• 제목/요약/키워드: bonded system

Search Result 468, Processing Time 0.022 seconds

Effect of prestressing on the first flexural natural frequency of beams

  • Jaiswal, O.R.
    • Structural Engineering and Mechanics
    • /
    • v.28 no.5
    • /
    • pp.515-524
    • /
    • 2008
  • In this paper the effect of prestressing force on the first flexural natural frequency of beams is studied. Finite element technique is used to model the beam-tendon system, and the prestressing force is applied in the form of initial tension in the tendon. It is shown that the effect of prestressing force on the first natural frequency depends on bonded and unbonded nature of the tendon, and also on the eccentricity of tendon. For the beams with bonded tendon, the prestressing force does not have any appreciable effect on the first flexural natural frequency. However, for the beams with unbonded tendon, the first natural frequency significantly changes with the prestressing force and eccentricity of the tendon. If the eccentricity of tendon is small, then the first natural frequency decreases with the prestressing force and if the eccentricity is large, then the first flexural natural frequency increases with the prestressing force. Results of the present study clearly indicate that the first natural frequency can not be used as an easy indicator for detecting the loss of prestressing force, as has been attempted in some of the past studies.

EXPERIMENTAL STUDY ON PROBABILITY OF STRENGTH FOR EPOXY ADHESIVE-BONDED METALS

  • Seo, Do-Won;Lim, Jae-Kyoo;Jeon, Yang-Bae;Yoon, Ho-Cheol
    • Proceedings of the KWS Conference
    • /
    • 2002.10a
    • /
    • pp.688-693
    • /
    • 2002
  • Adhesive bonding is becoming one of the popular joining techniques in metal industries, since it has some advantages over other techniques such as welding and diffusion bonding, e.g., any dissimilar metals are easily adhesive-bonded together. In this study, the experiments were carried out in order to provide the statistical data with strength evaluation methods: tension, shear and four-point bending tests for thermoplastic epoxy resin based adhesive-bonded metal joints. We should certificate on the probability of the adhesive strength that has the tendency of brittle fracture, the adhesive bonding strength between metals with thermoplastic adhesive has the best probability at four-point bending test. The strength testing method that has higher probability is four-point bending test, shear test and tensile test in order.

  • PDF

Measurement and Analysis of Sheath Circulating Current in Domestic Underground Transmission Cables (국내 송전 케이블 시스 순환전류 실측 및 분석)

  • 하체웅;김정년;이수길;김동욱;이종범;강지원
    • The Transactions of the Korean Institute of Electrical Engineers A
    • /
    • v.52 no.4
    • /
    • pp.193-200
    • /
    • 2003
  • The use of underground transmission tables has continuously increased in densely inhabited urban and suburban area. Due to a increasing demand of underground cables, two or more circuits are installed in parallel for several kilometers. It, however, has not been realized that the sheath circulating current is generated in the system where a large number of cables are laid in the same route. In this paper, Author studied diversely the sheath circulating current on underground cables depending on the various length rate, the phase arrangement, and the grounding resistance of the sheath in the cross-bonded section. It was clear that very large circulating current is generated in cable systems due to unbalanced length rate and phase arrangement in the cross-bonded section.

Bonding Property of Silicon Wafer Pairs with Annealing Method (열처리 방법에 따른 실리콘 기판쌍의 접합 특성)

  • 민홍석;이상현;송오성;주영창
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.16 no.5
    • /
    • pp.365-371
    • /
    • 2003
  • We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.

Evidence for Nitrogen-Bonded Acrylonitrile to Iridium (Ⅰ) in Acrylonitrilecarbonylbis(triphenylphosphine)iridium (Ⅰ) perchlorate

  • Park, Soon-Heum;Park, Hwa-Kun;Chin, Chong-Shik
    • Bulletin of the Korean Chemical Society
    • /
    • v.5 no.4
    • /
    • pp.167-169
    • /
    • 1984
  • Analyses of $_1$H-NMR, infrared and electronic spectral data for $[Ir(CH_2 = CHCN)(CO)(P(C_6H_5)_3)_2]ClO_4 (1)$prepared by the reaction of $Ir(OClO_3)(CO)(P(C_6H_5)_3)_2$ with $CH_2 = CHCN$, agree with the suggestion that 1 is a mixture of the nitrogen-bonded acrylonitrile complex, $[(CO)(P(C_6H_5)_3)_2Ir-NCCH = CH_2]ClO_4$ and other compound which may be the C = C ${\Pi}$ -system-bonded acrylonitrile complex, "[(CO)(P(C6H5)3)2Ir-CHCN = CH2]ClO4.

Conceptual design of a copper-bonded steam generator for SFR and the development of its thermal-hydraulic analyzing code

  • Im, Sunghyuk;Jung, Yohan;Hong, Jonggan;Choi, Sun Rock
    • Nuclear Engineering and Technology
    • /
    • v.54 no.6
    • /
    • pp.2262-2275
    • /
    • 2022
  • The Korea Atomic Energy Research Institute (KAERI) studied the sodium-water reaction (SWR) minimized steam generator for the safety of the sodium-cooled fast reactor (SFR), and selected the copper bonded steam generator (CBSG) as the optimal concept. This paper introduces the conceptual design of the CBSG and the development of the CBSG sizing analyzer (CBSGSA). The CBSG consists of multiple heat transfer modules with a crossflow heat transfer configuration where sodium flows horizontally and water flows vertically. The heat transfer modules are stacked along a vertical direction to achieve the targeted large heat transfer capacity. The CBSGSA code was developed for the thermal-hydraulic analysis of the CBSG in a multi-pass crossflow heat transfer configuration. Finally, we conducted a preliminary sizing and rating analysis of the CBSG for the trans-uranium (TRU) core system using the CBSGSA code proposed by KAERI.

