• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.19 no.12
• /
• pp.1078-1084
• /
• 2006

Impurity contamination induced by $CF_4\;and\;HBr/Cl_2/O_2$ plasma etching on Si surface was examined by using surface spectroscopes. XPS(x-ray photoelectron spectroscopy) surface analysis showed that F of 0.4 at % exists in the surface layer in the form of Si-F bonding but Br and Cl are below the detection limit $(0.1{\sim}1.0%)$ of the spectroscope. Static-SIMS(secondary ion mass spectrometry) surface analysis showed that the etched Si surface was contaminated with etching gas elements such as H, F, Cl and Br, and they existed to the depth of about $20{\sim}40nm$. The etched Si surface was treated with three different methods that were HF dip, thermal oxidation followed by HF dip and oxygen-plasma oxidation followed by HF dip. They showed an effect in reducing the impurity contamination and the oxygen-plasma oxidation followed by HF dipping method appears to be a little bit more effective.

• Journal of Surface Science and Engineering
• /
• v.49 no.6
• /
• pp.587-594
• /
• 2016

Various surface treatments and thin film coating processes on the surface of injection die steel have been developed to extend the life. Most of previous studies were mainly focused on investigating the wear and static bonding behavior of thin films. In this study complex surface treatments of DLC coating combined with ion nitriding were applied to increase fatigue life and wear resistance. Ion nitriding, DLC coating, and DLC coating following nitriding on the surface of Fe-3.0Ni-0.7Cr-1.4Mn-X steel were investigated to uncover the beneficial effect which is applicable to injection die. The effect of various surface treatments and coating conditions on high cycle fatigue resistance was studied. Surface morphology change during fatigue tests were observed with AFM. Fatigue life of the die steel increased by 10 to 1,000 times at the various level of stress amplitudes in the condition of DLC coating following the ion nitriding for 3 hrs comparing with the only DLC coated condition.

• Membrane and Water Treatment
• /
• v.15 no.3
• /
• pp.139-152
• /
• 2024

Mixed matrix membranes have gained significant recognition in the wastewater treatment industry for their effectiveness in removing dyes, proteins, and heavy metals from water sources. Researchers have developed an innovative technique to enhance properties of these membranes by incorporating amine-functionalized carbon nanotubes into the polymer matrix. This approach introduces amine functional groups onto the membrane surface, which are then modified with trimesoyl chloride and cyanuric chloride. The modified membranes are characterized by XPS to confirm successful bonding of amines with the trimesoyl chloride and cyanuric chloride. The surface charge of the modified membrane also plays a role in the modification process; the membrane modified with trimesoyl chloride has a negative surface charge, while the one modified with cyanuric chloride has a more positive charge. At the same acidic pH, the positive or negative charge of the mixed matrix membranes assists in enhancing the rejection of heavy metals. This results in improved antifouling properties for both modified membranes. The heavy metal rejection for all modified membranes is higher than for unmodified membranes, due to both adsorption and complexation abilities of the functional groups on the membrane surface with heavy metal ions. As the membrane surface functionalities increase through modification, the separation due to complexation also increases. The bulk morphology of the membrane remains unchanged, while roughness slightly increases due to the surface treatment.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.7
• /
• pp.929-933
• /
• 2010

Four-point bending tests were performed to investigate the interfacial adhesion of Cu-Cu bonding fabricated by thermo-compression process for three dimensional packaging. A pair of Cu-coated Si wafers was bonded under a pressure of 15 kN at $350^{\circ}C$ for 1 h, followed by post annealing at $350^{\circ}C$ for 1 h. The bonded wafers were diced into $30\;mm\;{\times}\;3\;mm$ pieces for the test. Each specimen had a $400-{\mu}m$-deep notch along the center. An optical inspection module was installed in the testing apparatus to observe crack initiation at the notch and crack propagation over the weak interface. The tests were performed under a fixed loading speed, and the corresponding load was measured. The measured interfacial adhesion energy of the Cu-to-Cu bonding was $9.75\;J/m^2$, and the delaminated interfaces were analyzed after the test. The surface analysis shows that the delamination occurred in the interface between $SiO_2$ and Ti.

