• Journal of Welding and Joining
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• v.13 no.3
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• pp.125-133
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• 1995

Rene80 superalloy was liquid phase diffusion bonded by using pure boron (B) as an insert material. As a basic study for the possibility of practical application of this bonding method, hardness and high temperature tensile strength of the bonded joint and metallurgical analysis were investigated. As experimental results, hardness of the bonded joint was homogenized after bonding and the tensile strength at 1144K was obtained to 90% of that of base metal. But there were some problems to be improved also, that means the joint was hardened after bonding due to increase of B content and elongation was much lower than that of base metal. Flat area and (Mo, Cr, W) boride, which should be harmful for bonding strength, were observed on the fractured surface of the tensile tested specimen.

• Transactions of Materials Processing
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• v.29 no.6
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• pp.307-315
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• 2020

The cemented carbide and stainless steel were bonded using a hot-vacuum brazing method to analyze the bonding interface. Since it is suitable for the hot vacuum brazing, nickel metal was used as a binder among the main components of the cemented carbide, and a new cemented carbide material was developed by adjusting the alloy composition. The paste, which is one of the important factors affecting the hot vacuum brazing bonding, was able to improve brazing adhesion by mixing solder as Ni powder and a binder as an organic compound at an appropriate ratio. Division of the stainless steel yielded a dense brazing result. This study elucidated the interfacial characteristics of wear-resistant parts by bonding stainless steel and cemented carbide via hot vacuum brazing.

• Restorative Dentistry and Endodontics
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• v.28 no.3
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• pp.209-221
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• 2003

The objectiveness of this study was to evaluate whether low-viscosity composite can bond effectively to dentin surface without bonding resin. The low-viscosity composites being 50wt% filler content were made by the inclusion of bonding resin of two self-etching systems(Cleafil SE Bond, Unifil Bond) varied with contents as 0, 10, 20, 30, 40, 50wt%. Exposed dentin surfaces of extracted 3rd molars are used. Dentin bond strengths were measured. The tests were carried out with a micro-shear device placed testing machine at a CHS of 1mm/min after a low-viscosity composite was filled into an iris cut from micro tygon tubing with internal diameter approximately 0.8mm and height of 1.0mm. 1 Flexural strength and modulus was increased with the addition of bonding resin. 2. Micro-shear bond strength to dentin was improved according to content of bonding resin irrespective of applying or not bonding resin in bonding procedure, and that of Clearfil SE Bond groups was higher than Unifil Bond. 3. There were no significant difference whether use of each bonding resin in bonding procedure for S-40, S-50, U-50(p＞0.05). 4. In SEM examination, resin was well infiltrated into dentin after primed with self-etching primer only for S-50 and U-50 in spite of the formation of thinner hybrid layer. Low viscosity composite including some functional monomer may be used as dentin bonding resin without an intermediary bonding agent. It makes a simplified bonding procedure and foresees the possibility of self-adhesive restorative material.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.3
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• pp.991-996
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• 2013

In this paper, the ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The ultrasonic horn was designed through the relational formula including the aspect ratio of the input terminal and output terminal, length of the ultrasonic horn. The modal analysis was performed for the propriety analysis of the designed horn. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the ultrasonic transducer was done. The optimal process parameters having maximum bonding strength was derived.

• Journal of Conservation Science
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• v.26 no.4
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• pp.371-376
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• 2010

The great jar estimated in Proto-Three Kingdoms period was found at the site from Pyeongtaek Daechuri and the bonding traces from pieces destroyed when they were excavated are observed. Therefore this study would figure out the components of bonding material used in great jars by optical microscope, FT-IR, py-GC/MS and the kind of textile attaching to great jar by transmitted light microscope. As a result of optical microscope for the cross-section, black material is uniformly applied between a piece of jar and the part of bonding and the textile line are observed. Black bonding material is resulted in korean rhus lacquer by FT-IR and py-GC/MS and the kind of textile is identified as hemp by transmitted light microscope. Materials for repairing archaeological objects are hardly known causing little information, but this study proves that the bonding material had used lacquer for great jars before Proto-Three Kingdoms period. Therefore if ancient bonding materials are systematically analysed in the further studies, it would be significant help for studying bonding and restoration materials of ancient objects.

• Journal of the Korean Institute of Telematics and Electronics
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• v.13 no.6
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• pp.1-6
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• 1976

In this paper, the methode of calculating conversion loss is proposed by considering the thickness of bonding medium between electrode and delay material in the vibrator of Elastic delay lines. As the result of computations using digital computer, it is shown that the thickness of bonding medium must be less than about 1/100 of the thickness of vibrator and when the thickness of electrode is about 1110 of vibrator, the center fnequency is shifted. When the thickness of bonding medium is equal to or more than the thickness of vibrator, the 리uctuations in frequency Bandwidth become larger and larger.

• Journal of Welding and Joining
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• v.22 no.1
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• pp.77-82
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• 2004

The effect of bonding condition on tensile properties of joints diffusion bonded spheroidal graphite cast iron, FCD60 to Cr-Mo steel, SCM 440 was investigated. Diffusion bonding was performed with various temperatures, holding times, pressures and atmospheres. All tensile specimens were fractured at the bonding interface. The tensile strength and elongation was increased with increasing bonding temperature. Especially, tensile strength of joints bonded at 1123K was higher than that of a raw material, FCD60, and tensile strength of joints bonded at 1173K was equal to that of a raw material, SCM440, but elongation of all joints was lower than those of raw materials. There was little the effect of holding time on the tensile properties. In comparison with bonding atmosphere, the difference of tensile strength was not observed, but elongation of joint bonded at vacuum(6.7mPa and 67mPa) was higher than that of Ar gas. Higher the degee of vacuum, elongation increased. Tensile properties of diffusion bonds depended on microstructures of cast iron at the interface and void ratio. Microstructures of cast iron at interface changed with temperature, because decarburizing and interdiffusion at the interface occurs and transformation of austenite-1 ferrite + graphite occurs on the cooling process. The void ratio decreased with increasing temperature, especially, effected on the elongation.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.785-790
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• 2002

Distributions of residual stress in diffusion bonding of dissimilar materials intermetallics TiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residual stresses presented in the minute area adjacent to bond-line of the base material with smaller coefficient of thermal expansion. Reducing bonding temperature and diminishing bonding time are in favor of the mollification of interface tresses.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.27-34
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• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.