• Title/Summary/Keyword: bonding surface

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Effect of Halide Ions on Hydrogen Entry Efficiency into Steel Sheet

  • Hiroki Kawanami;Takehiro Takahashi;Tomohiko Omura
    • Corrosion Science and Technology
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    • v.23 no.5
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    • pp.410-415
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    • 2024
  • In this study, hydrogen permeation currents were investigated in hydrogen permeation tests for NaCl solutions at different concentrations to clarify the effect of chloride ion on hydrogen entry into the steel sheet. Hydrogen permeation currents for bromide and iodide ions were also investigated in the same test to determine the effect of halide ion species on hydrogen entry. The amount of hydrogen entry increased with increasing chloride ion concentration in hydrogen permeation tests due to an increase in the amount of chloride ions adsorbed on the steel sheet surface, which prevented hydrogen atoms from bonding with each other. It was also found that hydrogen entry was higher in bromide and iodide ion environments than in the chloride ion environment. According to the HSAB rule, bromide and iodide ions are considered to have stronger adsorption with the steel sheet surface than chloride ions, preventing bonding between hydrogen atoms more than chloride ions.

Effect of hydrofluoric acid-based etchant at an elevated temperature on the bond strength and surface topography of Y-TZP ceramics

  • Yu, Mi-Kyung;Lim, Myung-Jin;Na, Noo-Ri;Lee, Kwang-Won
    • Restorative Dentistry and Endodontics
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    • v.45 no.1
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    • pp.6.1-6.8
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    • 2020
  • Objectives: This study investigated the effects of a hydrofluoric acid (HA; solution of hydrogen fluoride [HF] in water)-based smart etching (SE) solution at an elevated temperature on yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) ceramics in terms of bond strength and morphological changes. Materials and Methods: Eighty sintered Y-TZP specimens were prepared for shear bond strength (SBS) testing. The bonding surface of the Y-TZP specimens was treated with 37% phosphoric acid etching at 20℃-25℃, 4% HA etching at 20℃-25℃, or HA-based SE at 70℃-80℃. In all groups, zirconia primers were applied to the bonding surface of Y-TZP. For each group, 2 types of resin cement (with or without methacryloyloxydecyl dihydrogen phosphate [MDP]) were used. SBS testing was performed. Topographic changes of the etched Y-TZP surface were analyzed using scanning electron microscopy and atomic force microscopy. The results were analyzed and compared using 2-way analysis of variance. Results: Regardless of the type of resin cement, the highest bond strength was measured in the SE group, with significant differences compared to the other groups (p < 0.05). In all groups, MDP-containing resin cement yielded significantly higher bond strength values than MDP-free resin cement (p < 0.05). It was also shown that the Y-TZP surface was etched by the SE solution, causing a large change in the surface topography. Conclusions: Bond strength significantly improved when a heated HA-based SE solution was applied to the Y-TZP surface, and the etched Y-TZP surface was more irregular and had higher surface roughness.

Development of Cu CMP process for Cu-to-Cu wafer stacking (Cu-to-Cu 웨이퍼 적층을 위한 Cu CMP 특성 분석)

  • Song, Inhyeop;Lee, Minjae;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.4
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    • pp.81-85
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    • 2013
  • Wafer stacking technology becomes more important for the next generation IC technology. It requires new process development such as TSV, wafer bonding, and wafer thinning and also needs to resolve wafer warpage, power delivery, and thermo-mechanical reliability for high volume manufacturing. In this study, Cu CMP which is the key process for wafer bonding has been studied using Cu CMP and oxide CMP processes. Wafer samples were fabricated on 8" Si wafer using a damascene process. Cu dishing after Cu CMP and oxide CMP was $180{\AA}$ in average and the total height from wafer surface to bump surface was approximately $2000{\AA}$.

