• The Journal of Advanced Prosthodontics
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• v.4 no.3
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• pp.121-126
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• 2012

PURPOSE. The aim of the study was to evaluate the effect of 3 silicone primers and 3 surface characterization of acrylic resin surface on bond strength between silicone elastomer and acrylic resin. MATERIALS AND METHODS. 96 Cosmesil silicones bonded to heat-curing acrylic resin were fabricated with the dimension of $75{\times}10{\times}3$ mm. The 3 primers used in this study were G611 platinum primer, A-330 Gold platinum primer, and cyanoacrylates resin. Specimens without primer were used as control. The 3 types of surface characterization done were retentive holes with 1.5 mm in diameter and 0.5 mm deep, retentive beads of 0.6 mm diameter and the third type which was plain without any characterization. The specimens were then checked for bond strength by subjecting them to $180^{\circ}$ peel test on a universal testing machine. The obtained results were then subjected to statistical analysis using 2-way ANOVA and Scheff$\acute{e}$ multiple post hoc procedures. The statistical significance was set at 5% level of significance. RESULTS. The maximum bond strength was seen for samples in which A-330G primer was used followed by G611 primer. The control group showed the minimum bond strength. Surface characterization of retentive holes increased the bond strength considerably as compared to retentive beads and samples without any surface characterization. CONCLUSION. Within the limitations of the study, A-330G primer was more compatible with Cosmesil M511 silicone and has better bonding of Cosmesil to acrylic resin. Retentive holes made on acrylic surface increased the bond strength considerably than those without any surface characterization.

• Restorative Dentistry and Endodontics
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• v.7 no.1
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• pp.77-83
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• 1981

The purpose of this study was to observe the bonding strength between tooth surface (enamel and dentin) and restorative filling materials which are two composite resins (Clearfil and Concise) and Glass ionomer cement, after etching with 50% phoshoric acid and 37% citric acid. To measure the bonding strength in enamel, the labial surface of upper anterior tooth was cut flatly with using carborundum disk and polished with sand paper disk, and to measure in dentin, the dentin surface was prepared by grinding upper part of posterior tooth horizontally. After washing the tooth surface with water and drying with air blast, the prepared tooth surface was etched. In glass ionomer cement, 50% phosphoric acid and 37% citric acid were used, in Clearfil 40% phosphoric acid was used and in Concise, 50% phosphoric acid and 37% citric acid were used as etchant for 1 minute. After the copper band which is 5 mm in diameter and 5 mm in height was fixed on the prepared surface and each filling material was inserted into the copper band, the hooking loop was inserted into filled material in the copper band before setting to make it easily that the load is applied on the specimen. After all specimens were immersed in water at $37^{\circ}C$ for 1 week, this specimen was placed on the load cell of tensile test apparatus, and specimen was pulled at the cross-head speed of 0.8 mm per minute. The following results were obtained 1) In glass ionomer cement, the bond strength obtained by 37% citric acid was higher than one obtained by 50% phosphoric acid in enamel and dentin surfaces. The bond strength obtained in non-etched surface was much less than one by etchants in enamel and dentin surface. 2) In Clearfil, the bond strength obtained by 40% phosphoric acid was 4 times more than one obtained by non etch ant. 3) In Concise, the bond strength obtained by 50% phosphoric acid was almost same as one obtained by 37% citric acid, and the bond strength obtained by non etch ant was much less than one obtained by etchants.

• The Journal of Korean Academy of Prosthodontics
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• v.38 no.1
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• pp.108-115
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• 2000

This study was designed to compare the effect of polishing on surface roughness of composite resin. We used Z100(3M) composite resin and placed the composite resin in the hole (4mm thick and 4mm in diameter) of vinyl plate and polymerized it under manufacturer's instructions. Samples were divided into 5 groups by polishing methods. Group 1 was control: resin was polymerized under glass plate, Group 2: resin was polymerized without any polishing procedure, Group 3: resin was polymerized with a polishing procedure of abrasive disc, Group 4: bonding agent was applyed in thin layer and polymerized on the polished polymerized resin surface. Group 5: resin was polymerized under transparent celluloid strip. The surface roughness of each specimen was measured with Sufacoder SEF-30D (Kosaka lab. Ltd) under 0.08mm cut off, 0.05mm/s stylus speed, ${\times}40$ horizontal magnification, ${\times}5000$ vertical magnification. The results were as follows : 1. Group 1 showed the most smooth surface in this study. 2. Group 3 showed more rough surface than Group 2. Considering the surface roughness, it would be better to make the shape completely before polymerize the resin. To finish and polish after the polymerization of resin makes less smooth surface. 3. When we use the transparent celluloid strip, minimum finishing procedures are recommended. Any polishing procedure could not recover the smooth resin surface of celluloid strip. 4. Application and polymerization of the thin layer of bonding agent on the polished surface showed the minimum surface smoothing effect.

• 대한치과보철학회:학술대회논문집
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• 2002.11a
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• pp.44-44
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• 2002

• Journal of Sensor Science and Technology
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• v.8 no.1
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• pp.89-94
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• 1999

In this study, a new technology to bond the PZT with connection board, which is a core technology for the fabrication of medical micro high frequency sensors, was developed. Two technologies were adopted. One is bonding of In using thermal heating, he other is bonding of Pb using a high frequency heating machine. In case of thermal eating, bonding was failed because of the contaminations of In surface. But, when using high frequency healing machine, we developed good bonding characteristics at various experimental conditions and thickness of the electrode material.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.125-133
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• 1995

Rene80 superalloy was liquid phase diffusion bonded by using pure boron (B) as an insert material. As a basic study for the possibility of practical application of this bonding method, hardness and high temperature tensile strength of the bonded joint and metallurgical analysis were investigated. As experimental results, hardness of the bonded joint was homogenized after bonding and the tensile strength at 1144K was obtained to 90% of that of base metal. But there were some problems to be improved also, that means the joint was hardened after bonding due to increase of B content and elongation was much lower than that of base metal. Flat area and (Mo, Cr, W) boride, which should be harmful for bonding strength, were observed on the fractured surface of the tensile tested specimen.

• Journal of Technologic Dentistry
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• v.24 no.1
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• pp.65-71
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• 2002

This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker's hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

• Journal of Welding and Joining
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• v.15 no.6
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• pp.32-40
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• 1997

Solid state diffusion bonding is the joining process performed by creep and diffusion, which is accelerated by heating below melting temperature and proper pressing, in vacuum or shielding gas atmosphere. By this process we can obtain sufficient joint which can't be expected from the fusion welding. For Ti-6Al-4V alloy, the optimum solid state diffusion bonding condition and mechanical properties of the joint were found, and micro void morphology at bond interface was observed by SEM. The results of tensile test showed sufficient joint, whose mechanical properties are similar to that of base metal. 850$^{\circ}$C, 3MPa is considered as the optimum bonding condition. Void morphology at interface is long and flat at the initial stage. As the percentage of bonded area increases, however, small and round voids are found. Variation of void shape can be explained as follows. As for the void shrinkage mechanism, at the initial stage, power law creep is the dominant, but diffusion mechanism is dominant when the percentage of bonded area is increased.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.393-395
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• 2005

The bonding for Aluminum and Copper in the air is investigated in this study. This bonding method does not include the special process of removing aluminum oxide films. In case of this bending, each metal Is heated at bonding temperature where is above eutectic temperature of Al-Cu system and below melting point of Aluminum. The liquefaction around the bonding surface occurs after the diffusion at solid state of each metal. This phenomenon is predicted by the temperature range above eutectic temperature of Al-Cu equilibrium phase diagram.