• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Structural Engineering and Mechanics
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• v.83 no.5
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• pp.693-707
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• 2022

Bonded joints have proven their performance against conventional joining processes such as welding, riveting and bolting. The single-lap joint is the most widely used to characterize adhesive joints in tensile-shear loadings. However, the high stress concentrations in the adhesive joint due to the non-linearity of the applied loads generate a bending moment in the joint, resulting in high stresses at the adhesive edges. Geometric optimization of the bonded joint to reduce this high stress concentration prompted various researchers to perform geometric modifications of the adhesive and adherends at their free edges. Modifying both edges of the adhesive (spew) and the adherends (bevel) has proven to be an effective solution to reduce stresses at both edges and improve stress transfer at the inner part of the adhesive layer. The majority of research aimed at improving the geometry of the plate and adhesive edges has not considered the effect of temperature and water absorption in evaluating the strength of the joint. The objective of this work is to analyze, by the finite element method, the stress distribution in an adhesive joint between two 2024-T3 aluminum plates. The effects of the adhesive fillet and adherend bevel on the bonded joint stresses were taken into account. On the other hand, degradation of the mechanical properties of the adhesive following its exposure to moisture and temperature was found. The results clearly showed that the modification of the edges of the adhesive and of the bonding agent have an important role in the durability of the bond. Although the modification of the adhesive and bonding edges significantly improves the joint strength, the simultaneous exposure of the joint to temperature and moisture generates high stress concentrations in the adhesive joint that, in most cases, can easily reach the failure point of the material even at low applied stresses.

• Journal of the Korean Society for Heat Treatment
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• v.36 no.2
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• pp.61-68
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• 2023

Ti and Ti alloys are used in the automobile and aerospace industries due to their high specific strength and excellent corrosion resistance. However their application is limited due to poor formability at room temperature and high unit cost. In order to overcome these issues, dissimilarly jointed materials, such as cladding materials, are widely investigated to utilize them in each industrial field because of an enhanced plasticity and relatively low cost. Among various dissimilar bonding processes, the rolled cladding process is widely used in Ti alloys, but has a disadvantage of low bonding strength. Although this problem can be solved through post-heat treatment, the mechanical properties at the bonded interface are deteriorated due to residual stress generated during post-heat treatment. Therefore, in this study, the microstructure change and residual stress trends at the interfaces of Ti/Al cladding materials were studied with increasing post-heat treatment temperature. As a result, compared to the as-rolled specimens, no difference in microstructure was observed in the specimens after postheat treatment at 300, 400, and 500℃. However, a new intermetallic compound layer was formed between Ti and Al when post-heat treatment was performed at a temperature of 600℃ or higher. Then, it was also confirmed that compressive residual stress with a large deviation was formed in Ti due to the difference in thermal expansion coefficient and modulus of elasticity between Ti Grade II and Al 1050.

• Journal of the Korean Society for Nondestructive Testing
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• v.11 no.1
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• pp.23-30
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• 1991

In this study the bonding quality evaluation of FRP honeycomb structure was performed by the ultrasonic C-Scan method and stress wave factor measurements. These NDT techniques could be well applied to the disbonding detection of FRP honeycomb structures. Especially, stress wave factor (SWF) measurement is expected to be a useful technique in field applications.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1999.10a
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• pp.437-443
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• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Proceedings of the Korea Concrete Institute Conference
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• 1997.04a
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• pp.515-520
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• 1997

This research is aimed at the development of the composite beam-column connection system by which the steel beam can be connected to the R/C column with smooth stress transfer. As the first step of the structural performance tests of the system, bearing resistance test has been carried out for actual size specimen. From the test, the connection system has been proved to take good bonding and stress transfer to the surrounding concrete with negligible relative displacements.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.5
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• pp.658-671
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• 1999

The major influencing factors on the strength of all-ceramic crowns are types of dental ceramics, fabrication techniques, methods of abutment preparation and cementation modes of all-ceramic restorations. Zinc phosphate cement and glass-ionomer cement were used as an early lot-ing media for all-ceramic crowns. Recently many studies have reported that resin cements have more advantages in increasing the fracture strength of restorations comparing with zincphosphate cement and glass-ionomer cement. The purpose of this study is to investigate the effect of etching, silane treatment, sandblasting and dentin bonding agents on fracture strengths of dental ceramics. 40 flat dentin specimens and 40 ceramic discs of 1.5mm thickness and 8mm diameter were fabricated, and divided into 4 groups according to surface treatments. Surface treatments before cementation were as follows Group I : (ceramic) : HF etching - silane treatment - application of bonding resin (dentin) : application of dentin bonding agent Group II : (ceramic) : sandblasting - application of bonding resin (dentin) : application of dentin bonding agent Group III : (ceramic) : application of bonding resin (dentin) : application of dentin bonding agent Group IV : (ceramic) : HF etching - silane treatment - application of bonding resin (dentin) : no dentin bonding procedure Dentin specimens and ceramic discs were cemented with dual cure resin cement, and went through thermocycling. Compressive stress es were loaded on the centers of ceramic discs with Instron test-ing machine, and fracture strengths resistance for catastrophic fracture were measured The results were as follows. 1. The group I showed the highest fracture resistance. The next was group II And group III, IV followed. 2. There was a significant difference in the mean value of fracture strengths between group I and group III (p<0.05), but no significant differences between group I and group II, and group II and group III (p>0.05). 3. There was a significant difference in the mean value of fracture strengths between group I and group IV (p<0.05).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.473-476
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• 2003

This paper shows necessity of encapsulation layer to maximite flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer have an significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that have a significant effect on internal thermal stress. To compare magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• Structural Engineering and Mechanics
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• v.87 no.2
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• pp.107-116
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• 2023

The three-dimensional Hashin criterion and user subroutine VUMAT were used to simulate the damage in the composite layer, and the secondary stress criterion was used to simulate the interlayer failure of the cohesive element of the bonding layer and the propagation characteristics under the layer. The results showed that when the shear stress wave (shear wave) propagates on the surface of the laminate, the stress wave attenuation along the fiber strength direction is small, and thus producing a large stress profile. When the compressive stress wave (longitudinal wave) is transmitted between the layers, it is reflected immediately instead of being transmitted immediately. This phenomenon occurs only when the energy has accumulated to a certain degree between the layers. The transmission of longitudinal waves is related to the thickness and the layer orientation. Along the symmetry across the thickness direction, the greater is the stress amplitude along the layer direction. Based on the detailed investigation on the impact on various laminated composites carried out in this paper, the propagation characteristics of stress waves, the damage and the destruction of laminates can be explained from the perspective of stress waves and a reasonable layering sequence of the composite can be designed against damage and failure from low velocity impact.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.671-672
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• 2010