• Proceedings of the Korean Society of Near Infrared Spectroscopy Conference
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• 2001.06a
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• pp.1181-1181
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• 2001

Robinson with ${coworkers}^{1}$ have introduced two-state outer-neighbor bonding model to explain the anomalies of water. The studies on the properties of water as a function of temperature and pressure revealed that, unlike other ideas, all $H_2O$ molecules in liquid are tetrabonded. On the average they are forming two different bonding types. One type is the regular tetrahedral water-water bonding similar to that found in the ordinary ice Ih, whereas the other is a more dense nonregular tetrahedral bonding similar to that appearing in the ice II. The transformation between these two bonding forms is evidenced by FT-NIR experiment. The FT-NIR measurements were done for liquid water in the temperature range from $20^{\circ}C$ up to $80^{\circ}C$ in a wide extent of frequencies: 12 000 - 4000 $cm^{-1}$ /. Temperature dependent variations in the volume fraction of these two structures are directly related to the spectral changes. The absorbance variations are explored by means of the two-dimensional correlation spectroscopy (2DCOS), principal component analysis (PCA), curve fitting and second derivatives. The presence of the isosbestic points in a range of the combination and overtone transitions indicates that the experimental spectra are a superposition of two temperature independent components. One component of diminishing intensity with temperature increase, is assigned to a stronger hydrogen bonds occurred in the Ih type, whereas the second component showing an opposite behavior, one can attribute to a weaker H-bonds characteristic for the II type. The understanding of the hydrogen bonding network in the liquid water is very important in interpretation of the interaction between water and protein chain. The two-state model of water surrounding the protein surface could advance an understanding of the hydration process.

• Restorative Dentistry and Endodontics
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• v.21 no.1
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• pp.425-435
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• 1996

The effect of application of dentin bonding agent to the exposed dentin on the intradental nerve activity (INA), dentinal fluid movement and sealing of the dentinal tubules, was investigated in this study. The INA was recorded from the single pulp nerve unit dissected from the inferior alveolar nerve. And specimen of dentin was observed by SEM. Dentinal fluid 'movement through exposed dentin surface was measured before and after the application of dentin bonding agent. 1. Eight Ao-fiber units (conduction velocity: $8.0{\pm}4.0m$/sec) were identified. 4M NaCl evoked an irregular burst of action potentials which ceased immediately after washing. 2. In 4 $A{\delta}$-fiber units, appliction of All Bond 2 completely abolished the INA induced by 4M NaCl. Also, application of Scotchbond Multipurpose(SBMP) totally abolished the INA induced by 4M NaCl in 4 $A{\delta}$-fiber units. 3. Before the application of dentin bonding agent, outward dentinal fluid movement of $10.2{\pm}5.7\;pl{\cdot}s^{-1}{\cdot}mm^{-2}$ was obsered. But after the application of dentin bonding agent the movement of dentinal fluid was stopped. 4. The gap width of 2-$3{\mu}m$ was formed between exposed dentin and adhesive resin in the specimens applied with dentin bonding agents of All Bone 2 and SBMP. But the formation of hybrid layer and the penetration of resin into were dentinal tubules were not clearly observed in interface between dentin and adhesive resin.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.573-579
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• 2009

