A Study on the Surface Patterns and Bonding Characteristics of Exposed Materials based on Wheel Grit Size during Package Grinding (패키지 연삭 시 휠 입도에 따른 노출된 가공물의 표면 양상과 접합 특성 연구)
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- Journal of the Microelectronics and Packaging Society
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- v.31 no.3
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- pp.72-79
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- 2024