• Journal of the Korean Society for Precision Engineering
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• v.22 no.10 s.175
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• pp.39-48
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• 2005

As the industrial development is accelerated, a new machining process and system are keenly required to achieve super precision surface finish. Especially to get ground surface finish fer complicated and narrow inner shape of molds, it is impossible with the existing methods so that a new method is being required to be developed. A new material, called Magic(MAGnetic Intelligent Compounds), is finally made and it is called Magic machining that uses this material. There is a way to make a material as follows, the mixture of magnetic particles, bonding material and particles of abrasive grain should be melt down by proper heat, and then this mixture put in a mold and cool down in magnetic field which has a uniform direction. This new polishing method is spotlighted as an excellent solution to the existing problems. However it hasn't reported any study about the influence of the machining conditions of polishing velocity, amplitude and polishing pressure to the surface roughness yet. This study would examine closely the influence of polishing conditions of the Magic polishing tool to the surface finish to decide the optimum polishing condition and to standardize the Magic polishing work.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.216-216
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• 2011

We will investigate the bonding configurations of phenylalanine and tyrosine adsorbed on the Ge(100) surface using CLPES and DFT calculations. First, the C 1s, N 1s, and O 1s spectra obtained at 300 K revealed that both the amine and carboxyl groups of phenylalanine and tyrosine concurrently participated in adsorption on the Ge(100) surface without bond breaking using CLPES, depending on the extent of coverage. In the second place, we confirmed that the "O-H dissociated-N dative bonded structure" is the most stable structure implying kinetically favorable structure, and the "O-H dissociation bonded structure" is another stable structure manifesting thermodynamically advantageous structure using DFT calculations. This tendency turns up both phenylalanine and tyrosine, similarly. Furthermore, through the CLPES data and DFT calculation data, we discovered that the "O-H dissociated-N dative bonded structure" and the "O-H dissociation bonded structure" are preferred at 0.30 ML and 0.60 ML, respectively. Moreover, we found that the phenyl ring of phenylalanine is located in axial position to Ge(100) surface, but the phenyl ring of tyrosine is located in parallel to Ge(100) surface using DFT calculations.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.271-271
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• 2013

The defect states of a Ar-sputtered SiO2 surface on Si (001) were investigated using Auger electron spectroscopy (AES) and reflection electron energy loss spectroscopy (REELS). The REELS spectra at the primary electron energy of 500 eV showedthat three peaks at 2.5, 5.1, and 7.2 eV were found within the band gap after sputtering. These peaks do not appear at the primary electron energies of 1,000 and 1,500 eV, which means that the defect states are located at the extreme surface of a SiO2/Si thin film. According to the calculations, two peaks at 7.2 and 5.1 eV are related to neutral oxygen vacancies. However, the third peak at 2.5 eV has never been previously reported and the theories proposed that this defect state may be due to Si-Si bonding. Our Auger data showed that a peak for Si-Si bonding at 89 eV appears after Ar ion sputtering on the surface of the sample, which is consistent with the theoretical models.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3279-3281
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• 1999

This paper describes a method of direct wafer bonding using surfaces activated by a radio-frequency hydrogen plasma. The hydrogen plasma cleaning of silicon in the RIE mode was investigated as a pretreatment for silicon direct bonding. The cleaned silicon surface was successfully terminated by hydrogen, The hydrogen-terminated surfaces were rendered hydrophilic, which could be wetted by Dl water rinse. Two wafers of silicon and silicon dioxide were contacted to each other at room temperature and postannealed at $300{\sim}1100^{\circ}C$ in an $N_2$ atmosphere for 2 h. From the AFM results, it was revealed that the surface became rougher with the increased plasma exposure time and power. The effect of the plasma treatment on the surface chemistry was investigated by the AES analysis. It was shown that the carbon contamination at the surface could be reduced below 5 at %. The interfacial energy measured by the crack propagation method was 122 $mJ/m^2$ and 384 $mJ/m^2$ for RCA cleaning and hydrogen plasm, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.2
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• pp.114-119
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• 2000

Etch characteristics of SF6/CI2 electron cyclotron resonance (ECR) plasmas have been investigated. Surface reaction of gas plasma with polysilicon was also analysed using X-ray photoelectron spectroscopy (XPS). At the same time, the relationship between surface reaction and the etched profile of polysilicon was examined using XPS. The etch rate of polysilicon and oxide increases with increasing flow rate of SF6 in the SF6/CI2 gas mixture, and tis selectivity also increase also increase. It was also found that as increasing flow rate of SF6 in the SF6/CI2 gas mixture, the atomic% of chlorine detected at surface region decrease, but F and S contents increase. At the same time, when the mixing ratio of SF6 gas increases, the anisotropy of etched polysilicon is sharply decreased in the 0%~10% range of the SF6 mixing ratio, but is rarely varied in the range over 10%, in spite of the large variations in flow rates. It can be explained that the bonding of S-Si due to SiSx(x$\leq$2) compound formed on the etched surface suppress the formation of Si-Cl and 'or Si-F bonding in the silicon etching.

• Journal of Ceramic Processing Research
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• v.20 no.1
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• pp.48-53
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• 2019

Carbon fiber reinforced SiC composites (C/SiC) have high-temperature stability and excellent thermal shock resistance, and are currently being applied in extreme environments, for example, as aerospace propulsion parts or in high-performance brake systems. However, their low thermal conductivity, compared to metallic materials, are an obstacle to energy efficiency improvements via utilization of regenerative cooling systems. In order to solve this problem, the present study investigated the bonding strength between carbon fiber and matrix material within ceramic matrix composite (CMC) materials, demonstrating the relation between the microstructure and bonding, and showing that the mechanical properties and thermal conductivity may be improved by treatment of the carbon fibers. When fiber surface was treated with a nitric acid solution, the observed segment crack areas within the subsequently generated CMC increased from 6 to 10%; moreover, it was possible to enhance the thermal conductivity from 10.5 to 14 W/m·K, via the same approach. However, fiber surface treatment tends to cause mechanical damage of the final composite material by fiber etching.