Titanium/aluminum/stainless steel(Ti/Al/STS) clad materials have received much attention due to their high specific strength and corrosion-resisting properties. However, it is difficult to fabricate these materials, because titanium oxide is easily formed on the titanium surface during heat treatment. The aim of the present study is to derive optimized cladding conditions and thereupon obtain the stable quality of Ti/Al/STS clad materials. Ti sheets were prepared with and without pre-heat treatment and Ti/Al/STS clad materials were then fabricated by cold rolling and a post-heat treatment process. Microstructure of the Ti/Al and STS/Al interfaces was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersed X-ray Analyser(EDX) in order to investigate the effects of Ti pre-heat treatment on the bond properties of Ti/Al/STS clad materials. Diffusion bonding was observed at both the Ti/Al and STS/Al interfaces. The bonding force of the clad material with non-heat treated Ti was higher than that with pre-heat treated Ti before the cladding process. The bonding force decreased rapidly beyond $400^{\circ}C$, because the formed Ti oxide inhibited the joining process between Ti and Al. Bonding forces of STS/Al were lower than those of Ti/Al, because brittle $Fe_3Al$, $Al_3Fe$ intermetallic compounds were formed at the interface of STS/Al during the cladding process. In addition, delamination of the clad material with pre-heat treated Ti was observed at the Ti/Al interface after a cupping test.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.7
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• pp.4357-4363
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• 2015

This study is to compare the differences of bonding strength based on the Degassing temperatures and various opaque materials for Ni-Cr alloy specimen which does not contain beryllium(Be). Numerous comparison tests have been performed to measure the bonding strength by experimenting 3-point flexural rigidity tests in order to find out ways of stabilization and enhancement of bonding strength between metal and porcelain. AVOVA, surface component observation experiment by SAM/EDS, and Tukey's HSAD posteriori tests results are as follows: First, The bonding strength in all groups has exceeded the minimum (25MPa) of ISO9693 bonding strength regulation for dental mental-porcelain specimen. Second, The bonding strength of Group V1 was $32.37{\pm}1.91MPa$, $38.25{\pm}1.38MPa$ in Group V2, $46.43{\pm}2.14MPa$ in Group V3 and $47.21{\pm}1.72MPa$ Group V4. The difference has been statistically meaningful. Tukey's HSAD posteriori tests results have shown that the bonding strength in Group V4 was higher than that of Group V1. Third, the bonding strength between metal and porcelain without degassing process was higher than that of with degassing process, and the bonding strength of powder opaque was higher than that of paste opaque. Fourth, Group V4 has ranked the highest on the comparison table of metal and porcelain bonding strength.

• Journal of the korean academy of Pediatric Dentistry
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• v.32 no.2
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• pp.293-299
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• 2005

It is important to reduce chair time and procedure in restorative treatment for children. Composite resin is not only used in esthetic restoration of anterior teeth but also posterior teeth by its improved physical property. The 7th generation dentin bonding system was recently developed in order to simplify three steps which is needed to bond composite resin to tooth surface-etchant, primer, adhesive. We compared shear bond strengths of 4, 5, 6, 7th generations dentin bonding systems. The primary dentin was pretreated with 4, 5, 6, 7th generation dentin bonding systems. Then composite resin was cured to the specimen using molds 2.5mm in diameter and 2mm in height. Thermocycling was performed and shear bond strength was finally measured. The results were as follow; 1. The mean values of shear bond strengths in 5th generation dentin bonding system(group 2) were greater than those of 4, 6, 7th generation dentin bonding system(group 1, 3, 4). The differences were statistically significant. 2. The mean values of shear bond strengths in 4th generation dentin bonding system(group 2) were greater than those of 6, 7th generation dentin bonding system(group 1, 3, 4). But, the differences were not statistically significant. 3. Between the mean values of shear bond strengths in 6, 7th generation dentin bonding system(group 3, 4) were similar.

• Korean Journal of Materials Research
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• v.8 no.10
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• pp.890-897
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• 1998

