• 연구논문집
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• s.24
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• pp.63-79
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• 1994

This article reports a experimental study of the method to achieve a bond joint at lower temperature in a short time. DC magnetron sputtering of Sn, Sn/Pb, Sn/In and Sn/Cu on copper substrate was provided as an interlayer for Cu to Cu bonding under the air environment. Various examination was conducted and investigated on the effect of experimental parameters such as coating materials, coating time(or coating thickness), bonding temperature and bonding time etc. Bonding was performed at the temperature of $210^\circC-320^\circC$ for 0sec and interfacial reaction between the coated layer and copper substrate was examined using optical, scanning electron microscope and x-ray diffractometer. From the obtained results, it was found that intermetallic compounds layer consisted of $\eta-phase(Cu_6Sn_5)$ and $\beta-phase(Cu_3Sn)$ was formed at the joint interface for almost all coating materials. But the dominant phase formed in the preetched Cu substrate coated with Sn was $\beta-phase$. A characteristic morphology looks like a reaction ring, which was believed as the strong interconnecting regions between two substrates, was found to be formed on the reaction surface of copper substrates. The morphologies and compositions of the intermetallics, which depends on the regions of the reaction surface, was appeared as greatly different. Based on above results, the new bonding process to make the joint at lower temperature for short time can be admitted as a feasible process.

• Advances in materials Research
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• v.9 no.2
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• pp.99-107
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• 2020

Reinforced aluminum alloy base composites have become increasingly popular for engineering applications, since they usually possess several desirable properties. Recently, Warm Accumulative Roll Bonding (WARB) process has been used as a new novel process to fabricate particle reinforced metal matrix composites. In the present study, TiO₂ particles are used as reinforcement in aluminum metal matrix composites fabricated through warm accumulative roll bonding process. Firstly, the raw aluminum alloy 1060 strips with TiO₂ as reinforcement particle were roll bonded to four accumulative rolling cycles by preheating for 5 min at 300℃before each cycle. The mechanical and bonding properties of composites have been studied versus different volume contents of TiO₂ particles by tensile test, peeling test and vickers micro-hardness test. Moreover, the fracture surface and peeling surface of samples after the tensile test and peeling test have been studied versus different amount of TiO₂ volume contents by scanning electron microscopy. The results indicated that the strength and the average vickers micro-hardness of composites improved by increasing the volume content of TiO₂ particles and the amount of their elongation and bonding strength decreased significantly.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.10
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• pp.859-864
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• 2003

We prepared SOI(silicon-on-insulator) wafer pairs of Si II SiO$_2$/Si$_3$N$_4$ II Si using wafer direct bonding with an electric furnace annealing(EFA), a fast linear annealing(FLA), and a rapid thermal annealing(RTA), respectively, by varying the annealing temperatures at a given annealing process. We measured the bonding area and the bonding strength with processes. EFA and FLA showed almost identical bonding area and theoretical bonding strength at the elevated temperature. RTA was not bonded at all due to warpage, We report that FLA process was superior to other annealing processes in aspects of surface temperature, annealing time, and bonding strength.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.9
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• pp.672-675
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• 1999

Si-to-Si electrostatic bonding was carried out by employing LSG interlayer instead of conventional Corning #7740 interlayer in order to improve bonding properties. The surface roughness and dielectric breakdown field of the LSG interlayers deposited on Si substrates were investigated. Also, the bonding interface, bonding strength and bonding mechanism were discussed for the electrostatically-bonded Si-Si wafer pairs having LSG interlayers.

• Transactions of Materials Processing
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• v.20 no.1
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• pp.64-72
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• 2011

In this study, we have investigated bonding of metal and plastic parts with single planar interface. This is facilitated by surface processing of aluminum sheet, which consists of slitting and punching, followed by insert-molding of polybuthylelne terephthalate(PBT). An injection mold has been built to fabricate specimen. After processing of the specimen, tensile and bending shear adhesion tests have been fulfilled according to KS M3734 and KS M3723, respectively. We also have conducted simulation of tensile and bending shear adhesion tests. Based on the tests results, the proposed bonding method outperforms existing methods based on adhesion.

