• Steel and Composite Structures
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• v.24 no.6
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• pp.753-765
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• 2017

This paper aims to investigate the strength degradation of reinforced concrete piers wrapped with steel plates which corrode at the pier base by employing a three dimensional elasto-plastic finite element formulation. The prediction accuracy of the employed finite element analysis method is firstly verified by comparing the analytical results with test results. Then, a series of parametric studies is carried out to investigate the effects of steel plate's corrosion position along width direction, corrosion depth along plate thickness, corrosion range along width direction, and steel plate-concrete bonding degradation on the strength of the piers. It is observed that the strength degradation of the piers is closely related to steel plate's corrosion position, corrosion depth and corrosion range in the case of local corrosion on the webs. In contrast, when the base of flanges corrodes, the strength degradation of the piers is only related to steel plate's corrosion depth and corrosion range, and the influence of corrosion position on the strength degradation is very gentle. Furthermore, the strength of the piers decreases with the degradation of steel plate-concrete bonding behavior. Finally, the maximum strength of the piers obtained from numerical analysis corresponding to different bonding behavior is compared with theoretical results within an accepted error.

• Restorative Dentistry and Endodontics
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• v.37 no.1
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• pp.2-8
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• 2012

The limited durability of resin-dentin bonds severely compromises the longevity of composite resin restorations. Resin-dentin bond degradation might occur via degradation of water-rich and resin sparse collagen matrices by host-derived matrix metalloproteinases (MMPs). This review article provides overview of current knowledge of the role of MMPs in dentin matrix degradation and four experimental strategies for extending the longevity of resin-dentin bonds. They include: (1) the use of broadspectrum inhibitors of MMPs, (2) the use of cross-linking agents for silencing the activities of MMPs, (3) ethanol wet-bonding with hydrophobic resin, (4) biomimetic remineralization of water-filled collagen matrix. A combination of these strategies will be able to overcome the limitations in resin-dentin adhesion.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.780-785
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• 2004

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.

• Geomechanics and Engineering
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• v.18 no.2
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• pp.133-140
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• 2019

Strain-rate and temperature have significant effects on the one-dimensional (1D) compression behavior of soils. This paper focuses on the bonding degradation effect of soil structure on the time and temperature dependent behavior of soft structured clay. The strain-rate and temperature dependency of preconsolidation pressure are investigated in double logarithm plane and a thermal viscoplastic model considering the combined effect of strain-rate and temperature is developed to describe the mechanical behavior of unstructured clay. By incorporating the bonding degradation, the model is extended that can be suitable for structured clay. The extended model is used to simulate CRS (Constant Rate of Strain) tests conducted on structural Berthierville clay with different strain-rates and temperatures. The comparisons between predicted and experimental results show that the extended model can reasonably describe the effect of bonding degradation on the stain-rate and temperature dependent behavior of soft structural clay under 1D condition. Although the model is proposed for 1D analysis, it can be a good base for developing a more general 3D model.

• Journal of the Korean institute of surface engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1349-1354
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• 2008

In this study, we try to find the root cause of water condensing failures in a headlamp using chemical and mechanical analysis. Through the surface inspection by OM, SEM and CT, it was found that water infiltrate into the headlamp through hotmelt adhesive debonding part caused by adhesion force degradation and poor quality. IR spectra shows that adhesion force degradation are characterized by increase of some functional group(1742, 1710, 1649, 1016). Through the ESPI measurement, it is turned out that bonding structural change by thermal expansion and degradation of adhesive can be the cause of void generation. So it is recommended that cooling passage and the bonding part should be redesigned to give a guarantee of less thermal stress and high adhesion quality.

• Membrane Journal
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• v.19 no.4
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• pp.310-316
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• 2009

The degradation characteristics of cross-linked lactide/hyaluronic acid (LA/HA) membranes were investigated for purpose of applying to tissue engineering. The lactide/hyaluronic acid cross-linked with 1,3-butadiene diepoxide (BD) and 1-ethyl-3-(3-dimethyl aminopropyl) carbodiimide (EDC) was degradated in deionized water in water bath at $37^{\circ}C$. As the LA/HA mole ratio or crosslinking agent concentration decreased, the degradation rate of the crosslinked membranes increased. In order to investigate the structure change of the membrane in the degradation process, the control sample and 3, 6, 9 days-degradated samples were analysed by the nuclear magnetic resonance spectroscopy. In case of the membranes crosslinked with EDC, the HA-EDC bonding structure was degradated slowly whereas the HA-LA bonding structure was degradated quickly and dissappeared completely after 6 days. In case of the membranes crosslinked with BD, all the crosslinked bonding structure degradated slowly. The HA-BD bonding structure maintained its original state about 89, 83% in case of 3, 6 days-degardated samples respectively whereas the HA-LA bonding structure maintained its original state about 83, 65%. The scanning electron microscopy of the degradated membranes showed that the pore density in the surface, and the structure in the surface and cross section, of the before and after-degradation membranes did not change greatly, so the membranes was shown to be applied to materials for tissue engineering.

• Journal of Welding and Joining
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• v.30 no.6
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.18-21
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• 2003

The effect of interface bonding strength on the recovery force of SMA wire reinforced polymer matrix composites was investigated by pullout test. Firstly, the recovery forces and transformation temperatures of various prestrained SMA wires were measured and 5% prestrained SMA wires were prepared for the reinforcements of composites. EPDM incorporated with 20vol% silicon carbide particles(SiCp) of 6, 12, $60{mutextrm{m}}$ size were used as matrix. Pullout test results showed that the interface bonding strength increased when the SiCp size decreased due to the increase of elastic modulus of matrix. Cyclic test of composites was performed through control of DC current at the constant displacement mode. The abrupt decrease of recovery force during cycle test at high current was occurred by thermal degradation of matrix. This was in good agreement with temperature related in the thermal degradation of matrix. The hysteresis of recovery force with respect to the temperature was compared between wire and composite and the hysterisis of composites was smaller than the wire due to less thermal conduction.

• Journal of dental hygiene science
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• v.14 no.1
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• pp.29-34
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• 2014

The purpose of this study was to evaluate the influence of low temperature degradation (LTD) on the bonding strength of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP). The push-shear bond test method was used to investigate the core-veneer bonding strength of industrially manufactured Y-TZP core ceramic and manufacturer recommended veneering ceramic. Four groups from ceramic-zirconia specimens (n=28; n=7 per group) were assigned into four experimental aging conditions, namely storage in an autoclave at $134^{\circ}C$ for 0, 3, 5, 10 hours. Bonding strength was obtained using a universal testing machine with crosshead speed 0.5 mm/min. Data were statistically analyzed using one-way ANOVA and Tukey's test (${\alpha}=0.05$). In bonding strength test, the group which was treated with LTD showed lower bonding strength than no treated group. The ceramic-zirconia bonding strength was affected by LTD (p<0.05). Digital microscope examination of the fracture surface showed mixed failures with adhesive and cohesive types in LTD with treated Y-TZP groups.