• Title/Summary/Keyword: bonding stress

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The Influence of CuO on Bonding Behaviors of Low-Firing-Substrate and Cu Conductor (저온소성 기판과 Cu와의 동시소성에 미치는 CuO의 첨가효과)

  • 박정현;이상진
    • Journal of the Korean Ceramic Society
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    • v.31 no.4
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    • pp.381-388
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    • 1994
  • A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

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Micro Computer Tomography Applied Monotonic Pullout Test for Deformed Rebar Bonding Model (이형 철근의 콘크리트 부착 모델 수립을 위한 Micro-CT 활용 단조가력 시험)

  • Jang, Indong;Cho, Junghyun;Yi, Chongku
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2020.11a
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    • pp.192-193
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    • 2020
  • In reinforced concrete adhesion studies, the demolition of the specimen is inevitably involved, and the studies conducted are limited to the macro load-displacement analysis. In order to establish an elaborate model for concrete bonding reinforced rebars, it is necessary to observe the rebar bonding behavior in the in-situ state. In this study, specially manufactured reinforcing bars, micro-UTM and 𝝁-computer tomography (𝝁CT) are used to observe reinforcing bars in the in-situ state. As a result of the monotonic pullout test of the processed reinforcing bar, maximum bond stress were shown to be 16.7MPa, which is slightly higher than the existing 10 to 12 MPa, and then the empty space inside the specimen in which the pullout test was conducted using 𝝁CT was confirmed. Through additional research, the fracture phenomenon of concrete excluding voids will be studied.

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Evaluation of Interlayer Shear Properties and Bonding Strengths of a Stress-Absorbing Membrane Interlayer and Development of a Predictive Model for Fracture Energy (덧씌우기 응력흡수층에 대한 전단, 부착강도 평가 및 파괴에너지 예측모델 개발)

  • Kim, Dowan;Mun, Sungho;Kwon, Ohsun;Moon, Kihoon
    • International Journal of Highway Engineering
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    • v.20 no.1
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    • pp.87-95
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    • 2018
  • PURPOSES : A geo-grid pavement, e.g., a stress-absorbing membrane interlayer (SAMI), can be applied to an asphalt-overlay method on the existing surface-pavement layer for pavement maintenance related to reflection cracking. Reflection cracking can occur when a crack in the existing surface layer influences the overlay pavement. It can reduce the pavement life cycle and adversely affect traffic safety. Moreover, a failed overlay can reduce the economic value. In this regard, the objective of this study is to evaluate the bonding properties between the rigid pavement and a SAMI by using the direct shear test and the pull-off test. The predicted fractural energy functions with the shear stress were determined from a numerical analysis of the moving average method and the polynomial regression method. METHODS : In this research, the shear and pull-off tests were performed to evaluate the properties of mixtures constructed using no interlayer, a tack-coat, and SAMI with fabric and without fabric. The lower mixture parts (describing the existing pavement) were mixed using the 25-40-8 joint cement-concrete standard. The overlay layer was constructed especially using polymer-modified stone mastic asphalt (SMA) pavement. It was composed of an SMA aggregate gradation and applied as the modified agent. The sixth polynomial regression equation and the general moving average method were utilized to estimate the interlayer shear strength. These numerical analysis methods were also used to determine the predictive models for estimating the fracture energy. RESULTS : From the direct shear test and the pull-off test results, the mixture bonded using the tack-coat (applied as the interlayer between the overlay layer and the jointed cement concrete) had the strongest shear resistance and bonding strength. In contrast, the SAMI pavement without fiber has a strong need for fractural energy at failure. CONCLUSIONS : The effects of site-reflection cracking can be determined using the same tests on cored specimens. Further, an empirical-mechanical finite-element method (FEM) must be done to understand the appropriate SAMI application. In this regard, the FEM application analy pavement-design analysis using thesis and bonding property tests using cored specimens from public roads will be conducted in further research.

Refined 3-D Stress Analysis of Composite Wavy-Lap Joint (복합재료 Wavy-Lap Joint의 3-D 상세 응력 해석)

  • Shin, Hun;Lee, Chang-Sung;Kim, Seung-Jo;Kim, Wi-Dae
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2001.05a
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    • pp.168-171
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    • 2001
  • Due to intrinsic load eccentricity, severe peel stress concentration occurs at both ends of the single-lap joint. To avoid load eccentricity as well as the singular tensile peel stress in the joint interface, composite wavy-lap joint is proposed. In this paper, refined 3-D stress analysis of wavy-lap joint is performed by finite element method using parallel mutifrontal solver. Analysis results show that the singular tensile peel stress concentration is totally avoided in wavy-lap joint, and that loads are more evenly transferred over the length of the joint. Therefore, the strength of wavy-lap joint is significantly higher than that of conventional single-lap joint. And it is believed that even higher strengths can be obtained by optimizing the new design configuration.