A Syudy on the High Temprerties of the 5Layer Functionally Gradient Thermal Barrier Coating (5층열장벽 피막의 고온 물성에 관한연구)

  • Han, J. C.;Jung, C.;Song, Y. S.;Yoon, J. K.;Lo, B. H.;Lee, K. H.
    • Journal of Surface Science and Engineering
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    • v.31 no.1
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    • pp.12-23
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    • 1998
  • The Thermal Barrier Coating(TBC) has been used to improve the heat barrier and tribological properties of the aircraft engine and the automobile engine in high temperature. Especially, the high temperature tribological propertied of the cylinder haed and the piston crown of diesel engine was emphasized. Therefore, the purpose of this work was to evaluate the microstructure, tribological propeer in high tempearmal shock resistance and bonding strength of five layer functionally gradient TBC for the applications. The five layerwere composed with 100% ceramic insulating later, 75(ceramic):25 (metal) layer, 50:50 layer, 25:75 layer and 100% metal bonding layer to redude the thermal stress. the YSL and MSL poweders were the insulation ceramics powers. The NiCrAly, Inconel625 and SUS powders were the bonding and mixingg powders for plasma spray process. According to the result of high temperature wear test, the wera resistance of YSZ/NiCrAlY siytem was most out standing at 600 and $800^{\circ}C$. At $400^{\circ}C$, the wear resistance of YSZ/Inconel system was better than others. Wear volume at other temperature because of the low temperature degration of zirconia. The thermal shock mechanism of 5 later is the vertical crack gegration in insulating layer. this means that the initial cracks were generated in the top layer, and then developed into the composite layers during thermal shock test. Finally, these cracks werereached to the interface of coating and substrate and also, these vertioal cracks join with the horizontal cracks of the each layers. The bonding strength of YSZ/NiCrAlY and YSZ/Inconel 5 layer system is better than other 5layer systems. The theramal shock resistance of thermal barrier coating s with 5 layer system is better than that of 3 layers and 2 layers.

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The Comparison of Adhesion Properties on Polyester Fabric by AC and DC Corona Treatment (AC와 DC 코로나 처리에 따른 폴리에스테르 직물의 접착성질 비교)

  • Lee, Jae Ho
    • Journal of Adhesion and Interface
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    • v.17 no.3
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    • pp.104-109
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    • 2016
  • Compare AC corona and DC corona treatment effects, polyester fabrics were AC corona treated with different current intensity (5, 10, 15 A) and feeding speed (5, 10, 15 m/min) as the same DC corona treatment conditions of the preceding research. We confirmed the surface change of polyester fabrics using scanning electron microscopy (SEM) and X-ray photoelectron spectrometer (XPS), and the change of physical properties through measuring the dry and wet bonding strength. The surface changes of polyester fabrics by treating in air atmosphere with AC corona discharge are shown similar tendency with DC corona discharge. Generally dry bonding strength were increased with increasing current intensity and feeding speed, but wet bonding strength were increased with increasing current intensity and decreasing feeding speed in both AC and DC corona treatment. When the current is 20 A, carbonization occurs in DC corona discharge but carbonization does not occur in DC corona discharge.

THE SHEAR BOND STRENGTH OF TWO ADHESIVES BONDED TO COMPOSITE RESIN AND GLASS IONOMER CEMENT RESTORATIONS (복합레진과 Glass Ionomer Cement수복물에 대한 Bracket의 접착전단강도)

  • Han, Jae-Ik;Rhee, Byung-Tae
    • The korean journal of orthodontics
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    • v.20 no.3 s.32
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    • pp.583-591
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    • 1990
  • If the bond strength is sufficient to resist orthodontic force, orthodontic brackets can be bonded to restorations. Orthodontic brackets were bonded to composite resin and glass ionomer cement restorations with no-mix adhesive or glass ionomer cement. The shear bond strength of adhesives bonded to restorations was studied in vitro. Orthodontic brackets were bonded to 10 extracted natural teeth, 40 composite resin restorations and 40 glass ionomer restorations. The surfaces of composite resin restorations were roughened or applied with bonding agent (Scothbond) after surface roughening. The surfaces of glass ionomer cement restorations were conditioned with acid etching or applied with Scotchbond to etched surface. The adhesive was no-mix resin or glass ionomer cement. The shear bond strength was measured. The results were as follows: 1. Orthodontic brackets could be bonded to composite resin restorations effectively as they could be bonded to acid etched enamel with no-mix adhesive. The shear bond strength was sufficient to resist orthodontic force and was not affected by bonding agent greatly. 2. The shear bond strength of no-mix adhesive bonded to acid etched glass ionomer cement restorations was sufficient to resist orthodontic force. However. the fracture risk of glass ionomer cement restorations was increased during debonding. The bonding agent couldn't increase the shear bond strength greatly. 3. The shear bond strength of glass ionomer cement bonded to glass ionomer cement restorations was lower than that of no-mix adhesive. The shear bond strength was sufficient to resist orthodontic force and was greatly decreased by bonding agent. 4. The shear bond strength of glass ionomer cement bonded to composite resin restorations was too low to resist orthodontic force.

