• Proceedings of the Korea Concrete Institute Conference
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• 1997.10a
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• pp.723-728
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• 1997

The aim of this study is to define the physical properties of successive pours surfaces of concrete by various surface treatment methods with the laps of time. This paper is intended to study on the physical properties (the compressive strength, the tensile strength, the shear bonding strength and the bending strength) of the concrete successive pours surface used concrete surface finishing agent.

• International Journal of Korean Welding Society
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• v.4 no.1
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• pp.53-60
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• 2004

Adhesive-bonded joints are widely used in the industry. Recently, applications of adhesive bonding joints have been increased extensively in automobile and aircraft industry. The strength of adhesive joints is influenced by the surface roughness, adhesive shape, stress distribution, and etc. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, as the fundamental research of adhesive bonding joints, the effects of adhesive shape and loading speed on bonding strength properties and durability of aluminum to polycarbonate single-lap joints were studied. To evaluate the effect of adhesive shape, several modified shapes were used, and loading speeds were varied from 0.05 to 5mm/min. As a result, the load distribution showed a brittle fracture tendency. The trigonal edged single lap and bevelled lap joints showed the higher strength than the plain single lap, trigonal single lap, joggle lap and double lap joints in same adhesive area. The fractures of trigonal single lap and trigonal edged single lap joints that had the higher strength level were shown as the mixture type of the cohesive and interfacial-failure, mostly joggle lap joints that had the lower strength level were shown as the adhesive-failure.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.783-790
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• 2004

Adhesive-bonded joints are widely used in the industry. Recently, applications of adhesive bonding joints have been increased extensively in automobile and aircraft industry. The strength of adhesive joints is influenced by the surface roughness, adhesive shape, stress distribution, and etc. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, as the fundamental research of adhesive bonding joints, the effects of adhesive shape and loading speed on bonding strength properties and durability of aluminum to polycarbonate single-lap joints were studied. To evaluate the effect of adhesive shape, several modified shapes were used, and loading speeds were varied from 0.05 to 5 mm/min. As a result, the load-displacement distribution was shown a brittle fracture tendency. The trigonal edged single lap and bevelled lap joints showed the higher strength than the plain single lap, trigonal single lap, joggle lap and double lap joints in same adhesive area. The fractures of trigonal single lap and trigonal edged single lap joints that had the higher strength level were shown as the mixture type of the cohesive and interfacial-failure, mostly joggle lap joints that had the lower strength level were shown as the adhesive-failure.

• Journal of Surface Science and Engineering
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• v.33 no.2
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• pp.101-106
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• 2000

SOI (Silicon-On-Insulator) substrates were fabricated with varying annealing temperature of $25-660^{\circ}C$ by a linear annealing method, which was modified RTA process using a linear shape heat source. The annealing method was applied to Si ∥ $SiO_2$/Si pair pre-contacted at room temperature after wet cleaning process. The bonding strength of SOI substrates was measured by two methods of Razor-blade crack opening and direct tensile test. The fractured surfaces after direct tensile test were also investigated by the optical microscope as well as $\alpha$-STEP gauge. The interface bonding energy was 1140mJ/m$^2$ at the annealing temperature of $430^{\circ}C$. The fracture strength was about 21MPa at the temperature of $430^{\circ}C$. These mechanical properties were not reported with the conventional furnace annealing or rapid thermal annealing method at the temperature below $500^{\circ}C$. Our results imply that the bonded wafer pair could endure CMP (Chemo-Mechanical Polishing) or Lapping process without debonding, fracture or dopant redistribution.

• Carbon letters
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• v.7 no.3
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• pp.196-200
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• 2006

Graphite has hexagonal closed packing structure with two bonding characteristics of van der Waals bonding between the carbon layers at c axis, and covalent bonding in the carbon layer at a and b axis. Graphite has high tolerant to the extreme conditions of high temperature and neutron irradiations rather than any other materials of metals and ceramics. However, carbon elements easily react with oxygen at as low as 400C. Considering the increasing production of today of hydrogen and electricity with a nuclear reactor, study of oxidation characteristics of graphite is very important, and essential for the life evaluation and design of the nuclear reactor. Since the oxidation behaviors of graphite are dependent on the shapes of testing specimen, critical care is required for evaluation of nuclear reactor graphite materials. In this work, oxidation rate and amounts of the isotropic graphite (IG-110, Toyo Carbon), currently being used for the Koran nuclear reactor, are investigated at various temperature. Oxidation process or principle of graphite was figured out by measuring the oxidation rate, and relation between oxidation rate and sample shape are understood. In the oxidation process, shape effect of volume, surface area, and surface to volume ratio are investigated at $600^{\circ}C$, based on the sample of ASTM C 1179-91.

