• Journal of Powder Materials
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• v.27 no.1
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• pp.25-30
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• 2020

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m^-1K^-1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10^-6 to 3.06 × 10^-6K^-1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

• Journal of Powder Materials
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• v.21 no.5
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• pp.360-365
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• 2014

$SnO_2-CoO$/carbon-coated CoO core/shell nanowire composites were synthesized by using electrospinning and hydrothermal methods. In order to obtain $SnO_2-CoO$/carbon-coated CoO core/shell nanowire composites, $SnO_2-Co_3O_4$ nanowire composites and $SnO_2-Co_3O_4$/polygonal $Co_3O_4$ core/shell nanowire composites are also synthesized. To demonstrate their structural, chemical bonding, and morphological properties, field-emission scanning electron microscopy, transmission electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were carried out. These results indicated that the morphologies and structures of the samples were changed from $SnO_2-Co_3O_4$ nanowires having cylindrical structures to $SnO_2-Co_3O_4/Co_3O_4$ core/shell nanowires having polygonal structures after a hydrothermal process. At last, $SnO_2-CoO$/carbon-coated CoO core/shell nanowire composites having irregular and high surface area are formed after carbon coating using a polypyrrole (PPy). Also, there occur phases transformation of cobalt phases from $Co_3O_4$ to CoO during carbon coating using a PPy under a argon atmosphere.

• Journal of the Korean Wood Science and Technology
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• v.41 no.1
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• pp.33-41
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• 2013

This study was performed to analyse cause of quality deterioration using byproduct of plywood and to determine physical and mechanical properties of particleboard used new bonding condition we found. The result of bending strength of Com-Ply board using EMDI is 57.7 $N/mm^2$ on linear direction and 25.1 $N/mm^2$ on vertical direction. EMDI has better water-resisting qualities than Urea formaldehyde adhesive according to result of thickness swelling and water absorption test. Pre-treatment soaked particle 72 hours in water caused increase of HCHO emission.

• Journal of Environmental Science International
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• v.6 no.1
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• pp.75-88
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• 1997

The rates of photodegradation, reactivities, and mechanisms of photooxidation for the aqueous solution containing with halogen derivatives of aliphatic hydrocarbons have been discussed with respect to the kinds of photocatalysts, concentration of photocatalytlc suspensions, strength of radiant power, time of illumination, changes of pH of substrate solution, wavelength of radiation, and pressure of oxygen gas saturated In the solution. These aqueous solutions suspended with 0.5 $gL^{-1}$ $TiO_2$ powder have been photodecomposed in the range of 100 and 93.8% per 1 hour if it is illuminated with wavelength (λ $\geq$ 300nm) produced from Xe-lamp(450W). The photocatalytic abilities have been increased In the order of $Fe_2O_3$ < CdS < $CeO_2$ < Y_2O_3$ <$TiO_2$, and rates of photodegradation for the solution have maldmum values in the condition of pH 6 ~ 8 and 3 psi-$O_2$ gL^{-1}$. These rates for the Photoolddation Per 1 hour were dependent on the size of molecular weight and chemical bonding for organic halogen compounds and the rates of photodegadation were increased in the order of $C_2H_5Br$ < CH_2Br_2$ < C_5H_11Cl C_2H_4Cl_2$ < tracts-$C_2H_2Cl_2$ < cis-C_2H_2Cl_2$ The T_{1/2}$ and t99% for these solutions were 5~21 and 40~90 minutes. respectively, and these values were coincided with Initial reaction kinetics(ro). It was found that reaction of photodegradation has the pseudo first-order kinetics controlled by the amount of $h^+_{VB}$ diffused from a surface of photocatalysts.

• Journal of Technologic Dentistry
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• v.23 no.2
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• pp.161-170
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• 2002

The Purpose of this study was to investigate the chemically improvement of metal-ceramics bond strength in the course of recasting Ni-Cr metal composite system with 10wt.%, 20wt.% and 30wt.% aluminum respectively. We have tested the bond strength, micro-structure, chemical composition of each metal composites and metal- ceramic bond interfaces by 3-point bending strength tester, SEM and EDS. We have made the conclusions through this study as follow: 1. The most suitable amount of aluminum to the Ni-Cr metal composite recasting is 20wt. % for improving metal-ceramics bond strength with debonding strength value of 49.54 kgf/mm2. 2. The aluminum must be changed to small spread alumina like phases and second aluminum-metal composites phases in the morphology of Ni-Cr metal composite system by adding during it's casting. These second phases have inclined functional oxide phases mixed with metal elements and they must take roll to improvement of metal-ceramics bond strength. 3. In the case of 30wt.% aluminum appended to Ni-Cr metal composite system, an excess of second inclined functional oxide phases produce cracks and spalling of them apart from it's base material. It must be a important factor of reduction of metal-ceramics bond strength.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06a
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• pp.5-18
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• 1996