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Effect of Various Sizing Agents on the Properties of Nylon6/Carbon Fiber Composites Prepared by Reactive Process (다양한 사이징제가 반응중합에 의해 제조된 나일론 6/탄소섬유 복합체의 물성에 미치는 영향)

  • Park, Ha-Neul;Lee, Hak Sung;Huh, Mongyoung
    • Composites Research
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    • v.31 no.6
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    • pp.299-303
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    • 2018
  • In order to improve the interfacial bonding force and reaction polymerization degree of the carbon fiber reinforced nylon 6 composite material, the surface of the existing epoxy-sizing carbon fiber was desized to remove the epoxy and treated with urethane, nylon and phenoxy sizing agent, was observed. The interfacial bond strength of the resized carbon fiber was confirmed by IFSS (Interfacial Shear Strength) and the fracture surface was observed by scanning electron microscope. The results showed that the interfacial bonding strength of the carbon fiber treated with nylon and phenoxy sizing agents was higher than that of urethane - based sizing. It has been found that the urethane - type resizing carbon fiber has lower interfacial bonding strength than the conventional epoxy - sizing carbon fiber. This result shows that the interfacial bonding between carbon fiber and nylon 6 is improved by removing low activity and smoothness of existing carbon fiber.

Fabrication of SiCOI Structures for MEMS Applications in Harsh Environments (극한 환경 MEMS용 SiCOI 구조 제작)

  • Chung, Gwiy-Sang;Chung, Yun-Sik;Ryu, Ji-Goo
    • Journal of Sensor Science and Technology
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    • v.13 no.4
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    • pp.264-269
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    • 2004
  • This paper describes on an advanced technology of 3C-SiC/Si(100) wafer direct bonding using PECVD oxide to intermediate layer for SiCOI(SiC-on-Insulator) structure because it has an attractive characteristics such as a lower thermal stress, deposition temperature, more quick deposition rate and higher bonding strength than common used poly-Si and thermal oxide. The PECVD oxide was characterized by ATR-FTIR. The bonding strength with variation of HF pre treatment condition was measured by tensile strength measurement system. After etch-back using TMAH solution, roughness of 3CSiC surface crystallinity and bonded interface was measured and analyzed by AFM, XRD, and SEM respectively.

A Study on the Curing Method to Improve Bonding Strength of Aluminum/CFRP Composites (알루미늄/CFRP 복합재의 접착강도 향상을 위한 경화방법에 관한 연구)

  • 이경엽;양준호;최낙삼
    • Transactions of the Korean Society of Automotive Engineers
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    • v.10 no.3
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    • pp.130-135
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    • 2002
  • This study investigates the effect of curing method on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. Lap shear tests and T-peel tests were performed based on the procedure of ASTM 906-94a and ASTMD1876-95, respectively. Test samples were fabricated by using the co-curing method and the secondary curing method. The results showed that the shear strength of test samples made by the co-curing method was 2.5 times greater than that of test samples made by the secondary curing method. The T-peel strength of the co-curing method case was almost 2 times greater than that of the secondary curing method case.

The Consideration of the Damage in Gas Turbine Hot Parts for Repair Bonding Process (가스터빈 고온부품의 재생 접합을 위한 손상부 파악)

  • Kim, S.W.;Choi, C.;Kim, J.C.;Lee, C.H.
    • Journal of Power System Engineering
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    • v.7 no.2
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    • pp.73-79
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    • 2003
  • The present study was aimed at analysing the damage of a used gas turbine bucket after 39,500h of total service. Microstructures and cracks of service-induced bucket were observed. The crack might have initiated from the coating in the bucket surface by thermal fatigue and propagated into the GTD111 base metal. Maximum depth of penetration was 2.7 mm(full penetration) at the leading edge. Crack contains a lot of Cr-,Ti-,Al-oxide which will prohibit filling and wetting of insert metal. Depth and propagation direction of crack were accorded with centrifugal force and temperature distribution in turbine bucket. Present result will provide basic data for repair bonding process.

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