• Restorative Dentistry and Endodontics
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• v.22 no.1
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• pp.447-463
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• 1997

The purpose of this study was to evaluate the effectiveness of copal varnish and five bonding agents(Scotchbond Multi-Purpose Plus Dental Adhesive System, Panavia 21, All Bond 2, Superbond D-Liner II plus, Fuji Duet) in reducing microleakage under amalgam restorations. Class V cavity were prepared on both buccal and lingual surface of sixty extracted human molars with cementum margin and were filled with different kinds of liners and amalgam. All teeth were stored at $37^{\circ}C$ in physiologic saline solution. After 1 week they were thermally stressed for 500 cycles between 5 and $55^{\circ}C$ in baths containing 0.5 % basic fuchsin dye. The dye penetrations were observed with a stereomicroscope. Scanning electron micrographs were taken of representative tooth sections from each group to assess the nature of the tooth/liner/amalgam interface. The statistical test were applied to the results using a one way analysis variance (ANOVA) and Duncan's multiple range test. The results were as follows ; 1. In all groups, the enamel margin showed significantly lower leakage value than the cementum margin (p<0.05). 2. At the dentin and enamel margins, the leakage value of Copalite-lined group showed significantly higher than that of no liner group (p<0.05), but showed significantly lower than that of bonding agent lined-groups (p<0.05). 3. There was no significant difference between the bonding agent lined-groups (p>0.05). 4. On the backscattered scanning electron microscopy observation, discontinuous gaps were observed between amalgam and dentin in the bonding agent-lined amalgam restorations and the bonding agents appeared to fill the gap space and were mixed with amalgam particles. At the amalgam/tooth interface, unsealed dentin and continuous gaps were found in both unlined and Copalite-lined restorations.

• Restorative Dentistry and Endodontics
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• v.24 no.1
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• pp.55-66
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• 1999

The purpose of this study was to evaluate the microleakage of 5 current dentin bonding systems which are composed of 2 multi-bottle systems(Scotchbond Multi-Purpose, All Bond2) and 3 one-bottle systems(Single bond, One-Step, Prime & Bond). In this in vitro study, class V cavities were prepared on buccal and lingual surfaces of sixty extracted human premolars and molars on cementum margin. The experimental teeth were randomly divided into six groups of 10 samples (20 surfaces) each, Group 1 : Scotchbond Multi-Purpose ; Group 2 : All Bond 2 ; Group 3 : Single Bond ; Group 4 : One-Step ; Group 5 : Prime & Bond ; Group 6 : no bonding agent(control). The bonding agent and composite resin were applied for each group following the manufacturer's instructions. After 500 thermocycling between $5^{\circ}C$ and $55^{\circ}C$, the 60 teeth were placed in 2% Methylene blue dye for 24 hours, then rinsed with tab water. The specimen were embedded in clear resin, then sectioned buccolingually through the center of restoration with a low speed diamond saw. The dye penetration on each of the specimen were then observed with a stereomicroscope at ${\times}20$. The results of study were statistically analyzed using the Student-Newmann-Keul's Methods and the Mann-Whitney Rank Sum Test. The resin/dentin interfaces were examined under Scanning Electron Microscopy. The results of this study were as follows. 1. None of the dentin bonding systems used in this study showed significant difference in leakage values at both the enamel and the dentin margins (P>0.05). 2. In all groups except the control, leakage value seen at the enamel margin was significantly lower than that seen at the dentin margin (P<0.05). 3. Compared to the control group, all the groups treated with dentin bonding systems showed significantly lower leakage value at both enamel and dentin margins (P<0.05). 4. In the SEM view, gaps were observed in the composite resin / dentin interface in group 6 where no dentin bonding agent was used, and in all the other groups (group 1, 2, 3, 4, 5) composite resin, hybrid layer, and dentin were seen to be closely adhering to each other where there were no leakages. Well-developed resin tags 3~100${\mu}m$ in length infiltrated dentinal tubules past the hybrid layer and a hybrid layer 1~5${\mu}m$ thick had developed between the dentinal surface and the composite resin surface.

• The korean journal of orthodontics
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• v.31 no.4 s.87
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• pp.459-465
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• 2001

The purpose of this study was to evaluate the feasibility of the combined use of paste resin with sealant as an adhesive of the indirect bonding. The resin bases made of light-cured resin were bonded to the bovine incisors at a distance of 0.0, 0.2 or 0.4 mm using the sealant only or the mixture of sealant and paste resin. Bond strength of each group was measured using universal testing machine. The results were as follows : 1. The bond strength was reduced in both groups as the distance between enamel surface and resin base increased. 2. The bond strength showed no statistical difference between two groups in case the distance between enamel surface and resin base was 0.0 mm. 3. In case the distance between enamel surface and resin base was 0.2 or 0.4 mm, the sealant with paste resin group showed significantly higher bond strength than the sealant only group. The results of the present study indicate that the use of paste resin with sealant may be desirable as an adhesive in indirect bonding, particularly in case a gap is suspected between enamel surface and resin base.

• Journal of Surface Science and Engineering
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• v.28 no.2
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.