The solid state cesium ion source os alumino-silicate based zeolite which contains cerium. The material is an ionic conductor. Cesiums are stably stored in the material and one can extract the cesiums by applying electric field across the electrolyte. Cesium ion bombardment has the unique property of producing high negative ion yield. This ion source is used as the primary source for the production of a negative ion without any gas discharge or the need for a carrier gas. The deposition of materials as an ionic species in the energy range of 1.0 to 300eV is recently recognized as a very promising new thin film technique. This energetic non-thermal equilibrium deposition process produces films by “Kinetic Bonding / Energetic Condensation" mechansim not governed by the common place thermo-mechanical reaction. Under these highly non-equilibrium conditions meta-stable materials are realized and the negative ion is considered to be an optimum paeticle or tool for the purpose. This process differs fundamentally from the conventional ion beam assisted deposition (IBAD) technique such that the ion beam energy transfer to the deposition process is directly coupled the process. Since cesium ion beam sputter deposition process is forming materials with high kinetic energy of metal ion beams, the process provider following unique advantages:(1) to synthesize non thermal-equilibrium materials, (2) to form materials at lower processing temperature than used for conventional chemical of physical vapor deposition, (3) to deposit very uniform, dense, and good adhesive films (4) to make higher doposition rate, (5) to control the ion flux and ion energy independently. Solid state cesium ion beam sputter deposition system has been developed. This source is capable of producing variety of metal ion beams such as C, Si, W, Ta, Mo, Al, Au, Ag, Cr etc. Using this deposition system, several researches have been performed. (1) To produce superior quality amorphous diamond films (2) to produce carbon nitirde hard coatings(Carbon nitride is a new material whose hardness is comparable to the diamond and also has a very high thermal stability.) (3) to produce cesiated amorphous diamond thin film coated Si surface exhibiting negative electron affinity characteristics. In this presentation, the principles of solid state cesium ion beam sputter deposition and several applications of negative metal ion source will be introduced.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.5
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• pp.227-231
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• 2005

We have developed a microsystem with a capillary electrophoresis (CE) and an electrochemical detector (ECD). The microfabricated CE-ECD systems are adequate for a disposable type and the characteristics are optimized for an application to the electrochemical detection. The system was realized with polydimethylsiloxane (PDMS)-glass chip and indium tin oxide electrode. The injection and separation channels (80 um wide$\ast$40 um deep) were produced by moulding a PDMS against a microfabricated master with relatively simple and inexpensive methods. A CE-ECD systems were fabricated on the same substrate with the same fabrication procedure. The surface of PDMS layer and ITO-coated glass layer was treated with UV-Ozone to improve bonding strength and to enhance the effect of electroosmotic flow. For comparing the performance of the ITO electrodes with the gold electrodes, gold electrode microchip was fabricated with the same dimension. The running buffer was prepared by 10 mM 2-(N-morpholino)ethanesulfonic acid (MES) titrated to PH 6.5 using 0.1 N NaOH. We measured olectropherograms for the testing analytes consisted of catechol and dopamine with the different concentrations of 1 mM and 0.1 mM, respectively. The measured current peaks of dopamine and catechol are proportional to their concentrations. For comparing the performance of the ITO electrodes with the gold electrodes, electropherograms was measured for CE-ECD device with gold electrodes under the same conditions. Except for the base current level, the performances including sensitivity, stability, and resolution of CE-ECD microchip with ITO electrode are almost the same compared with gold electrode CE-ECD device. The disposable CE/ECD system showed similar results with the previously reported expensive system in the limit of detection and peak skew. When we are using disposable microchips, it is possible to avoid polishing electrode and reconditioning.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.8-13
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• 2006

Recent RF SAW filters are made using a HTCC package with a CSP(chip scale Package) technology. This paper describes a development of a new $1.4{\times}1.1\;and\;2.0{\times}1.4mm$ RF SAW liters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.

• The Journal of Korean Academy of Prosthodontics
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• v.39 no.4
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• pp.417-432
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• 2001

The pcf metal primers on the bond strength and durability of 4-META/MMA-TBB resins adhered to an Au-Ag-Pd alloy. For this study, the specimens were divided into 8 groups as follows: Thermocyle 0 : (1) control group : sandblast, (2) Group I : sandblast + Cesead Opaque Primer; (3) Group II : sandblast + Metal Primer; (4) Group III : sandblast + V-Primer; Thermocyle 10,000 (5) control sandblast: (6) Group I : sandblast + Cesead Opaque Primer: (7) Group II : sandblast + Metal Primer; (8) Group III sandblast + V-Primer. The shear bond strength was determined using an Instron were observed with the use of scanning electron microscope. Finally, the strengths of bonded joints were evaluated with regard to their adherence energy using a wedge test. The results obtained were as follows ; (1) The shear bond strength of 4-META/MMA-TBB resin to the Au-Ag-Pd alloy was significantly improved in all the groups treated with the primers (p<0.05). (2) Regardless of the adhesive primers used, a significant difference was observed in the bond strength of the thermocycle 0 groups and 10,000 groups (p<0.05). (3) Both before and after thermocycling, the strongest bond strength between the resin an the alloy was obtained after treatment with a metal primer containing MEPS (p<0.05). (4) In the wedge test, the adherence energies of the control group and Group III decreased more rapidly than those of Group I and II during the 2nd day of storage in water.

• Composites Research
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• v.30 no.3
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• pp.215-222
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• 2017

The effect of a multi walled carbon nanotubes (MWNCT) on the adhesive properties and thermal properties of epoxy were studied by double lap-shear tests. Epoxy/MWCNT resins were prepared from a different amount of the MWCNT incorporated into the epoxy resins (araldite 2011). Steel plates and carbon fiber reinforced plastics (CFRP) were chosen as materials. Mechanical tests were performed by a universal testing machine (UTM). The analysis of thermal properties were conducted by a thermogravimetric analyzer (TGA) and a differential scanning calorimetry (DSC). The fracture surface morphology was examined using a scanning electron microscopy (SEM) and optical microscope. Compared to neat epoxy, it was found that the mechanical properties of epoxy/MWCNT resins are increased.