• Title/Summary/Keyword: bonding surface

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Behavior of Tin and Palladium for Electroless Plating on bariumtitanate ceramics.(Part 1:Study with Electron Spertroscopy for Chemical Analysis) (티탄산바륨세라믹의 무전해도금을 위한 Sn 및 Pb 촉매의 거동 (제1부: Electron Spertroscopy for Chemical Analysis에 의한 연구))

  • 박광자
    • Journal of Surface Science and Engineering
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    • v.23 no.3
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    • pp.144-149
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    • 1990
  • X-ray phtoelectron spectroscopy has been used to obtain information on the behavior of the Pb catalysis and Sn sensitizer on the bariumtitanate ceramic substrate. SnF2 sensitization and PbCl2 activation process are used are used to prepare nonconductive substrate for electroless plating. This method of surface preparation is compared to Pd-Sn mixed solu tions and Ag pretreatment process. In all the case, the bonding energy is about 487.5eV for Sn and 336.5~337.5eV for Pb.

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Effect of anodic potentials for fabricating co-doped TiO2 on the photocatalytic activity

  • Lee, Seunghyun;Han, Jae Ho;Oh, Han-Jun;Chi, Choong-Soo
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.05a
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    • pp.295-295
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    • 2012
  • The $TiO_2$ films were prepared in the $H_2SO_4$ solution containing $NH_4F$ at different anodic voltages, to compare the photocatalytic performances of titania for purification of waste water. The microstructure was characterized by a Field-emission scanning electron microscopy (FE-SEM) and X-ray diffractometry (XRD). Chemical bonding states and co-doped elements of F and N were analyzed using surface X-ray photoelectron spectroscopy (XPS). The photocatalytic activity of the co-doped $TiO_2$ films was analyzed by the degradation of aniline blue solution. From the result of diffuse reflectance absorption spectroscopy(DRS), it is indicated that the absorption edge of the F-N-codoped $TiO_2$ films shifted toward visible light area, and the photocatalytic reaction of $TiO_2$ was improved by doping an appropriate contents of F and N.

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Nano-cleaning of EUV Mask Using Amphoterically Electrolyzed Ion Water (화학양면성의 전해이온수를 이용한 극자외선 마스크의 나노세정)

  • Ryoo, Kun-kul;Jung, Youn-won;Choi, In-sik;Kim, Hyung-won;Choi, Byung-sun
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.2
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    • pp.34-42
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    • 2021
  • Recent cleaning technologies of mask in extremely ultraviolet semiconductor processes were reviewed, focused on newly developed issues such as particle size determination or hydrocarbon and tin contaminations. In detail, critical particle size was defined and proposed for mask cleaning where nanosized particles and its various shapes would result in surface atomic ratio increase vigorously. A new cleaning model also was proposed with amphoteric behavior of electrolytically ionized water which had already shown excellent particle removing efficiency. Having its non-equilibrium and amphoteric properties, electrolyzed ion water seemed to oxidize contaminant surface selectively in nano-scale and then to lift up oxidized ones from mask surface very effectively. This assumption should be further investigated in future in junction with hydrogen bonding and cluster of water molecules.

Preparation and characterization of fullerene dimer [C120] by trichloroperbenzoic acid oxidation method

  • Oh, Won-Chun;Jung, Ah-Reum;Ko, Weon-Bae
    • Analytical Science and Technology
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    • v.20 no.2
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    • pp.124-130
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    • 2007
  • In this study, we present the preparation and characterization of oxidized fullerene and fullerene dimer [$C_{120}$]. From the XRD data, other weak peaks with pristine fullerene [$C_{60}$] peaks were observed in the X-ray diffraction patterns for fullerene dimer [$C_{120}$]. SEM micrographs for the fullerene dimer [$C_{120}$] indicated that practically all the surface state was shown the drastic morphology changes and its outer surface is clearly visible and resulted in clogging and frost-like formation. From the MALDI-TOF mass spectra, the differences in the spectra recorded on two kinds of fullerene are due to the oxidation including chemical bonding and bridging between the $C_{60}$ molecules. We also obtained additional information from FT-IR spectra on functional component on the chemically modified surface of oxidized fullerene and fullerene dimer [$C_{120}$].

The effect of Surface Roughness on Wire-cut Electric Discharge Machining of Discharge Energy in Aluminium Alloy 2024 (알루미늄 합금 2024의 와이어 컷 방전가공에서 방전 에너지가 표면 거칠기에 미치는 영향)

  • Ryu, Cheong-Won;Choi, Seong-Dae;Lee, Soon-Kwan
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.6
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    • pp.714-719
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    • 2011
  • The surface roughness depending on the machining method is very important because is produce a finished product through riveting, sealing, bonding, and special paint in order to curb the turbulence and air resistance which occur between the sheets. Aluminum alloy 2024 which is widely used for interior and exterior material of aircraft are tested. Jin-young JW-60C wire cutting machine was used in this experiment. In this paper, the experimental investigation has been performed to find out the influence of the surface roughness and surface shape characteristics on the wire-cut EDM of discharge energy in aluminium alloy 2024. The selected experimental parameters are peak current, no-load voltage, off time and feed rate. The experimental results give the guideline for selecting reasonable machining parameters. The high discharge energy on the idle time, almost no change in surface roughness can be seen.

