• 한국전기전자재료학회논문지
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• 제15권10호
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• pp.883-888
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECYD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of 5.3 kgf/cm$^2$to 15.5 kgf/cm$^2$.

• 한국전기전자재료학회논문지
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• 제30권10호
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• pp.615-624
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• 2017

This study investigated the various physical and electrical effects of silicon direct bonding. Direct bonding means the joining of two wafers together without an intermediate layer. If the surfaces are flat, and made clean and smooth using HF treatment to remove the native oxide layer, they can stick together when brought into contact and form a weak bond depending on the physical forces at room temperature. An IR camera and acoustic systems were used to analyze the voids and bonding conditions in an interface layer during bonding experiments. The I-V and C-V characteristics are also reported herein. The capacitance values for a range of frequencies were measured using a LCR meter. Direct wafer bonding of silicon is a simple method to fuse two wafers together; however, it is difficult to achieve perfect bonding of the two wafers. The direct bonding technology can be used for MEMS and other applications in three-dimensional integrated circuits and special devices.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.303-304
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• 2005

In this paper, we report a fluxless eutectic die bonding process which uses 80Au-20Sn eutectic alloy. The chip LEDs are picked and placed on silicon substrate wafers. The bonding process temperatures and force are $305\sim345^{\circ}C$ and 10$\sim$100gf, respectively. The bonding process was performed on graphite heater with nitrogen atmosphere. The quality of bonding are evaluated by shear test and thermal resistance. Results of fluxless eutectic die bonding show that shear strength is Max. 3.85kgf at 345$^{\circ}C$ /100gf and thermal resistance of junction to die bonding is Min. 3.09K/W at 325$^{\circ}C$/100gf.

• Steel and Composite Structures
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• 제31권3호
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• pp.233-242
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• 2019

Early detection of damage bonding state such as insufficient bonding strength and interface partial contact defect for the explosive clad pipe is crucial in order to avoid sudden failure and even catastrophic accidents. A generalized and efficient model of the explosive clad pipe can reveal the relationship between bonding state and vibration characteristics, and provide foundations and priory knowledge for bonding state detection by signal processing technique. In this paper, the slender explosive clad pipe is regarded as two parallel elastic beams continuously joined by an elastic layer, and the elastic layer is capable to describe the non-uniform bonding state. By taking the characteristic beam modal functions as the admissible functions, the Rayleigh-Ritz method is employed to derive the dynamic model which enables one to consider inhomogeneous system and any boundary conditions. Then, the proposed model is validated by both numerical results and experiment. Parametric studies are carried out to investigate the effects of bonding strength and the length of partial contact defect on the natural frequency and forced response of the explosive clad pipe. A potential method for identifying the bonding quality of the explosive clad pipe is also discussed in this paper.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• 반도체디스플레이기술학회지
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• 제15권1호
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• pp.52-55
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• 2016

GZO film was prepared on p-type Si wafer and then annealed at various temperatures in an air conditions to research the bonding structures in accordance with the annealing processes. GZO film annealed in an atmosphere showed the various bonding structure depending on annealing temperatures and oxygen gas flow rate during the deposition. The difference of bonding structures of GZO films made by oxygen gas flows between 18 sccm and 22 sccm was so great. The bonding structures of GZO films made by oxygen gas flow of 18 sccm were showed the crystal structure, but that of 22 sccm were showed the amorphous structure in spite of after annealing processes. The bonding structure of GZO as oxide-semiconductor was observed the trend of becoming amorphous structures at the temperature of $200^{\circ}C$. Therefore, the characteristics of oxide semiconductor are needed to research the variation near the annealing at $200^{\circ}C$.

• 대한기계학회논문집A
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• 제37권3호
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• pp.373-378
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• 2013

엔진의 출력증대와 이에 따른 변속기의 크기 증가 등으로 인한 회전체의 관성증가로 변속기의 변속성능은 악조건이 되고 있다. 따라서, 이를 해결하기 위하여 내마모성이 높은 마찰소재의 개발이 요구된다. 디젤차량 수동변속기용 싱크로나이저 링에 요구되는 마찰특성에 적합한 소재를 개발하고, 이에 대한 접합 특성을 평가하였다. 즉, 철합금 모재와 동합금계 마찰재를 접합하는 공정을 개발하고, 접합층에 대하여 BSE분석, EDX분석을 수행하여 접합특성을 평가하였으며, 해당 시험편에 대하여 전단강도를 평가하였다.

