• Title/Summary/Keyword: bonding surface

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Improvement of Surface Properties of CP-Titanium by Thermo-Chemical Treatment (TCT) Process (열확산처리 공정에 의한 순수 타이타늄의 표면특성 향상 연구)

  • Jeong, Hyeon-Gyeong;Lee, Dong-Geun;Yaskiv, O.;Lee, Yong-Tai;Hur, Bo-Young
    • Korean Journal of Metals and Materials
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    • v.49 no.9
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    • pp.692-698
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    • 2011
  • The thermo-chemical treatment (TCT) process was applied to achieve surface hardening of CP titanium. The following three different surface modification conditions were tested so that the best surface hardening process could be selected:(a) PVD, (b) TCT+PVD, and (c) TCT+Aging+PVD. These specimens were tested and analyzed in terms of surface roughness, wear, friction coefficient, and the gradient of hardening from the surface of the matrix. The three test conditions were all beneficial to improve the surface hardness of CP titanium. Moreover, the TCT treated specimens, that is, (b) and (c), showed significantly improved surface hardness and low friction coefficients through the thickness up to $100{\mu}m$. This is due to the functionally gradient hardened surface improvement by the diffused interstitial elements. The hardened surface also showed improvement in bonding between the PVD and TCT surface, and this leads to improvement in wear resistance. However, TCT after aging treatment did not show much improvement in surface properties compared to TCT only. For the best surface hardening on CP titanium, TCT+PVD has advantages in surface durability and economics.

Electronic Structure, Bonding and Kithium Migration Effects of the Mixed Conductor $\beta-LiAl$ (혼합 전도체 $\beta-LiAl$의 전자구조, 결합과 Li 이온 이동에 따른 영향)

  • Jang, Gun-Eik;I.M Curelaru
    • Journal of the Korean Vacuum Society
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    • v.5 no.3
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    • pp.194-198
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    • 1996
  • Detailed expermental studies of theelectronic structure of the valence and conduction bands of the mixed conductor $\beta$-LiAlindicate that a quasi-gap opens at the Fermi level, and the conduction states are highlylocalized, as opposed to the theoretical band structure calculations that predict predominant metallic behavior. Evidence for complex lithium migration effects involving the surface of Lial , induced by particle (electron or ion) bombardment and mechanical treatment , has been obtained as a byproduct of these experiments.

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The Effect of Surface Area Implant on Bonding Strength between Implant and Bone (임프란트의 외표면적이 임프란트와 골과의 결합력에 미치는 영향)

  • Jo, Seong-Am
    • Korean Journal of Materials Research
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    • v.8 no.7
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    • pp.613-615
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    • 1998
  • 임프란트의 외표면적이 골과의 결합의 정도에 미치는 영향을 알아보기 위하여 10개의 grade ll 티타늄 임프란트를 사용하여 이를 직경 3미리와 5미리의 2개의 군으로 나누어 10마리의 토끼의 무릅뼈에 삽입하였다. 6주후에 동물들을 희생시키고 회전제거력을 Tohnichi 15-BTG-N Torque garge Manometer로 측정하여 5nmwlrrud 그룹의 회전제거력이 3mm직경 그룹의 회전제거력보다 큰 것을 확인하였다. (p=0.008)

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Bonding Behavior of Carbon Black/Nylon 66 Hybrid Nanofiber Webs via Microwave Heating (카본블랙/나일론 66 혼합 나노섬유웹의 마이크로파에 의한 접착거동)

  • Shin, Dong-Ho;Joo, Chang-Whan
    • Proceedings of the Korean Fiber Society Conference
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    • 2003.10b
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    • pp.114-117
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    • 2003
  • Conventional heating the heat source cause the molecules to react from the surface toward the center so that successive layers of molecules heat in turn. The product surfaces may be in danger of over heating by the time heat penetrates the material. Microwave, however, produce a volume heating effect. All molecules are set in action at the same time. It also evens temperature gradients and offers other important benefits such as selective heating. (omitted)

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Low Temperature Cure Film Adhesive

  • Liang, Bin;Zhao, Shenglong
    • Journal of Adhesion and Interface
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    • v.5 no.2
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    • pp.1-7
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    • 2004
  • A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

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Particular aspects of drivers for VCSELs operating at multi-Gb/s

  • Kyriakis-Bitzaros, Efstathios D.;Katsafouros, Stavros G.;Halkias, George
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.1
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    • pp.82-86
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    • 2002
  • It is demonstrated that the conventional current-pulse laser drivers are not adequate in driving VCSELs operating at multi-Gb/s speeds. Simulation results, including the bonding parasitics, show that high-performance VCSELs are more efficiently driven using voltage-pulse mode of operation. The optical output power is almost doubled in the voltage-mode of operation, while the total electrical power consumption of the transmitter decreases by 20%.

Study on the microwave heating on kevlar fiber-bonding using Polyvinylidene floride(PVDF) (Polyvinylidene floride(PVDF)를 이용한 케블라 섬유접착에 마이크로웨이브에 관한 연구)

  • Young-Soo Lee;Jin-Ah Lee;Chang-Whan Joo
    • Proceedings of the Korean Fiber Society Conference
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    • 2001.10a
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    • pp.403-404
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    • 2001
  • In conventional heating, the heat source causes the molecules to react from the surface toward the center so that successive layers of molecules heat in turn. In the microwave heating, which is produced a volume heating effect, all molecules are set in action at the same time. And, It also evens temperature gradients without the concern of material thickness. (omitted)

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Fabrication of Electro-optical Microlens Using Micromachining Technology (마이크로머시닝 기술을 이용한 전자 광학 렌즈의 제작)

  • Lee, Yong-Jae;Chun, Kuk-Jin
    • Proceedings of the KIEE Conference
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    • 1996.11a
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    • pp.413-415
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    • 1996
  • This paper presents a technique for fabricating an electro-optical microlens for microcolumn e-beam system. The device, named Self-Aligned Microlens (SAM) was realized by mixing surface and bulk micromachining technology. The microbridges were formed on both sides of silicon wafer symmetrically. The alignment error between the electrodes could be controlled within a few micrometers with also reducing the numbers of anodic bonding.

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A Study on the Disbonding Detection of Al/Al Honeycomb Sandwich Structures by Ultrasonic Methods (초음파를 이용한 Al/Al 하니캄 구조물의 Disbonding 검출에 관한 연구)

  • Cho, K.S.;Lee, J.S.;Chang, H.K.;Lee, S.H.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.10 no.1
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    • pp.29-37
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    • 1990
  • In this study the disbonding tests of adhesively bonded Al/Al honeycomb structures were performed by ultrasonic methods. Ultrasonic C-scan squiter method and ultrasonic surface wave attenuation measuring method were applied for the detection of skin/core disbonding. The bonding quality of Al/Al honeycomb structures could be well evaluated by properly controlled ultrasonic parameters.

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