Simultaneous Detection of Biomolecular Interactions and Surface Topography Using Photonic Force Microscopy

  • Heo, Seung-Jin;Kim, Gi-Beom;Jo, Yong-Hun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.402.1-402.1
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    • 2014
  • Photonic force microscopy (PFM) is an optical tweezers-based scanning probe microscopy, which measures the forces in the range of fN to pN. The low stiffness leads proper to measure single molecular interaction. We introduce a novel photonic force microscopy to stably map various chemical properties as well as topographic information, utilizing weak molecular bond between probe and object's surface. First, we installed stable optical tweezers instrument, where an IR laser with 1064 nm wavelength was used as trapping source to reduce damage to biological sample. To manipulate trapped material, electric driven two-axis mirrors were used for x, y directional probe scanning and a piezo stage for z directional probe scanning. For resolution test, probe scans with vertical direction repeatedly at the same lateral position, where the vertical resolution is ~25 nm. To obtain the topography of surface which is etched glass, trapped bead scans 3-dimensionally and measures the contact position in each cycle. To acquire the chemical mapping, we design the DNA oligonucleotide pairs combining as a zipping structure, where one is attached at the surface of bead and other is arranged on surface. We measured the rupture force of molecular bonding to investigate chemical properties on the surface with various loading rate. We expect this system can realize a high-resolution multi-functional imaging technique able to acquire topographic map of objects and to distinguish difference of chemical properties between these objects simultaneously.

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Improvement of carrier transport in silicon MOSFETs by using h-BN decorated dielectric

  • Liu, Xiaochi;Hwang, Euyheon;Yoo, Won Jong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2013.05a
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    • pp.97-97
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    • 2013
  • We present a comprehensive study on the integration of h-BN with silicon MOSFET. Temperature dependent mobility modeling is used to discern the effects of top-gate dielectric on carrier transport and identify limiting factors of the system. The result indicates that coulomb scattering and surface roughness scattering are the dominant scattering mechanisms for silicon MOSFETs at relatively low temperature. Interposing a layer of h-BN between $SiO_2$ and Si effectively weakens coulomb scattering by separating carriers in the silicon inversion layer from the charged centers as 2-dimensional h-BN is relatively inert and is expected to be free of dangling bonds or surface charge traps owing to the strong, in-plane, ionic bonding of the planar hexagonal lattice structure, thus leading to a significant improvement in mobility relative to undecorated system. Furthermore, the atomically planar surface of h-BN also suppresses surface roughness scattering in this Si MOSFET system, resulting in a monotonously increasing mobility curve along with gate voltage, which is different from the traditional one with a extremum in a certain voltage. Alternatively, high-k dielectrics can lead to enhanced transport properties through dielectric screening. Modeling indicates that we can achieve even higher mobility by using h-BN decorated $HfO_2$ as gate dielectric in silicon MOSFETs instead of h-BN decorated $SiO_2$.

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Evaluation of Dicing Characteristics of Diamond Micro-blades with Cu/Sn Binder Including Etched WS2 Particles (표면 부식 처리한 WS2 입자를 첨가한 Cu/Sn계 다이아몬드 마이크로 블레이드의 절삭특성)

  • Kim, Song-Hee;Jang, Jaecheol
    • Journal of Surface Science and Engineering
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    • v.46 no.1
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    • pp.22-28
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    • 2013
  • $WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.

Fabrication of Micro Conductor Pattern on Polymer Material by Laser Induced Surface Activation Technology

  • Lee, Sung-Hyung;Yashiro, Hitoshi;Kure-Chu, Song-Zhu
    • Korean Journal of Materials Research
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    • v.30 no.7
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    • pp.327-332
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    • 2020
  • Laser induced surface activation (LISA) technology requires refined selection of process variables to fabricate conductive microcircuits on a general polymer material. Among the process variables, laser mode is one of the crucial factors to make a reliable conductor pattern. Here we compare the continuous wave (CW) laser mode with the pulse wave (PW) laser mode through determination of the surface roughness and circuit accuracy. In the CW laser mode, the surface roughness is pronounced during the implementation of the conductive circuit, which results in uneven plating. In the PW laser mode, the surface is relatively smooth and uniform, and the formed conductive circuit layer has few defects with excellent adhesion to the polymer material. As a result of a change of laser mode from CW to PW, the value of Ra of the polymer material decreases from 0.6 ㎛ to 0.2 ㎛; the value of Ra after the plating process decreases from 0.8 ㎛ to 0.4 ㎛, and a tight bonding force between the polymer source material and the conductive copper plating layer is achieved. In conclusion, this study shows that the PW laser process yields an excellent conductive circuit on a polymeric material.

Recommended properties of elastic wearing surfaces on orthotrotropic steel decks

  • Fettahoglu, Abdullah
    • Steel and Composite Structures
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    • v.18 no.2
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    • pp.357-374
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    • 2015
  • Orthotropic decks composed of deck plate, ribs, cross beams and wearing surface are frequently used in industry to span long distances due to their light structures and load carrying capacities. As a result they are broadly preferred in industry and there are a lot of bridges of this type exist in the world. Nevertheless, some of them cannot sustain the anticipated service life and damages in form of cracks develop in steel components and wearing surface. Main reason to these damages is seen as the repetitive wheel loads, namely the fatigue loading. Solutions to this problem could be divided into two categories: qualitative and quantitative. Qualitative solutions may be new design methodologies or innovative materials, whereas quantitative solution should be arranging dimensions of deck structure in order to resist wheel loads till the end of service life. Wearing surface on deck plate plays a very important role to avoid or mitigate these damages, since it disperses the load coming on deck structure and increases the bending stiffness of deck plate by forming a composite structure together with it. In this study the effect of Elastic moduli, Poisson ratio and thickness of wearing surface on the stresses emerged in steel deck and wearing surface itself is investigated using a FE-model developed to analyze orthotropic steel bridges.