The direct wafer bonding between n-InP(001) wafer and the ${Si}_3N_4$(200 nm) film grown on the InP wafer by PECVD method was investigated. The surface states of InP wafer and ${Si}_3N_4$/InP which strongly depend upon the direct wafer bonding strength between them when they are brought into contact, were characterized by the contact angle measurement technique and atomic force microscopy. When InP wafer was etched by $50{\%}$ HF, contact angle was $5^{\circ}$ and RMS roughness was $1.54{\AA}$. When ${Si}_3N_4$ was etched by ammonia solution, RMS roughness was $3.11{\AA}$. The considerable amount of initial bonding strength between InP wafer and ${Si}_3N_4$/InP was observed when the two wafer was contacted after the etching process by $50{\%}$ HF and ammonia solution respectively. The bonded specimen was heat treated in $H^2$ or $N^2$, ambient at the temperature of $580^{\circ}C$-$680^{\circ}C$ for lhr. The bonding state was confirmed by SAT(Scannig Acoustic Tomography). The bonding strength was measured by shear force measurement of ${Si}_3N_4$/InP to InP wafer increased up to the same level of PECVD interface. The direct wafer bonding interface and ${Si}_3N_4$/InP PECVD interface were chracterized by TEM and AES.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• Elastomers and Composites
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• v.52 no.4
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• pp.257-265
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• 2017

In this work, CR (Chloroprene Rubber) was emulsified by phase-inversion emulsification with nonionic surfactants (NP-1025, LE-1017, and OP-1019) and an anionic surfactant (SDBS; sodium dodecylbenzenesulfonate), and its stabilization was investigated through a study of its adsorption characteristics, zeta potential, and flow behavior. As the amount of the mixed surfactant increased, the droplet size decreased, resulting in the increase of viscosity. In particular, a CR emulsion with a lower absorbance in the UV spectrum exhibited the highest zeta potential. The results of this experiment showed that the CR emulsion prepared using (LE-1017) and SDBS was the most stable. In this study, calcium hydroxide and aluminum hydroxide were added to enhance the mechanical properties of the CR emulsion, and the relationship between tensile strength, tear strength and surface free energy were investigated. The tensile and tear strengths of the CR emulsion incresed as the amount of calcium hydroxide and aluminum hydroxide increased. The highest tensile and tear strengths and surface free energy were observed for additions of 1.0% calcium hydroxide and 0.80% aluminum hydroxide, respectively. It was concluded that the interfacial bonding strength was improved by the even dispersion of calcium hydroxide and aluminum hydroxide in the CR emulsion.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.45 no.1
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• pp.59-66
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• 2013

Fillers have been used for printing paper to improve printability, sheet formation and optical properties and to reduce production costs by replacing expensive wood pulps. However, an increased filler content will decrease paper strength because filler particles interfere with fiber-fiber bonding. In order to increase filler content without sacrificing too much paper strength in high filler content papers, the surface of precipitated calcium carbonate (PCC) has been modified by adsorbing anionic polyacrylamide and cationic starch in series. The adsorbed polymer layers would enhance interactions between the filler surface and the fiber surface, improving internal bonding. It was found that the modified PCC increased paper strength at a given filler content compared to the coventional method. Negligible differences in optical properties and formation of paper, filler and fines retention and drainage on the wire section were observed between the modified and the conventional PCC. However, the decreased bulk of paper was observed when the modified PCC was used.

• Advances in concrete construction
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• v.15 no.6
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• pp.431-444
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• 2023

This study investigated the use of latex-modified sand concrete reinforced with sisal fibers (LMSC) as a repair material. Notably, no prior research has explored the application of LMSC for this purpose. This paper examines the interface bond strength and the type of failure between LMSC as a repair material and the normal concrete (NC) substrate utilising four different surfaces: without surface preparation as a reference (SR), hand hammer (HA), sandblasted (SB), and grooved (GR). The bond strength was measured by bi-surface shear, splitting tensile, and pull-off strength tests at 7, 28, and 90 days. Scanning electron microscopy analysis was also performed to study the microstructure of the interface between the normal concrete substrate and the latex-modified sand concrete reinforced with sisal fibers. The results of this study indicate that LMSC has bonding strength with NC, especially for HR and SB surfaces with high roughness. Therefore, substrate NC surface roughness is essential in increasing the bonding strength and adhesion. Eventually, The LMSC has the potential to repair and rehabilitate concrete structures.