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.221-225
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• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• The korean journal of orthodontics
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• v.17 no.1
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• pp.85-91
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• 1987

The aim of this study was to clarify whether bonding/debonding procedure will affect the occurance of enamel crack. The frequency of enamel crack was compared between before-bonding and after-debonding on 200 human extracted teeth. Each facial surface of the tooth was divided in 9 fragments. A presence of crack, which was classified by its direction as vertical, horizontal and oblique crack, was surveyed in each fragment. Number of all cracks in facial surface was 1355 at before-bonding, and 1605 at after-debonding, so it revealed significant increase rate of $18.5\%$, but compared by fragment, cracks were significantly Increased in OC, OD, CC and GC fragments. All kinds of cracks were significantly increased, especially increase rate of oblique crack reached $54.9\%$. The increase rate of cracks was not superior at any fragment or region, but some evidence was seen in CC fragment. Judging from the above, increase of crack is unavoidable with bonding/debonding procedures.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.215-215
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• 2011

The bonding configuration and adsorption stability of alanine and leucine adsorbed on Ge(100)-2${\times}$1 surface were investigated and compared using core-level photoemission spectroscopy (CLPES) and density functional theory (DFT) calculations. The bonding configuration, stability, and adsorption energies were evaluated for two different coverage levels. In both cases, the C 1s, N 1s, and O 1s core-level spectra at a low coverage (0.30 ML) indicated that the carboxyl and amine groups participated in bonding with the Ge(100) surface in an "O-H dissociated-N dative bonded structure". At high coverage levels (0.60 ML), both this structure and an "O-H dissociation bonded structure" were present. As a result, we found that alanine adsorbs more easily (lower adsorption energy) than leucine on Ge(100) surfaces due to less steric hindrance of side chain.

• Restorative Dentistry and Endodontics
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• v.26 no.4
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• pp.316-325
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• 2001

The purpose of this study was to evaluate the effect of adhesive curing timing on the direction of polymerization shrinkage of light-curing composite resin. In this study, the curing times of adhesive and composite resin were measured by differential scanning calorimeter(DSC). 28 extracted human molars were embedded in clear resin and box-type cavities were prepared. Based on DSC data, the experimental teeth were divided into 4 groups. Group 1: no bond; Group 2: late curing; Group 3: Intermediate curing; Group 4: Early curing. After treating with adhesive, the buccal cavities were filled with Z-100 hybrid composite resin and the lingual ones were filled with AEliteflo flowable composite resin. The depressions at the surface were measured by surface profilometer, then the specimens were embedded in clear resin and sectioned. Impressions were obtained and used to get epoxy resin replicas. The epoxy replicas were gold-coated and observed under SEM. Average Maximum Gap(AMG), Gap Proportion(GP), Average Marginal Index(AMI) were used to compare the shrinkage gap of each group. The results were statistically analyzed using the Kruskal-Wallis One Way ANOVA, Student-Newman-Keuls method. The results of this study were as follows. 1. Average Maximum Gap, Gap Proportion, Average Marginal Index and depression at the surface or Z-100 hybride composite resin were smaller than those of AEliteflo flowable composite resin(P<0.05). 2. When the bonding between composite resin and tooth structure was strong, the shrinkage gap was small, and depression at the surface was deep(P<0.05). 3. In the well-bonded group, light-curing composite resin shrank toward bonded cavity wall, not toward light source. The result suggested that the direction of polymerization shrinkage was affected by the quality of bonding in the dentin-resin interface. The strong was the bonding between composite resin and tooth structure, the smaller was the gap and the deeper was the depression at the surface. Then the flow to compensate the polymerization shrinkage proceeded from surface to bonded cavity wall.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1197-1201
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• 1994

The fracture strength and fracture modes were studied in 3Y-TZP/NiNi bonding which change their interfacial structure with bonding condition. Average 4-point bending strength of 200 MPa to 400 MPa were achieved. The formation of Ti-oxide phase at the interface critically influenced the bonding strength and fracture mode. The fracture surface of Ti-oxide free interface contained multiphase in some case including ZrO2. From the result it was confirmed that in order to maximize the bonding strength crack deflection from interface to ceramic was required.