• Journal of Powder Materials
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• v.14 no.1 s.60
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• pp.44-49
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• 2007

In the fabrication of dye-sensitized solar cells (DSSCs), carbon counter electrode has been tested for replacing the platinum counter electrode which has two drawbacks: limited surface area and high material cost. Poor mechanical stability of carbon layer due to weak bonding strength to electrically conductive TCO (transparent conducting oxide) glass substrate is a crucial barrier for practical application of carbon counter electrode. In the present study a carbon counter electrode with high conversion efficiency, comparable to Pt counter electrode, could be fabricated by adaption of a bonding layer between particulate carbon material and TCO substrate.

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.6-9
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• 1996

The Joining of copper rod and zirconia tube was carried out in Ar gas atmosphere. There are two type of the joining. The one is the reaction bond consisting of Cu and zirconia was dominated by surface reaction wi th a undetctable very thin layer. It was found that copper elements were diffused to zirconia side, but that most of Z $r^{4+}$ ions were not diffused to copper side. This result means application of a DC voltage to migrate oxygen to the copper/zirconia interface can oxidize metal at the copper /zirconia interface, and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result means application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cr.

• Macromolecular Research
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• v.16 no.5
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• pp.399-403
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• 2008

Monodisperse, micron-sized, hybrid particles having a core-shell structure were prepared by coating the surface of poly(methyl methacrylate)(PMMA) microspheres with silica and by copolymerizing acrylamide (AAm) to supply the hydrogen bonding effect by means of the amide groups. Tetraethoxysilane (TEOS) was then slowly dropped onto the medium under certain conditions. Because of the hydrogen bonding between the amide of the PMMA particles and the hydroxyl group of the hydrolyzed silanol, a silica shell was generated on the PMMA core particles. The morphology of the hybrid particles was investigated with transmission (TEM) and scanning (SEM) electron microscopy as a function of the medium conditions and the amount of TEOS. Improved thermal properties were observed by TGA analysis.

• Transactions of Materials Processing
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• v.12 no.4
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• pp.376-381
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• 2003

Microstructural evolution and dry sliding wear behavior of ultra-fine grained 5052 Al alloy obtained by an accumulative roll-bonding process have been investigated. After 7 ARB cycles, ultra-fine grains with a large misorientation between neighboring grains were obtained. The grain size was about 0.2 $\mu$m. The hardness, tensile and yield strengths of the ultra-fine grained alloy increased as the amount of accumulated strain increased with the ARB cycles. Sliding wear tests of the ultra-fine grained 5052 Al alloy were conducted at room temperature. Wear rate of the ultra-fine grained alloy increased in spite of the increase of hardness. Surface of the worn specimens were examined with SEM to investigate wear mechanism of the ultra-fine grained alloy.

• Journal of Powder Materials
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• v.12 no.1
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• pp.30-35
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• 2005

An aluminum powder compact consolidated by a powder-in sheath rolling (PSR) method was severely deformed by accumulative roll-bonding (ARB) process. The ARB process was performed up to 8 cycles at ambient temperature without lubrication. Optical microscope and transmission electron microscope observations revealed that microstructure of the ARB-processed Al powder compact is inhomogeneous in the thickness direction. The ultra-fine subgrains often reported in the ARB-processed bulky materials were also developed near surface of the Al powder compacts in this study. Tensile strength of the ARB-processed Al powder compact increased at the 1st cycle, but from the 2nd cycle it rather decreased slightly.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.10
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• pp.815-819
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• 1998

The silicon-nirtide membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PRO($PbTiO_3$ ) layer for a IR detection was coated on the membrane and its characteristics were measured. The a attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer were eliminated through the method of bonding/etching of silicon wafer. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by the PTO layer were measured, too.

• Steel and Composite Structures
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• v.20 no.3
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• pp.671-692
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• 2016

FRP stay-in-place (SIP) formworks are designed as a support for casting concrete and as a tension reinforcement when concrete is cured. Bond development between SIP formwork and concrete is critical for FRP tension element to be effective. This paper reports the bond strength between FRP formwork and concrete for different interfacial treatments. A novel experimental setup is prepared for observing the bond behaviour. Three different adhesives with varying workability have been investigated. Along with the load-deformation characteristics, bond slip and strains in the formwork have been measured. A finite element numerical simulation was conducted for the experiments to understand the underlying mechanism. The results show that the adhesive bonding has the best bond strength.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.11
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• pp.334-339
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• 2020

In this study, the adhesion properties between aluminum and composite materials, composite materials, and composite materials were compared according to the physical surface treatment to improve mechanical bonding at the bonding surface when considering carbon fiber and glass fiber-reinforced composite materials. Bonded specimens were classified into the type of base material and the surface treatment method of the bonding surface. Sandpaper, sandblasting, and plasma were applied as physical surface treatment methods. The bonded specimen was prepared as a single lap joint test specimen. An experiment to measure the lap shear strength was conducted, and the results were compared. The experimental results confirmed that the mechanical abrasion and sandblasting treatment improved the lap shear strength approximately 4 to 5 fold compared to the general specimen without physical surface treatment. In plasma treatment, the experiment was conducted by defining the respective plasma output and treatment time as follows: 150 W and 5 minutes, 150 W and 10 minutes, and 300 W and 3 minutes. Moreover, the lap shear strength results were similar to the previous mechanical surface treatments. On the other hand, the effect on the adhesion properties was small, depending on the plasma treatment conditions.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.75-81
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• 2018

The effect of $Ar-N_2$ plasma treatment on Cu surface as one of solutions to realize reliable Cu-Cu wafer bonding was investigated. Structural characteristic of $Ar-N_2$ plasma treated Cu surface were analyzed using X-ray diffraction, X-ray photoelectron spectroscopy, atomic force microscope. Ar gas was used for a plasma ignition and to activate Cu surface by ion bombardment, and $N_2$ gas was used to protect the Cu surface from contamination such as -O or -OH by forming a passivation layer. The Cu specimen under high Ar partial pressure plasma treatment showed more copper oxide due to the activation on Cu surface, while Cu surface after high $N_2$ gas partial pressure plasma treatment showed less copper oxide due to the formation of Cu-N or Cu-O-N passivation layer. It was confirmed that nitrogen plasma can prohibit Cu-O formation on Cu surface, but nitrogen partial pressure in the $Ar-N_2$ plasma should be optimized for the formation of nitrogen passivation layer on the entire surface of Cu wafer.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.156.2-156.2
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• 2007