• The Journal of Korean Academy of Prosthodontics
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• v.42 no.3
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• pp.267-279
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• 2004

A modelling scheme for the stress analysis taking into account load transfer characteristics of the osseointegrated interfaces between dental implant and surrounding alveolar bone was investigated. Main aim was to develop a more realistic simulation methodology for the load transfer at the interfaces than the prefect bonding assumption at the interfaces which might end up the reduced level in the stress result. In the present study, characteristics of osseointegrated bone/implant interfaces was modelled with material nonlinearity assumption. Bones at the interface were given different stiffness properties as functions of stresses. Six different models, i.e. tens0, tens20, tens40, tens60, tens80, and tens100 of which the tensile moduli of the bones forming the bone/implant interfaces were specified from 0, 20, 40, 60, 80, and 100 percents, respectively, of the compressive modulus were analysed. Comparisons between each model were made to study the effect of the tensile load carrying abilities, i.e. the effectivity of load transfer, of interfacial bones on the stress distribution. Results of the present study showed significant differences in the bone stresses across the interfaces. The peak stresses, however, were virtually the same regardless of the difference in the effectivity of load transfer, indicating the conventional linear modelling scheme which assumes perfect bonding at the bone/implant interface can be used without causing significant errors in the stress levels.

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.159-162
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• 1996

• Journal of the Korean Society for Advanced Composite Structures
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• v.6 no.4
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• pp.30-37
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• 2015

iFLASH System is new structural floor system which consists of sandwich panels filled with nano-composite. The nano-composite has low specific gravity and high bonding strength with steel plates. The bonding strength is one of important factors for structural performance of iFLASH System and it can further be improved by surface preparation such as blast metal cleaning. However, using none blast steel plates is recommended since surface preparation generates additional fabrication time and cost. In this study, a bonding strength test and bending experiment were conducted to check feasibility of applying none blast steel plates to iFLASH System. Moreover, stress in bonding plane between steel plates and nano-composite was analytically evaluated by finite element method. Consequently, flexural capacity of the specimen was 11% higher than theoretically calibrated value and its flexural behavior was structurally efficient without defect of bonding.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.6
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• pp.764-769
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• 2014

This paper describes sheath voltage limiter(SVL) transient characteristics by switching overvoltage considering single point bonding in underground transmission cables. The crossbonding system is generally used for grounding methods of underground transmission system. However, the single point bonding system is used in selective area which is difficult to consist of crossbonding major section. The sheath voltage limiters are connected between joints in the single point bonding. Specially, the high overvoltage might be generated in that section as well as the aging of sheath voltage limiter might be progressed by various electrical stress including lightning overvoltage, switching overvoltage and power frequency overvoltage. Therefore, in this paper, the switching overvoltage characteristics in underground cables are firstly analysed using EMTP simulation. Then, the switching overvoltage of sheath voltage limiter is also studied in single point bonding. Finally, the reduction method of sheath voltage limiter switching overvoltage is proposed by various simulation studies including circuit breaker operating order.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.05a
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• pp.69-74
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• 2001

Steel plate or fiber composite plate are mainly used in externally bonding method. Shear strengthening by externally bonding method is to confirm shear safety and to avoid brittle failure. In case of strengthening by externally bonding method, a failure of structure occurs frequently due to delamination between strengthening plate and concrete. Therefore, it is important to consider the delamination in the strengthening design. The objective of this study is to propose a modified shear strength evaluation by considering the delamination. The delamination criteria of strengthening plate is established by the ultimate strain and shear stress. And shear strength of RC beams is proposed in terms of the delamination criteria. The proposed shear strength is compared with test results and verified through the comparison.

• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.1
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• pp.143-150
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• 1998

The evaluation of joint fatigue strength of light weight materials for electrical vehicle body has been performed through single lap joint tests with the design parameters such as joint style, adherend, bonding overlap length and bonding thickness. Fatigue strength was evaluated through 5-Hz, tension-tension, load controlled test with the stress ratio zero value. It is experimentally observed that fatigue strength of joint increases for the increase of overlap length. The combinations of Al-Al and Al-FRP adherends show that fatigue strength of joint is hardly changed for the increase of bonding thickness, but FRP-FRP adherend specimen shows that fatigue strength of joint increases after decreases for the increase of bonding thickness. Al-Al adherend specimen has much higher fatigue length than Al-FRP and FRP-FRP adherend specimens. Riveting at adgesive bonded joint gives little effect on fatigue strength.

• Laser Solutions
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• v.11 no.3
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• pp.10-15
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• 2008

This study is aimed to analyse the laser glass bonding process numerically. Due to the viscoelastic behaviour of glass, the extremely large deformation of the frit seal is resulted continuously over the transition temperature, so that the thermal boundary condition be changed in the entire calculation process. The commercial FEM algorithm is restrictively able to remesh the large geometrical boundary shape and to adapt the boundary conditions simultaneously. According to our manual adaptation of increasing the laser line intensity to 700 mW/mm, it is possible to estimate the thermal glass bonding process under the fracture stress in principle. But it should be studied further in the case of high laser line intensity.

• Journal of the Korean Ceramic Society
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• v.30 no.11
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• pp.949-954
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• 1993

Microstructural development at the ZrO2/NiTi bonding interface and reaction products were examined and identified with SEM and AEM. Ti-oxide, Ti2Ni and Ni2Ti layer were observed whose thickness depends on bonding temperature typically. The development of Ti-oxide layer is related with oxygen ion in ZrO2 and liquid phase Ti2Ni. It is considered that compositional deviation from homogeneity and residual stress caused by thermal expansion mismatch are closely related with the formation of the Ti2Ni phase.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Journal of the Korean GEO-environmental Society
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• v.8 no.3
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• pp.41-49
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• 2007

The typical bonding methods which connect steel pipe pile and spread footing is bolted bonding method using +type cover plate for reinforcing a head of steel pipe pile. In this paper, stability of spread footing in pile foundation have been evaluated by loading test of +type cover plate for reinforcing a head of pile and hook type bonding method. The presents results from a series of pilot model test on vertically loaded piles foundation of bolted bonding method and hook type bonding method, pile foundation is identified to safety due to pile foundation exceed 8.5~21% which more than yield stress of steel pipe pile. As the results of horizontal loading tests, peak load of piles foundation of hook type bonding method has estimated in 41.1tonf and it was exceed about 33% which more than pile foundation of bolted bonding method.