• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.447-450
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• 2001

Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).

• Structural Engineering and Mechanics
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• 제84권6호
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• pp.799-811
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• 2022

Adhesive bonding has seen rapid development in recent years, with emphasis to composite patch repairing processes of geometric defects in aeronautical structures. However, its use is still limited given its low resistance to climatic conditions and requirement of specialized labor to avoid fabrication induced defects, such as air bubbles, cracks, and cavities. This work aims to numerically analyze, by the finite element method, the failure behavior of a damaged plate, in the form of a bonding defect, and repaired by an adhesively bonded composite patch. The position and size of the defect were studied. The results of the numerical analysis clearly showed that the position of the defect in the adhesive layer has a large effect on the value of J-Integral. The reduction in the value of J-Integral is also related to the composite stacking sequence which, according to the mechanical properties of the ply, provides better load transfer from the plate to the repair piece through the adhesive. In addition, the increase in the applied load significantly affects the value of the J-Integral at the crack tip in the presence of a bonding defect, even for small dimensions, by reducing the load transfer.

• 한국재료학회지
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• 제34권3호
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• pp.125-137
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• 2024

Composite laminates are used in a wide range of applications including defense, automotive, aviation and aerospace, marine, wind energy, and recreational sporting goods. These composite beams still exhibit problems such as buckling, local deformations, and interlaminar delamination. To overcome these drawbacks, a novel viscoelastic autoclave bonding with tapered epoxy reinforcement polyurethane films is proposed. In existing laminates, compression face wrinkling and interlaminar delamination is caused in the sandwich beam. The unique viscoelastic autoclave spunbond interlayer bonding is designed to prevent face wrinkling and absorb and distribute stresses induced by external loads, thereby eliminating interlaminar delamination in the sandwich beam. Also, the existing special reinforcement causes stress concentrations, and the core is not effectively connected, which directly affects the stiffness of the beam. To address this, a novel tapered epoxy polyurethane reinforcement adhesive film is proposed, whose reinforcement thickness gradually tapers as it enters the core material. This minimizes stress concentrations at the interface, preventing excessive adhesive squeeze-out during the bonding process, and improves the stiffness of the beam. Results indicate the proposed model avoids the formation of micro cracks, interlaminar delamination, buckling, and local deformations, and effectively improves the stiffness of the beam.

• 마이크로전자및패키징학회지
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• 제17권1호
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• pp.69-73
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• 2010

Through-silicon-via (TSV)를 포함하고 있는 3차원 적층 반도체 패키지에서 구조적 변수에 따른 열응력의 변화를 살펴보기 위하여 유한요소해석을 수행하였다. 이를 통하여 TSV를 포함하고 있는 3차원 적층 반도체 패키지에서 웨이퍼 간 접합부의 지름, TSV 지름, TSV 높이, pitch 변화에 따른 열응력의 변화를 예측하였다. 최대 von Mises 응력은 TSV의 가장 위 부분과 Cu 접합부, Si, underfill 계면에서 나타났다. TSV 지름이 증가할 때, TSV의 가장 위 부분에서의 von Mises 응력은 증가하였다. Cu 접합부 지름이 증가할 때, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. Pitch가 증가할 때에도, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. 한편, TSV 높이는 von Mises 응력에 크게 영향을 미치지 못하였다. 따라서 TSV 지름이 작을수록, 그리고 pitch가 작을수록 기계적 신뢰성은 향상되는 것으로 판단된다.

• Smart Structures and Systems
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• 제22권3호
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• pp.341-358
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• 2018

This present study investigates Love-type wave propagation in composite structure consists of a loosely bonded functionally graded piezoelectric material (FGPM) stratum lying over a functionally graded initially-stressed fibre-reinforced material (FGIFM) substrate. The closed-form expressions of the dispersion relation have been obtained analytically for both the cases of electrically open and electrically short conditions. Some special cases of the problem have also been studied and the obtained results are found in well-agreement with the classical Love wave equation. The emphatic influence of wave number, bonding parameter associated with bonding of stratum with substrate of the composite structure, piezoelectric coefficient as well as dielectric constant of the piezoelectric stratum, horizontal initial stresses, and functional gradedness of the composite structure on the phase velocity of Love-type wave has been reported and illustrated through numerical computation along with graphical demonstration in both the cases of electrically open and electrically short condition for the reinforced and reinforced-free composite structure. Comparative study has been carried out to analyze the distinct cases associated with functional gradedness of the composite structure and also various cases which reveals the influence of piezoelectricity, reinforcement and horizontal initial stress acting in the composite structure, and bonding of the stratum and substrate of the composite structure in context of the present problem which serves as one of the major highlights of the study.