• Journal of Surface Science and Engineering
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• v.41 no.6
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• pp.325-330
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• 2008

Al6061 and Sus304 materials are bonded by using thermal bonding technology. Al6061, Sus304 and thermal bonded Al6061/Al6061 and Al6061/Sus304 materials are characterized by using mechanical and electrical measurement. Especially the experimental characteristic data of thermal bonded Al6061/Al6061 and Al6061/Sus304 are not well known until today. We have investigated on Al6061, Sus304 and thermal bonded material. The thermal bonded material Al6061/Al6061 and Al6061/Sus304 can be used for the LCD frame and the other electrical products. For the future, we expect that the more various experiments should be needed to carry out for the data accumulation in the bonded new materials.

• Restorative Dentistry and Endodontics
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• v.18 no.2
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• pp.483-496
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• 1993

Dentin hypersensitivity medicaments such as Gluma, Scotchbond 2, All-Bond 2, which are resin adhesives, were used to compare the sealing effects of dentinal tubule under mechanical stress. Topical application of above medicaments on the dentin surfaces of extracted teeth followed by artificial tooth brushing for 6 weeks was performed for the comparison. The following conclusions on the degree of dentinal tubule exposure versus time by were reached by using polyvinyl siloxane impression material for taking the impression, epoxy resin for the duplication and SEM for observing the surface. 1. SEM was used to compare the accuracy of the duplicated surface, but no differences were found when teeth samples and the duplicated surfaces were observed. 2. After comparing the degree of dentinal tubules exposure with varnish applied contrast group, resin adhesive materials showed much less exposure as time went by. 3. The results indicated that AU-Bond 2 adhesive, under mechanical stress, showed lesser exposure of dentinal tubules comparing with Gluma and Scotchbond 2 adhesives After the results were put together, it was demonstrated that resin replica method is an useful way to evaluate the treatment effects of the dentinal tubule hypersensitivity medicaments. Also, it was noticed that under mechanical stress, All-Bond 2, classified as fourth generation, illustrated the best dentinal tubules sealing effects.

• Journal of Surface Science and Engineering
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• v.49 no.6
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• pp.567-574
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• 2016

We have analyzed chemical properties of polysiloxane and polysilazane films, respectively, as sealing materials for electrostatic chuck (ESC) and have investigated the possibility of polysilazane as an alternative sealant to polysiloxane. It has been revealed that Si-O with organic bonding ($Si-CH_3$) existed in polysiloxane films compared to only pure Si-O bonding in polysilazane films. The sealing property of polysilazane has been found outstanding even in a short time of application. In the polysiloxane films containing $H_2O$, pin holes have been found possibly due to $CO_2$ gas evolution, and low adhesion with Si substrate has been observed after heat stress test in connection with the existence of organic bonding. After acid resistance test in 0.5 vol.% HF, 68 wt.% $HNO_3$, and 37 wt.% HCl solution, polyilazane films have shown a longer survival times. Compared to the conventional polysiloxane sealant, polysilazane is expected as a new sealing material because of good thermal and chemical stability.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.2
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• pp.75-79
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• 2007

This paper describes the self-alignment and bonding of microparts using adhesive surface tension to assemble microsystems in air. The alignment and bonding were tested experimentally using adhesive droplets, and the resulting performance was evaluated. The adhesive, which was inorganic and water-soluble before hardening, was diluted with water to a ratio of 10:1 so that its surface tension generated a sufficient restoring force for self-alignment. The experimental results showed that the average of the alignment errors obtained using the adhesive on $1.0\times1.0\times0.15-mm$ microparts was less than $2{\mu}m$ in the X and Y directions and 0.2 degrees in the e direction. These alignment errors were almost the same as those obtained using water. The use of a suitable adhesive had no negative effects on the alignment accuracy. The average tensile strength of the adhesive bond after self-alignment was $0.61N/mm^2$.

• Journal of Surface Science and Engineering
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• v.29 no.2
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• pp.93-99
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• 1996

In this work BN thin films were deposited on Si substrate by R. F. sputtering method at $200^{\circ}C$ and in Ar + $N_2$ mixed gas atmosphere. In order to investigate the effect of ion bombardment on substrate for c-BN bonding, substrate bias voltage was applied. The optimum substrate bias voltage for c-BN bonding was determined by FTIR analysis on specimens which were deposited with various bias voltages. Then BN thin film was deposited with this optimum condition and its phase, morphology, chemical composition, and refractive index were compared with those of BN film which was deposited without bias voltage. FTIR results showed that BN films deposited with substrate bias voltage were composed of mixed phases of c-BN and h-BN, while those deposited without bias voltage were h-BN only. When pure Ar gas was used for sputtering gas, BN films were delaminated easily from substrate in air, while when 10% $N_2$ gas was added to the sputtering gas, although c-BN specific infrared peak was reduced, delamination did not occur. GXRD and TEM results showed that BN films were amorphous phases regardless of substrate bias voltage, and AES results showed that the chemical compositions of B/N were about 1.7~1.8. The refractive index of BN film deposited with bias voltage was higher than that without bias voltage. The reason is believed to be the existence of c-BN bonding in BN film and the higher density of film that deposited with the substrate bias voltage.