• The korean journal of orthodontics
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• v.43 no.3
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• pp.141-146
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• 2013

Objective: Bonding forces of brackets to enamel surfaces may be affected by the procedures used for bleaching and enamel etching. The aim of this study was to investigate the bonding strength of orthodontic brackets to laser-etched surfaces of bleached teeth. Methods: In a nonbleached control group, acid etching (group A) or Er:YAG laser application (group B) was performed prior to bracket bonding (n = 13 in each group). Similar surface treatments were performed at 1 day (groups C and D; n = 13 in each subgroup) or at 3 weeks (groups E and F; n = 13 in each subgroup) after 38% hydrogen peroxide bleaching in another set of teeth. The specimens were debonded after thermocycling. Results: Laser etching of bleached teeth resulted in clinically unacceptable low bonding strength. In the case of acid-etched teeth, waiting for 3 weeks before attachment of brackets to the bleached surfaces resulted in similar, but not identical, bond strength values as those obtained with nonbleached surfaces. However, in the laser-etched groups, the bonding strength after 3 weeks was the same as that for the nonbleached group. Conclusions: When teeth bleached with 38% hydrogen peroxide are meant to be bonded immediately, acid etching is preferable.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.257-262
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• 2005

In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

• Journal of Welding and Joining
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• v.19 no.1
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• pp.82-87
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• 2001

The creep-rupture and low cycle fatigue properties of transient liquid phase bonded joints of Ni-base single crystal superalloy, CMSX-2 was investigated using MBF-80 insert metal. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. CMSX-2 was bonded at 1523K for 1.8ks in vacuum, optimum bonding condition. The creep rupture strength and rupture lives of the joints were the almost identical to ones of the base metal. SEM observation of the fracture surfaces of joints after creep rupture test revealed that the fracture surfaces classified three types of region, ductile fracture surface, cleavage fracture surface and interfacial fracture surface. The low cycle fatigue properties of the joints were also the same level as those of base metal. The elongation and reduction of area values of joints were comparable to those of base metal while fell down on creep rupture condition of high temperature.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.33-38
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• 2004

In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

• Journal of Powder Materials
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• v.8 no.1
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• pp.20-25
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• 2001

Most of mold manufacturing procedures have been automated by the introduction of NC machine tool and CAD/CAM system. But the three-dimensional surface curvature of the mold must be done by hand work of well-skilled workers. Magnetic abrasive polishing powders were investigated for surface polishing for 3D curvature. This study aims to investigate homogeneously distributed hard phase in Fe matrix and strong bonding between Fe-matrix and hard phase. The NbC powder, $B_4C$ powder and $Al_2O_3$ powder were mixed in Fe-matrix respectively. Mixed Fe-hard phase powders were compacted by press and then these were melted by plasma melting. According to SEM, XRD and OM observation, Fe-NbC magnetic abrsive powder had the most homogeneous distribution and strong bonding. As a result of magnetic polishing, the surface roughness before magnetic polishing, 1 ${\mu}m$ $R_{max}$, was reduced to 0.2 ${\mu}m$ $R_{max}$ over the entire inner surface of the tube.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.47-51
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• 2013

Chemical mechanical polishing (CMP) has become one of the key processes in wafer level stacking technology for 3D stacked IC. In this study, two-step CMP process was proposed to polish $Cu/SiO_2$ hybrid bonding surface, that is, Cu CMP was followed by $SiO_2$ CMP to minimize Cu dishing. As a result, Cu dishing was reduced down to $100{\sim}200{\AA}$ after $SiO_2$ CMP and surface roughness was also improved. The bonding interface showed no noticeable dishing or interface line, implying high bonding strength.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.171-176
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• 2021

Die-to-wafer (D2W) hybrid bonding in the multilayer semiconductor manufacturing process is one of wafer direct bonding, and various studies are being conducted around the world. A noteworthy point in the current die-to-wafer process is that a lot of voids occur on the bonding surface of the die during bonding. In this study, as a suggested method for removing voids generated during the D2W hybrid bonding process, a flexible mechanism for implementing convex for die bonding to be applied to the bond head is proposed. In addition, modeling of flexible mechanisms, analysis/design/control/evaluation of static/dynamics properties are performed. The proposed system was controlled by capacitive sensor (lion precision, CPL 290), piezo actuator (P-888,91), and dSpace. This flexure mechanism implemented a working range of 200 ㎛, resolution(3σ) of 7.276nm, Inposition(3σ) of 3.503nm, settling time(2%) of 500.133ms by applying a reverse bridge type mechanism and leaf spring guide, and at the same time realized a maximum step difference of 6 ㎛ between die edge and center. The results of this study are applied to the D2W hybrid bonding process and are expected to bring about an effect of increasing semiconductor yield through void removal. In addition, it is expected that it can be utilized as a system that meets the convex variable amount required for each device by adjusting the elongation amount of the piezo actuator coupled to the flexible mechanism in a precise unit.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.549-555
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• 1996

Diamond Like Carbon film is amorphous film which is considered to consist of three coordinate graphite structure and tetrahedron coordinate diamond structure. Its hardness, thermal conductivity and chemical stability are nearly to one of diamond. It is well known to become semi-conductor by doping of inpurity. In this study Diamond Like Carbon film was synthesized by Microwave Plasma CVD in the gas mixture of hydrogen-methan-nitrogen and doped of nitrogen on the single-crystal silicon or silica glass. The temperature of substrate and nitrogen concentration in the gas mixture had an effect on the bonding state, structural properties and conduction mechanism. The surface morphology was observed by Scanning Electron Microscope. The strucure was analyzed by laser Raman spectrometry. The bonding state was evaluated by electron spectroscopy. Diamond Like Carbon film synthesized was amorphous carbon containing the $sp^2$ and $sp^3$ carbon cluster. The number of $sp^2$ bonding increased as nitrogen concentration increased from 0 to 40 vol% in the feed gas at 1233K substrate temperature and at $7.4\times10^3$ Pa. Increase of nitrogen concentration made Diamond Like Carbon to be amorphous and the doze of nitragen could be controlled by nitrogen concentration of feed gas.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.11
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• pp.102-108
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• 2020

The demand for lightweight materials and high-strength steel has rapidly increased to help reduce the weight of a vehicle body; it improves the fuel efficiency of automobiles and provides passenger safety. Additionally, as the material becomes thinner, the demand for its resistance against corrosion becomes higher. Hence, the application of the surface-treated steel sheet has surged rapidly. In this study, a weld bonding experiment using a delta spot welding machine is performed on a thin sheet of a different material (Al6061-T6/GA440). The thickness of the material was kept at 1 mm to reduce the weight of the automobile body parts. Additionally, the purpose of this study is to control the heat input by applying the welding conditions of a multi-stage pressure pattern to improve corrosion resistance shear strength. The analysis of nugget diameter measurement, shear tensile test, and salt spray test was performed to achieve the aim.

• The Journal of the Korean dental association
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• v.42 no.2 s.417
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• pp.94-100
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• 2004