• Structural Engineering and Mechanics
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• 제17권2호
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• pp.153-166
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• 2004

An elasticity solution for sandwich plates assembled with non-rigid bonding and subjected to edgewise loads is presented. The solution satisfies the equilibrium equations of the face and core elements, the compatibility equations of stresses and strains at the interfaces, and the boundary conditions. To investigate the effects of bonding stiffnesses on the responses of sandwich plates, numerical evaluations are conducted. The results obtained have shown that the bonding stiffness, up to a certain level, has a strong effect on the plate mechanical response. Beyond this level, the usual assumption of perfect bonding used in classical theories is quite acceptable. An answer to what constitutes perfect bonding is found in terms of the ratio of the core stiffness to the bonding stiffness.

• 한국전기전자재료학회논문지
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• 제16권5호
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• pp.365-371
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• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.

• 한국전산구조공학회논문집
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• 제14권3호
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• pp.309-315
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• 2001

탄성 반도체 칩과 점탄성 접착제층의 계면에 존재하는 모서리 균열에 대한 응력확대계수를 조사하였다. 이러한 균열들은 자유 경계면 부근에 존재하는 응력 특이성으로 인해 발생할 수 있다. 계면 응력상태를 해석하기 위해서 시간 영역 경계요소법이 사용되었다. 작은 크기의 모서리 균열에 대한 응력확대계수가 계산되었다. 점탄성 이완으로 인해 응력확대계수의 크기는 시간이 경과함에 따라 작아진다.

• 한국전기전자재료학회논문지
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• 제14권10호
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• pp.779-784
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• 2001

In this work, we studied the characteristics of nitride films for the optimization of PMD(pro-metal dielectric) linear process, which can be applied to the recent semiconductor manufacturing process. We split the deposit condition of nitride films into four parts such as PO(protect overcoat) nitride, baseline, low hydrogen and high stress and low hydrogen, respectively. We tried to find out correlation between BPSG deposition and densification. In order to analyze the changes of Si-H and Si-NH-Si bonding density, we used FTIR area method. We also investigated the crack generation on wafer edge after BPSG densification, and the changes of nitride film stress as a function of RF power variation to judge whether the deposited films.

• Restorative Dentistry and Endodontics
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• 제18권2호
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• pp.483-496
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• 1993

Dentin hypersensitivity medicaments such as Gluma, Scotchbond 2, All-Bond 2, which are resin adhesives, were used to compare the sealing effects of dentinal tubule under mechanical stress. Topical application of above medicaments on the dentin surfaces of extracted teeth followed by artificial tooth brushing for 6 weeks was performed for the comparison. The following conclusions on the degree of dentinal tubule exposure versus time by were reached by using polyvinyl siloxane impression material for taking the impression, epoxy resin for the duplication and SEM for observing the surface. 1. SEM was used to compare the accuracy of the duplicated surface, but no differences were found when teeth samples and the duplicated surfaces were observed. 2. After comparing the degree of dentinal tubules exposure with varnish applied contrast group, resin adhesive materials showed much less exposure as time went by. 3. The results indicated that AU-Bond 2 adhesive, under mechanical stress, showed lesser exposure of dentinal tubules comparing with Gluma and Scotchbond 2 adhesives After the results were put together, it was demonstrated that resin replica method is an useful way to evaluate the treatment effects of the dentinal tubule hypersensitivity medicaments. Also, it was noticed that under mechanical stress, All-Bond 2, classified as fourth generation, illustrated the best dentinal tubules sealing effects.