• Bulletin of the Korean Chemical Society
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• 제33권7호
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• pp.2238-2246
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• 2012

Molecular dynamics simulations have been performed to investigate hydrogen bonding characteristics of hydroxyl groups in glucose aqueous solutions with different concentrations. The hydrogen bonding abilities and strength of different O and H atom types have been calculated and compared. The acceptor/donor efficiencies have been predicted and it has been found that: (1) O2-HO2 and O3-HO3 are more efficient intramolecular hydrogen bonding acceptors than donors; (2) O1-HO1, O4-HO4 and O6-HO6 are more efficient intramolecular hydrogen bonding donors than acceptors; (5) O1-HO1 and O6-HO6 are more efficient intermolecular hydrogen bonding acceptors than donors while hydroxyl groups O2-HO2 and O4-HO4 are more efficient intermolecular hydrogen bonding donors than acceptors. The hydrogen bonding abilities of hydroxyl groups revealed that: (1) the hydrogen bonding ability of OH2-$H_w$ is larger than that of hydroxyl groups in glucose; (2) among the hydroxyl groups in glucose, the hydrogen bonding ability of O6-HO6 is the largest and the hydrogen bonding ability of O4-HO4 is the smallest; (3) the intermolecular hydrogen bonding ability of O6-HO6 is the largest; (4) the order for intramolecular hydrogen bonding abilities (from large to small) is O2-HO2, O1-HO1, O3-HO3, O6-HO6 and O4-HO4.

• Journal of the Korean Wood Science and Technology
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• 제16권3호
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• pp.5-16
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• 1988

This experiment was executed to investigate the effect of activation of veneer surface by oxidizing agents, hydrogen peroxide and nitric acid, on bonding characteristics of Malas(Homalium foetidum Benth) plywood, in which the effects of these oxidizing agents amount, pretreatment time, and pressing time and temperatue on shear strength of the plywood were examined and discussed. In this research the activation of veneer surface by oxidants was effective in raising shear strength but the difference in shear strength was not observed between hydrogen peroxide and nitric acid treatment. Hydrogen peroxide treatment, however, seemed to be more profitable to industrial application because of its lower concentration and easier handling than nitric acid. The bonding method by lignin-phenol adhesive through surface activation revealed inferior shear strength to phenol- and urea-formaldehyde adhesive but superior water resistance to urea-formaldehyde adhesive and this bonding method, in addition, have the advantage of lower cost compared with phenol-formaldehyde adhesive, Therefore, this bonding method by lignin-phenol adhesive through surface activation seemed to economical in manufacturing of water-resistant wood panel materials in future.

• 한국염색가공학회지
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• 제25권2호
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• pp.110-117
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• 2013

The purpose of this study is to fabricate the flame retardant polyester fabric by thermal bonding with low melting component of flame retardant bicomponent filament(LMFRPC) and to describe the characteristics of thermal bonded fabrics. The fabrics were prepared with flame retardant polyester filaments(FRP) as warp and blended filaments of FRP and LMFRPC as weft. The LMFRPC have a sheath and a core wherein the core comprises a flame retardant polyester and the sheath comprises a thermoplastic polyester of low-melting point. In this study, we investigated the physical properties, melting behavior of filament, the effect of the component of FRP and LMFRPC on the thermal bonding, mechanical properties. Melting peak of LMFRPC showed the double melting peak. The thermal bonding of the fabric formed at lower melting peak temperature of bicomponent filament of LMFRPC. The optimum thermal bonding conditions for fabrics was applied at about $170^{\circ}C$ for 60 seconds by pin tenter. On the other hand, the tensile strength, elongation, and LOI of the fabric increased with an increasing component of FRP of weft.