• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1130-1131
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• 2006

We found that the """interface reaction between Ni-based alloy bond, diamond, and steel core is very critical in bond strength of diamond tool. None element from metal bond diffuses into the steel core but the Fe element of steel core was easily diffused into the bond. This diffusion depth of Fe has a great effect on the bonding strength. The Cr in steel core accelerated the Fe diffusion and improved the bond strength, on the other hand, carbon decreased the strength. Ni-based alloy bond including Cr was chemically bonded with diamond by forming Cr carbide. However, the Cr and Fe in STS304 were largely interdiffused, the strength was very low. The Cr passivity layer formed at surface of STS304 made worse strength at commissure in brazing process.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.25-30
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• 2001

The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

• Elastomers and Composites
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• v.34 no.4
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• pp.299-314
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• 1999

Bonding metal and textile components to rubber has always posed a problem. In this paper, an attempt had been made to modify textile and metal surfaces for bonding with rubber. The metal surfaces were modified using silane coupling agents and textile fibers were modified using plasma polymerization techniques. Some results on adhesion of metals to a range of sulfur-cured rubber compounds using a combination of organofunctional silanes are given here. The treatment was not only effective for high-sulfur compounds but also for low-sulfur com pounds as used in engine mounts and even for some semi-EV compounds. Coatings of plasmapolymerized pyrrole or acetylene were deposited on aramid and polyester tire cords. Standard pull-out force adhesion measurements were used to determine adhesion of tire cords to rubber compounds. The plasma coatings were characterized by various techniques and the performance results are explained in an interpenetrating network model.

• Journal of the Korean Ceramic Society
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• v.43 no.9 s.292
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• pp.515-518
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• 2006

The microstructure of $ZrO_2$ toughened $Al_2O_3$ ceramics was carefully controlled so as to obtain dense and fine-grained ceramics, thereby improving the properties and reliability of the ceramics for capillary applications in semiconductor bonding technology. $Al_2O_3-ZrO_2(Y_2O_3)$ composite was produced via Ceramic Injection Molding (CIM) technology, followed by Sinter-HIP process. Room temperature strength, hardness, Young's modulus, thermal expansion coefficient and toughness were determined, as well as surface strengthening induced by the fine grained homogenous microstructure and the thermal treatment. The changes in alumina/zirconia grain size, sintering condition and HIP treatment were found to be correlated.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.14 no.3
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• pp.309-315
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• 2001

The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

• Proceedings of the Korea Concrete Institute Conference
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• 2004.11a
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• pp.17-20
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• 2004

FRP strengthening system that bonds FRP sheet or laminate underneath structure has been used popularly thesedays. The failure of this bonding system occurs mainly at the interface of bonded surface abruptly. So it is difficult to expect the failure and FRP can't show its full material capacity that makes it uneconomically. By that reason, KICT proposed a system to install FRP aminate to structure for strengthening not by bondging but by unbonding. It is to install both ends of FRP laminate by anchoring underneath structure without bonding. Then, the failure is not an interfacial problem any more, it is governed by mechanical anchoring. This paper includes an experimental study about anchoring system for prestressing CFRP laminate.

• Journal of the Korean Ceramic Society
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• v.27 no.6
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• pp.755-762
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• 1990

The tungsten paste was printed on the surface of 92% alumina sheet which was made by type casting process. The printed tungsten was bonded on the Al2O3 by co-firing in reducing atmosphere. During the co-firing, the binder burn-out was easier in wet H2 atmosphere than in dry H2, which affected sintered density. In practically, the use of wet H2 above 100$0^{\circ}C$ was beneficial for density of alumina and bond strength. This phenomena occured more distinctly when atmosphere varied from dry H2 to wet H2 than varied dew point in wet H2. In wet H2, the improvement in bonding strength can be attributed to good glass migration into the metal layer due to inhibition of the tungsten particle growth, with increase of alumina density, at the temperatrue higher than 100$0^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.426-427
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• 2007

Here we describe the formation of a self-assembled film of thin multiwalled carbon Nanotubes(t-MWNT) modified with hydroxy groups through hydrogen peroxide treatment. Morphologies of t-MWNT films could be controlled by the various coating method, such as filtering, drop casting, spraying method, etc. The results show that on densification of the CNT suspension during drying, multiple hydroxy group-modified MWNTs can be self-assembled through strong surface hydrogen bond interaction while MWNTs usually exist an entangled state in the film. The interaction between t-MWNT was illustrated from Raman spectrum of spray coated films.

• Journal of Welding and Joining
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• v.22 no.3
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• pp.62-68
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• 2004

The strip Au bumps are bonded using longitudinal ultrasonic far the electronic package. Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. Deformed bump shapes are calculated using the finite element method, and the bond strength is measured experimentally. The crossed strip Au bumps are deformed similar to the saddle, which provides larger contact surface area and higher friction force. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained using the crossed strip bumps.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1156-1161
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• 2006

This study is to evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital $LabView^{TM}$ measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module.