• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1879-1884
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• 2014

Recently, the micro bonding technology comes into the spotlight as the miniaturization of the electronic product. The micro bonding technique can classify by way of laser welding and ultrasonic bonding and etc. However, the research on the micro bonding is much lacks. In this paper, carried out the cooling analysis of the 60 [kHz] ultrasonic bonding equipment to know heat effect of the piezoelectric element when the ultrasonic bonding equipment was operated. The ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the 60 [kHz] ultrasonic bonding equipment was done. We carried out the bonding for improving bonding strength to using the silver paste. air thightness of bonding surface was confirmed by analysis of bonding interfaces.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.1014-1018
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• 2005

The purpose of this study is to obtain strong bond strength at the interface between piezoelectric substrates and semiconductor thin films to be applied for the manufacture of high-performance acoustic wave semiconductor coupled device. For this purpose, we have compared and examined the effects of different surface treatment methods on hydrophile properties at the surface of the piezoelectric substrates. Moreover, we have observed the effect of microwave and laser on the elimination of water molecules at the interface. As for the piezoelectric substrates, dry method for surface treatment was found to be superior in the control of hydrophilicity of the surface compared to wet method. On the other hand, both microwave and laser were found to be effective in the elimination of water molecules in the interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.173-176
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• 2000

In this paper, we investigated the surface degradation of HTV silicone rubber used for a polymeric insulator by UV irradiation. To study the surface ageing properties by W irradiation, we used the corona discharge charging and contact angle. Therefore, we observed the change of surface charge retention and decrease of surface hydrophobicity. Also, we discussed the chemical change in the surface range using the analytic equipment such as SEM, ATR-FTIR, ESCA. Therefore, it is found that the scissor of characteristic bonding and the reattachment of oxidant bonding was developed by UV rays radiation. As discussing the corona ischarge charging and the change of contact angle, it is found the effect of UV irradiation and the mechanism of chemical reaction

• Journal of Technologic Dentistry
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• v.29 no.2
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• pp.141-150
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• 2007

The purpose of this study was to ascertain the bonding durability of self-etching dentin bonding agents to dentin by means of shear bonding strength. Several acid-etching dentin bonding system (ESPE Z100) and self-etching dentin bonding systems (DEN-FIL, GRADIA DIRET) were used. The occlusion surface of human molars were ground flat to expose dentin and treated with the etch bonding system according to manufactures instruction and followed by composite resin application. After 24hours of storage at 37$^{\circ}C$, the shear bonding strength of the specimens was measured in a universal testing machine with a 1mm/min crosshead speed. An one-way analysis of variance and the scheffe test were performed to identify significant differences (p<0.05). The bonded interfacial surfaces and treated dentin surfaces were examined using a SEM. Through the analysis of shear bond strength data and micro-structures of dentin-resin interfaces, following results are obtained. In dentin group, the shear bond strength of DEN-FIL showed statistical superiority in comparison to the other groups and followed by ESPE Z100 and GRADIA DIRECT (p<0.05).

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Journal of Biomedical Engineering Research
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• v.16 no.4
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• pp.533-542
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• 1995

The present study investigated the effectiveness of pretreatment on dentin bonding. The adhesive resin was 5% 4-methacryloyloxyethyl trimellitate anhydride (4-META) in methyl methacrylate (MMA) combined with poly-MMA powder. Polymerization of this resin was initiated by tri-n-butyl borage (TBB). Ground bovine dentin samples were etched with either an aqueous solution of 10% citric (10-0 solution) (Group I) or aqueous solution of 10% citric acid and 3% ferric chloride(10-3 solution) (Group ll ). After etching, the primer (an aqueous solution of 35% hydroxyethyl methacrylate (HEM- A) and 5% glutaraldehyde was applied on the differently etched surfaces (Group III , Group IV). The 10-0 treatment showed the lowest tensile bond strength, followed by the 10-3 treatment, primer application after the 10-0 treatment and primer application after the 10-3 treatment. The relationship among the surface morphology after pretreatment, fractured surface morphology and tensile bond strength was examined. It revealed that the surface morphology change by different pretreatment influenced the bond strength and the resulting fractured surface morphology. The correlation of tensile bond strength with the fracture morphology was explained.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.9-15
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• 2008