• Journal of Advanced Marine Engineering and Technology
• /
• v.38 no.6
• /
• pp.688-697
• /
• 2014

In this study, electrode bonding technology needed for high density of rechargeable battery is studied, which is recently researched for electric vehicle, the small leisure vessel. For the alternative overcoming the limit of stacking amount able to be stacked by conventional ultrasonic welding, the low temperature bonding method, eligible for minimum of degeneration of chemical activator on the electrode surface which is generated by thermal effect as well as the increase of conductivity and tension strength caused by electrode bonding using filler metal, not using conventional direct heating on the electrode material method, is studied. Specifically to say, recently used more generally the ultrasonic welding and spot welding method are not usable for satisfying stable electric conductivity and bonding strength when much electrode is stacking bonded. If the electrical power is unreasonably increased for the welding, due to the effect of welding temperature, deformation of electrode and activating material degeneration are caused, and after the last packaging, decline of electrical output and generating heat cause to reduce stability of battery. Therefore, in this study, induction heating system bonding method using high frequency heating and differentiated electrode method using filler metal pre-treatment of hot dipping are introduced.

• Journal of the Korean Wood Science and Technology
• /
• v.37 no.1
• /
• pp.87-93
• /
• 2009

Properties and chemical bonding of wood charcoal were investigated to understand the chemistry occurring in wood carbonization. From the pH changes of wood charcoal, it is revealed that it becomes acidic to weakly basic for charcoal carbonized at about $300^{\circ}C$, whereas it turns to basic at higher carbonization temperature higher than $600^{\circ}C$. Also, the ratio of carbon atoms in the charcoal was increased with increasing the carbonization temperature, while those of oxygen and hydrogen atoms. This tendency was significant when the carbonization temperature was increased up to $600^{\circ}C$ and the ratio changes of the atoms became stable at above $600^{\circ}C$. In the changes of chemical bonding, the ratio of C-C bonding was increased and those of C-O-H and C-O-R bonding was decreased significantly. It is considered that bondings connected to oxygen atoms tends to be broken, and the ratio of C-C bonding increased. Consequently, it is expected that this change may causes occurrence of new functional groups. In addition to that, it seems to be that the chemical bondings undergo the partial decomposition, formation, and recombination steps, Because ratio of C=O bonding tended to be increased or decreased by increasing the carbonization temperature. This understanding of chemical bond changes in charcoal can be a compensative consideration on the knowledges made only by physical parameters in the properties of micro-pore which has limited to explain the phenomenon. Also, it is considered that this can be treated as a basic knowledge for upgrading and development of use of wood charcoal.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.163-169
• /
• 2019

Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.31-37
• /
• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.

• Restorative Dentistry and Endodontics
• /
• v.29 no.6
• /
• pp.504-514
• /
• 2004

This study compared the dentin shear bond strengths of currently used dentin bonding agents that were irradiated with an LED (Elipar FreeLight, 3M-ESPE) and a halogen light (VIP, BISCO). The optical characteristics of two light curing units were evaluated. Extracted human third molars were prepared to expose the occlusal dentin and the bonding procedures were performed under the irradiation with each light curing unit. The dentin bonding agents used in this study were Scotchbond Multipurpose (3M ESPE), Single Bond (3M ESPE), One-Step (Bisco), Clearfil SE bond (Kuraray), and Adper Prompt (3M ESPE), The shear test was performed by employing the design of a chisel-on-iris supported with a Teflon wall. The fractured dentin surface was observed with SEM to determine the failure mode. The spectral appearance of the LED light curing unit was different from that of the halogen light curing unit in terms of maximum peak and distribution. The LED LCU (maximum peak in 465 nm) shows a narrower spectral distribution than the halogen LCU (maximum peak in 487 nm). With the exception of the Clearfil SE bond (P < 0.05), each 4 dentin bonding agents showed no significant difference between the halogen light-cured group and the LED light-cured group in the mean shear bond strength (P > 0.05). The results can be explained by the strong correlation between the absorption spectrum of camphoroquinone and the narrow emission spectrum of LED.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.113-119
• /
• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.