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Design and fabrication of condenser microphone with rigid backplate and vertical acoustic holes using DRIE and wafer bonding technology (기판접합기술을 이용한 두꺼운 백플레이트와 수직음향구멍을 갖는 정전용량형 마이크로폰의 설계와 제작)

  • Kwon, Hyu-Sang;Lee, Kwang-Cheol
    • Journal of Sensor Science and Technology
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    • v.16 no.1
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    • pp.62-67
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    • 2007
  • This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

Design and Fabrication of MEMS Condenser Microphone Using Wafer Bonding Technology (기판접합기술을 이용한 MEMS 컨덴서 마이크로폰의 설계와 제작)

  • Kwon, Hyu-Sang;Lee, Kwang-Cheol
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.16 no.12 s.117
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    • pp.1272-1278
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    • 2006
  • This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

A Study to Improve Bonding Strength of Strengthening Plate with Notches (노치를 이용한 보강재의 부착력 증가 방안에 관한 연구)

  • Han, Man-Yop;Song, Byeong-Pyo;Lee, Kwang-Myong
    • Magazine of the Korea Concrete Institute
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    • v.11 no.1
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    • pp.129-139
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    • 1999
  • Recently, many strengthening methods are developed and used to rehabilitate existing structures. One of the old and popular methods is strengthening with bonding steel plate. However, steel plate bonding method has a defect, which is debonding failure of steel plate before yielding of the plate due to stress concentration at the of the bonded plate. The objective of this study is the experimental verification of the improved bonding properties of a strengthening plate with notches. Two normal beams and ten strengthened beams with steel plate, which have several different notches, are tested and showed their effectiveness. Test results show that the notches of strengthening plate significantly improve post-yielding behavior, compared to normally strengthened beams. It is proved that the notches of strengthening plate increases ultimate strength 14% more than normal strengthened beam after yield strength. As for the shape of notches, arc notch is the best. and triangle notch and trapezoidal notch are the next and end welding method has no effect.

Effects of the Heat Treatment on the Microstructure and Mechanical Properties of the Diffusion-Bonded Ferritic/Martensitic Steel (확산접합된 페라이트/마르텐사이트강의 미세조직 및 기계적 특성에 미치는 열처리 효과)

  • Sah, Injin;Kim, Sunghwan;Hong, Sunghoon;Jang, Changheui
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.11 no.1
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    • pp.12-19
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    • 2015
  • As a measure of improving the mechanical properties of a diffusion bonded joint of a ferritic/martensitic steel (FMS), the post-bonding heat treatment (PBHT) is applied. In the temperature range of normalizing condition ($950-1,050^{\circ}C$), diffusion bonding is employed with compressive stress (6 MPa). Due to the martensite structure distributed in the matrix, Vicker's hardness values of the as-bonded are much higher than those of the as-received. Through the PBHT for 1 h at $720^{\circ}C$, hardness values are recovered to as low as those of the as-received condition. Also, tensile properties of PBHT are similar to those of the as-received at up to the test temperature of $550^{\circ}C$, when the diffusion bonding is carried out over $1,000^{\circ}C$. Based on the creep-rupture testing performed at $650^{\circ}C$ in air environment, the joint efficiency of the PBHTed specimens is about 80% in, which is higher than that of the as-bonded specimens.

Singular Stress Field Analysis and Strength Evaluation in Ceramic/Metal Joints (세라믹/금속접합제의 응력특이장 해석 및 강도평가)

  • 박영철;한근조;허선철;강재욱
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.470-474
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    • 1997
  • Since the ceramic/metal joints is joined at high temperature, the residual stress will develop during when cooled from bonding temperature due to remarkable difference of thermal expansion coefficient between creamic and metal. Moreover, the edge of jointed interface makes singular stress field in the ceramic/metal joints and this singular stress field much influences on the strength of joints. In this study, The influence of residual stress, mechanical load and repeat thermal sysle was estimated in the ceramic/metal joints. According to this influence, the change of singular stress field was analyed and then strength test, X-ray measurement are performed.

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Stress Function-Based Interlaminar Stress Analysis of Composite Laminates under Complex Loading Conditions (응력함수에 기초한 복합 하중하의 복합재 적층판의 층간응력 해석)

  • Kim, H.S.;Kim, J.Y.;Kim, J.G.
    • Journal of Power System Engineering
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    • v.14 no.3
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    • pp.52-57
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    • 2010
  • Interlaminar stresses near the free edges of composite laminates have been analyzed considering wall effects. Interface modeling of bonding layer was introduced to explain the wall effect. Using Lekhnitskii stress functions and the principle of complementary virtual work, the interlaminar stresses were obtained, which satisfied the traction free boundary conditions not only at the free edges, but also at the top and bottom surfaces of laminates. The interface modeling provides not singular stresses but concentrated finite interlaminar stresses. The significant amount of reductions of stresses at the free edge are observed compared to the results without interface modeling. The real stress state can be predicted accurately and the results demonstrate the usefulness of the proposed interface modeling for the strength design of composite laminates.