Mokumegane is one of the sophisticated metal craft techniques enabling wood grain surface effect. To embody the mokumegane, an ingot of well-bonded stacked metal plates has been required. Traditionally prepared mokumegane ingots were bonded using charcoal which enables reduction atmosphere, but sometimes end up with collapse of bonding interface due to the lack of reliable process control. We proposed a systematic vacuum direct bonding process for ingots. First, we confirmed copper//copper homogeneous plate bonding at $900^{\circ}C$ by applying uniaxial press of 2.5kg. We observed 80min required to obtain 90%-bonding ratio and the diffusion coefficient would be enhanced up to 100 times due to surface effect. Second, by considering enhanced diffusion behavior, we also obtained optimum bonding condition in copper/silver heterogeneous plates that ensures 90%-bonding ratio at $700^{\circ}C$ for 10min with apply uniaxial press. A 7-layered copper/silver ingot is prepared successfully, and eventually the prototype mokumegane cases for mobile phone were fabricated with these ingot.

• Journal of the Korea Institute of Building Construction
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• v.15 no.1
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• pp.9-16
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• 2015

The goal of this research was evaluating and suggesting the solution of preventing carbonation of concrete replaced high-volume of slag. The concrete mixtures were prepared with high-volume slag and recycled aggregate, and the concrete samples were evaluated the carbonation depth with various surface treatment methods. For various surface treatment methods and surface protecting sheets, bonding strength and carbonation depth were measured. Basically, from the results, the carbonation of concrete was completely prevented with any type of surface treatment method and surface protecting sheet as far as the surface treatment materials were remained. Therefore, in this research, it was known and suggested that the easiness of handling and sufficient bonding performance was much important than the quality of surface protecting sheets.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.42 no.2
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• pp.41-45
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• 2010

This study was performed to evaluate the effect of paper property changes by internal addition of surface strength agent on printability. Advances in printing technique has required the development of paper qualities in many aspects. Basically paper structure is composed of hydrogen bonds which induce many problems in high speed printing machine because of weak bonding strength. One of the important printing problems is surface picking when mechanical pulp or recycled pulp are used. It was caused by the ink-stained blanket in printing process because accumulations of pollutant in white water and other elements which are bonded weakly or do not have hydrogen bonds. Debris at paper surface adheres to blanket which deteriorates printing efficiency and causes various problems. To complement these problems, Pennocel 5137 of polysaccharide structure was used as an agent to improve paper's surface property, strength and printability. Paper surface picking was analyzed by RI-1 test. As the dosage amount increased tensile strength, fiber bonding strength and ZDT strength were improved. Further more formation, smoothness and surface picking resistance were improved. It was confirmed that when adding polysaccharide structure polymers to improve surface strength such as surface picking resistance, it was also possible to improve tensile strength, fiber bonding strength, formation and smoothness.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.253-255
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• 2002

Since a butt Joint is smaller than a lap type joint, it is expected to have smaller AC losses. The butt joint is produced by the diffusion bonding of the contacting surface under pressured and heated condition. It is important to find robust joining conditions, because butt joint has small contact area and has the shape by which the quality of bonding is hard to be checked. In this research, the loading pressure is considered as the joining parameter to find optimum joining condition. The DC resistance of the joint may be changed by the surface pressure during joining process, because the superconducting strands near the contact surface are failed by large plastic deformation. The range from 10 MPa to 18 MPa is expected optimum surface pressure in the conditions of 1 hour heating time and $750^{\circ}C$ temperature in the vacuum furnace.