• Journal of Welding and Joining
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• v.23 no.3
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of Sensor Science and Technology
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• v.3 no.3
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• pp.45-53
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• 1994

A new type of Si diaphragm was fabricated using Si-wafer direct bonding and two-step electrochemical etch-stopping methods. Using the new diaphragm structure in mechanical sensors, more precise control of cavity depth and diaphragm thickness was achievable. Also, the propagation of the stress, which was generated near the bonding interface, to the surface can be avoided. Finally, a piezoresistive-type Si pressure sensor was fabricated utilizing the diaphragm and a digital pressure gauge, which can display units of pressure, was realized.

• Journal of the korean academy of Pediatric Dentistry
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• v.32 no.2
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• pp.191-199
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• 2005

This study was experienced in order to obtain the shear bond strength of orthodontic bracket adhesives under the blood contamination that can be occurred during the procedure of bracket bonding under window opening surgery. As a result of this study, shear bond strength of all glass ionomer groups were lower than resin cement groups. However, the strength of uncontaminated and post-contaminated group of glass ionomer was strong enough to perform an orthodontic forced eruption. This study revealed that during a window opening surgery, glass ionomer without etching procedure is available in order to bond a bracket if surface of teeth is not pre-contaminated by blood before the adhesive application. Both simple procedure and less adhesives remnant after bonding failure could make light-cured glass ionomer cement the ultimate choice for racket bonding.

• The Journal of Advanced Prosthodontics
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• v.1 no.1
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• pp.41-46
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• 2009

STATEMENT OF PROBLEM. The poor chemical bonding of a denture base resin to cast titanium framework often introduces adhesive failure and increases microleakage. PURPOSE. This study evaluated the shear bond strengths of a heat cure denture base resin to commercially pure titanium, Ti-6Al-4V alloy and a cobalt-chromium alloy using two adhesive primers. MATERIAL AND MATHODS. Disks of commercially pure titanium, Ti-6Al-4V alloy and a cobalt-chromium alloy were cast. Specimens without the primer were also prepared and used as the controls. The shear bond strengths were measured on a screw-driven universal testing machine. RESULTS. The primers significantly(P < .05) improved the shear bond strengths of the heat cure resin to all metals. However, the specimens primed with the Alloy $primer^{(R)}$(MDP monomer) showed higher bond strength than those primed with the MR $bond^{(R)}$(MAC-10 monomer) on titanium. Only adhesive failure was observed at the metal-resin interface in the non-primed specimens, while the primed specimens showed mixed failure of adhesive and cohesive failure. CONCLUSIONS. The use of appropriate adhesive metal primers makes it possible not only to eliminate the need for surface preparation of the metal framework before applying the heat cure resins, but also reduce the need for retentive devices on the metal substructure. In particular, the Alloy $primer^{(R)}$, which contains the phosphoric acid monomer, MDP, might be clinically more acceptable for bonding a heat cure resin to titanium than a MR $bond^{(R)}$, which contains the carboxylic acid monomer, MAC-10.

• Restorative Dentistry and Endodontics
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• v.42 no.2
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• pp.95-104
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• 2017

Objectives: This study evaluated the influence of a multi-mode universal adhesive (MUA) containing silane (Single Bond Universal, 3M EPSE) on the bonding of resin cement to lithium disilicate. Materials and Methods: Thirty IPS e.max CAD specimens (Ivoclar Vivadent) were fabricated. The surfaces were treated as follows: Group A, adhesive that did not contain silane (ANS, Porcelain Bonding Resin, Bisco); Group B, silane (S) and ANS; Group C, hydrofluoric acid (HF), S, and ANS; Group D, MUA; Group E, HF and MUA. Dual-cure resin cement (NX3, Kerr) was applied and composite resin cylinders of 0.8 mm in diameter were placed on it before light polymerization. Bonded specimens were stored in water for 24 hours or underwent a 10,000 thermocycling process prior to microshear bond strength testing. The data were analyzed using multivariate analysis of variance (p < 0.05). Results: Bond strength varied significantly among the groups (p < 0.05), except for Groups A and D. Group C showed the highest initial bond strength ($27.1{\pm}6.9MPa$), followed by Group E, Group B, Group D, and Group A. Thermocycling significantly reduced bond strength in Groups B, C, and E (p < 0.05). Bond strength in Group C was the highest regardless of the storage conditions (p < 0.05). Conclusions: Surface treatment of lithium disilicate using HF and silane increased the bond strength of resin cement. However, after thermocycling, the silane in MUA did not help achieve durable bond strength between lithium disilicate and resin cement, even when HF was applied.

