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• pp.81-86
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• 2000

This paper was carried out to investigate the characteristics of interlaminar fracture toughness of foam core sandwich structures under opening loading mode by using the double cantilever beam (DCB) specimens in Carbon/Epoxy and foam core composites. instead of using symmetric geometry of DCB specimen non-symmetric DCB specimen was used to calculate the interlaminar fracture toughness. Three approaches for calculating the energy release rate({{{{ {G }_{IC } }}}}) were compared. Fracture toughness of foam core sandwich structures by autoclave vacuum bagging and hotpress were compared and analyzed. Experiment nonlinear beam bending FEM method were performed. Suggested bonding surface compensation and equivalent area inertia moment was used to calculate the energy release rate in nonlinear analytical results. The conclusions among experimental nonlinear analytical and FEM results was observed. The vacuum bagging method was shown to be able to substitute method in stead of autoclave without serious loss of Mode I energy release rate({{{{ {G }_{IC }}}}}) to be able to substitute method in stead of autoclave without serious loss of Mode I energy release rate({{{{ {G }_{IC }}}}}).

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.

• Journal of Technologic Dentistry
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• v.28 no.1
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• pp.19-26
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• 2006

The effect of Nb on interfacial bonding characteristics of Ni-Cr alloy for porcelain fused to metal crown (PFM) has been studied in order to investigate oxide layer. A specimens of Ni-Cr alloy, which is 0.8mm in thickness, within the porcelain furnace of 1,000$^{\circ}C$ with four tests such as air, vacuum, air for 5 minutes and vacuum for 5 minutes in order to examine an oxide behavior of alloy surface generated by the adding of Nb to be controlled at a rate of 0, 1, 3 and 5. Oxide film was observed form of the fired specimens with scanning electron microscope (SEM), and at the same time it measured Electron Probe Micro Analyzer (EPMA). The result of this study were as follows: 1. Cr oxide film and Nb oxide film were observed from the surface of specimen to be controlled at a rate of Nb 1%. 2. Nb oxide film was observed from the interface of specimens to be controlled at a rate of Nb 1% and 3%. 3. The stability of oxide films that treated in air were more stable than treated under vacuum.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.1
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• pp.31-43
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• 1993

Thermal behavior and $O_{2}$ plasma effects on residue and penetrated impurities formed by reactive ion etching (RIE) in CHF$_{3}$/C$_{2}$F$_{6}$ have been investigated using X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS) techniques. Decomposition of polymer residue film begins between 200-300.deg. C, and above 400.deg. C carbon compound as graphite mainly forms by in-situ resistive heating. It reveals that thermal decomposition of residue can be completed by rapid thermal anneal above 800.deg. C under nitrogen atmosphere and out-diffusion of penetrated impurities is observed. The residue layer has been removed with $O_{2}$ plasma exposure of etched silicon and its chemical bonding states have been changed into F-O, C-O etc.. And $O_{2}$ plasma exposure results in the decrease of penetrated impurities.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.907-911
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• 2001

In order to improve the grindability of magnetic abrasive, Fe-WC magnetic abrasives were made by a plasma melting method after ball milling at various times. This study aims to investigate homogeneously distributed hard phases in Fe matrix and strong bonding between the Fe-matrix and the hard phase. According to XRD, SEM and OM observation, Fe-WC magnetic abrasive powders exhibit the best grindability by plasma melting for 30h ball milling. As a result of magnetic abrasive polishing, the surface roughness, R_{max}$ 5.0$\mu\textrm{m}$, before magnetic abrasive polishing, was reduced to R_{max}$ 2.4$\mu\textrm{m}$. The new magnetic abrasive polishing process is thought to be the useful methods for the automation of three dimensional surface polishing.

• Journal of Surface Science and Engineering
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• v.28 no.6
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• pp.368-375
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• 1995

Thermal CVD method is in general used for the fabrication of TiC/$Al_2O_3$-coated carbide tools. The growth of TiC layer and the coating morphology depended on the chemical composition of the hard metal substrate on which the tool properties were strongly influenced. TiC-coated layer was grown by the diffusion of carbon from the substrate, whereas the growth of $Al_2O_3$ layer was unrelated to the composition of substrate. In the nitride hard coatings of Zr, Nb and Mo metals deposited on high speed steel substrate by magnetron sputtering, the reactivity of the metal elements was decreased with increasing group number in one period of the periodic system. The hard material films exhibited the highest adhesion with the chemical composition of stoichiometry or substoichiometry. The critical load as a measure of adhesion was evaluated using scratch tester. The CVD tools indicated the values of 80 and 40N in the coated layers with proper bonding to the substrate and with $\eta$ phase of 1$\mu\textrm{m}$ in the interface respectively, but the nitride films prepared by sputtering of PVD showed only the values between 10 and 20N.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.305-310
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• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.599-602
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• 2002

A novel rapid prototyping (RP) process, an automated transfer type variable lamination manufacturing process (Automated VLM-ST) has been developed. In Automated VLM-ST, a vacuum chuck and linear moving system transfer the plate type material with two pilot holes to the rotation stage. A four-axis synchronized hotwire cutter cuts the material twice to generate Automated Unit Shape Layer (AUSL) with the desired width, side slopes, length, and two reference shapes in accordance with CAD data. Each AUSL is stacked on the stacking plate with two pilot pins using the pilot holes in AUSL and the pilot pins. Subsequently, adhesive is supplied to the top surface of the stacked AUSL by a bonding roller and pressure is simultaneously applied to the bottom surface of the stacked AUSL. Finally, three-dimensional shapes are rapidly fabricated. This paper describes the procedure for generating the cutting path data (AUSL data) f3r automated VLM-ST. The method for the generation of the Automated Unit Shape Layer (AUSL) in Automated VLM-ST was practically applied and fabricated for a various shapes.