• Land and Housing Review
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• v.2 no.4
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• pp.407-413
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• 2011

This paper reports a novel structural health monitoring (SHM) technique for detecting de-bonding between a concrete beam and CFRP (Carbon Fiber Reinforced Polymer) sheet that is attached to the concrete surface. To achieve this, a multi-scale actuated sensing system with a self-sensing circuit using piezoelectric active sensors is applied to the CFRP laminated concrete beam structure. In this self-sensing based multi-scale actuated sensing, one scale provides a wide frequency-band structural response from the self-sensed impedance measurements and the other scale provides a specific frequency-induced structural wavelet response from the self-sensed guided wave measurement. To quantify the de-bonding levels, the supervised learning-based statistical pattern recognition was implemented by composing a two-dimensional (2D) plane using the damage indices extracted from the impedance and guided wave features.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.655-659
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• 2011

An ultrafine grained complex aluminum alloy was fabricated by an accumulative roll-bonding (ARB) process using dissimilar aluminum alloys of AA1050 and AA5052 and subsequently annealed. A two-layer stack ARB process was performed up to six cycles without lubricant at an ambient temperature. In the ARB process, the dissimilar aluminum alloys, AA1050 and AA5052, with the same dimensions were stacked on each other after surface treatment, rolled to the thickness reduction of 50%, and then cut in half length by a shearing machine. The same procedure was repeated up to six cycles. A sound complex aluminum alloy sheet was fabricated by the ARB process, and then subsequently annealed for 0.5h at various temperatures ranging from 100 to $350^{\circ}C$. The tensile strength decreased largely with an increasing annealing temperature, especially at temperatures of 150 to $250^{\circ}C$. However, above $250^{\circ}C$ it hardly decreased even when the annealing temperature was increased. On the other hand, the total elongation increased greatly above $250^{\circ}C$. The hardness exhibited inhomogeneous distribution in the thickness direction of the specimens annealed at relatively low temperatures, however it had a homogeneous distribution in specimens annealed at high temperatures.

• The korean journal of orthodontics
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• v.49 no.6
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• pp.404-412
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• 2019

Objective: To assess shear bond strength and failure mode (Adhesive Remnant Index, ARI) of orthodontic brackets bonded to polymethylmethacrylate (PMMA) blocks for computer-aided design/manufacture (CAD/CAM) fabrication of temporary restorations, following substrate chemical or mechanical treatment. Methods: Two types of PMMA blocks were tested: $CAD-Temp^{(R)}$ (VITA) and $Telio^{(R)}$ CAD (Ivoclar-Vivadent). The substrate was roughened with 320-grit sandpaper, simulating a fine-grit diamond bur. Two universal adhesives, Scotchbond Universal Adhesive (SU) and Assure Plus (AP), and a conventional adhesive, Transbond XT Primer (XTP; control), were used in combination with Transbond XT Paste to bond the brackets. Six experimental groups were formed: (1) $CAD-Temp^{(R)}/SU$; (2) $CAD-Temp^{(R)}/AP$; (3) $CAD-Temp^{(R)}/XTP$; (4) $Telio^{(R)}$ CAD/SU; (5) $Telio^{(R)}$ CAD/AP; (6) $Telio^{(R)}$ CAD/XTP. Shear bond strength and ARI were assessed. On 1 extra block for each PMMA-based material surfaces were roughened with 180-grit sandpaper, simulating a normal/medium-grit ($100{\mu}m$) diamond bur, and brackets were bonded. Shear bond strengths and ARI scores were compared with those of groups 3, 6. Results: On $CAD-Temp^{(R)}$ significantly higher bracket bond strengths than on $Telio^{(R)}$ CAD were recorded. With XTP significantly lower levels of adhesion were reached than using SU or AP. Roughening with a coarser bur resulted in a significant increase in adhesion. Conclusions: Bracket bonding to CAD/CAM PMMA can be promoted by grinding the substrate with a normal/medium-grit bur or by coating the intact surface with universal adhesives. With appropriate pretreatments, bracket adhesion to CAD/CAM PMMA temporary restorations can be enhanced to clinically satisfactory levels.

• Korean Journal of Materials Research
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• v.29 no.6
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• pp.392-397
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• 2019

A cold roll-bonding process is applied to fabricate an AA6061/AA5052/AA6061 three-layer clad sheet. Two AA6061 and one AA5052 sheets of 2 mm thickness, 40 mm width, and 300 mm length are stacked, with the AA5052 sheet located in the center. After surface treatment such as degreasing and wire brushing, sample is reduced to a thickness of 1.5 mm by multi-pass cold rolling. The rolling is performed at ambient temperature without lubricant using a 2-high mill with a roll diameter of 400 mm at rolling speed of 6.0 m/sec. The roll bonded AA6061/AA5052/AA6061 complex sheet is then hardened by natural aging(T4) and artificial aging(T6) treatments. The microstructures of the as-roll bonded and age-hardened Al complex sheets are revealed by optical microscopy; the mechanical properties are investigated by tensile testing and hardness testing. After rolling, the roll-bonded AA6061/AA5052/AA6061 sheets show a typical deformation structure in which grains are elongated in the rolling direction. However, after T4 and T6 aging treatment, there is a recrystallization structure consisting of coarse equiaxed grains in both AA5052 and AA6061 sheets. The as roll-bonded specimen shows a sandwich structure in which an AA5052 sheet is inserted into two AA6061 sheets with higher hardness. However, after T4 and T6 aging treatment, there is a different sandwich structure in which the hardness of the upper and lower layers of the AA6061 sheets is higher than that of the center of the AA5052 sheet. The strength values of the T4 and T6 age-treated specimens are found to increase by 1.3 and 1.4 times, respectively, compared to that value of the starting material.