The Efficient Detection Algorithm of Various CR signals using Channel Bonding in TV White Space (TV White Space에서 채널 본딩된 다양한 CR 시스템의 효율적인 검출 알고리즘)

  • Lim, Sun-Min;Jung, Hoi-Yoon;Jeong, Byung-Jang
    • The Journal of Korean Institute of Communications and Information Sciences
    • /
    • v.36 no.5A
    • /
    • pp.536-542
    • /
    • 2011
  • For efficient utilization of spectrum resources in TV white space after DTV transition, FCC allowed usage of the spectrum for CR system. The CR system is required to cognize channel usage state for utilizing the unused spectrum in TV white space which coexists various primary and secondary systems. In the meantime, as a demand for high throughput communication had been increased recently, CR systems also consider to adopt channel bonding technology, thus spectrum sensing for channel bonded system is essentially required. In this paper, we propose a novel spectrum sensing algorithm for channel bonding system using a single channel receiver. For IEEE 802.l1af signal, the proposed algorithm provide detection probability of 90% with false alarm probability 10% at SNR -18dB for single channel system and at SNR -7dB for 8 channel bonded system, respectively. Utilizing the proposed scheme, we can detect channel bonded signal using only a single receiver, therefore system overhead for spectrum sensing can be reduced significantly.

FATIGUE CRACK GROWTH MONITORING OF CRACKED ALUMINUM PLATE REPAIRED WITH COMPOSITE PATCH USING EMBEDDED OPTICAL FIBER SENSORS (광섬유센서를 이용한 복합재 패치수리된 알루미늄판의 균열관찰)

  • 서대철;이정주;김상훈
    • Proceedings of the Korean Society For Composite Materials Conference
    • /
    • 2001.05a
    • /
    • pp.250-253
    • /
    • 2001
  • Recently, based on the smart structure concept, optical fiber sensors have been increasingly applied to monitor the various engineering and civil structural components. Repairs based on adhesively bonded fiber reinforce composite patches are more structurally efficient and much less damaging to the parent structure than standard repairs based on mechanically fastened metallic patches. As a result of the high reinforcing efficiency of bonded patches fatigue cracks can be successfully repaired. However, when such repairs are applied to primary structures, it is needed to demonstrate that its loss can be immediately detected. This approach is based on the "smart patch" concept in which the patch system monitors its own health. The objective of this study is to evaluate the potentiality of application of transmission-type extrinsic Fabry-Perot optical fiber sensor (TEFPI) to the monitoring of crack growth behavior of composite patch repaired structures. The sensing system of TEFPI and the data reduction principle for the detection of crack detection are presented. Finally, experimental results from the tests of center-cracked-tension aluminum specimens repaired with bonded composite patch is presented and discussed.

  • PDF

An Exploratory Study for the Introduction of Standard Electronic Documents for Bonded Logistics Warehouse in Port Hinterland (항만배후단지 보세물류창고 표준전자문서 도입을 위한 탐색적 연구)

  • Chang, Su-Jin;Nam, Jung-Woo;Kim, Yul-Seong
    • Journal of Korea Port Economic Association
    • /
    • v.39 no.3
    • /
    • pp.1-19
    • /
    • 2023
  • After being kept in bonded areas and bonded logistics warehouses, the level of information sharing and progress confirmation on the process until the cargo is released is insufficient, resulting in disputes and legal disputes related to unauthorized and illegal delivery of cargo. This study attempted to present the introduction of standard electronic documents as a way to solve problems such as delivery practices raised in the delivery of existing imported cargo and legal disputes related to unauthorized illegal delivery among import-related entities. The service provider who manages the bonded warehouse/logistics center in the hinterland of Busan New Port and the shipper service user who use the service were classified into two groups, and a survey was conducted to analyze the difference in perception between the two groups. As a result of the analysis, both groups judged that the introduction of standard electronic documents was necessary, and showed high expected effects in preventing and reducing erroneous shipments and preventing and improving unauthorized and illegal shipments. Discussions between related organizations, related parties, and subjects are needed first to introduce standard electronic documents of the entry and warehouse management system, and the actual participation of related entities such as service providers and service users will play a very important role in establishing the system.

Near-IR Spectroscopic Studies of the Hydrogen Bonding Between Thiopropionamide and N,N-Dimethylalkylamide in Carbon Tetrachloride (사염화탄소 중에서 Thiopropionamide와 N,N-Dimethylalkylamide사이의 수소결합에 관한 분광학적 연구)

  • Byung-Chul Kim;Chang-Ju Yoon;Kyuseok Song;Young Sang Choi
    • Journal of the Korean Chemical Society
    • /
    • v.33 no.2
    • /
    • pp.156-163
    • /
    • 1989
  • The $ν_a+amide II$ combination band of thiopropionamide has been recorded for investigation of Hydrogen bonding between thiopropionamide (TPA) and N,N-dimethylalkylamide (DMF, DMA and DMP) in carbon tetrachloride over the range of $5^{\circ}$ to $55^{\circ}$. The combination band of monomeric TPA and hydrogen-bonded TPA can be resolved by Lorentzian-Gaussian product function into monomeric TPA and hydrogen-bonded TPA with amides. The association constants ($K_1$) for the hydrogen-bonded TPA were calculated by the concentrations of the monomeric TPA and the hydrogen-bonded TPA obtained from the computer resolved absorption bands. Thermodynamic parameters for the Hydrogen bonding have been evaluated by the analysis of the temperature dependent spectra. The ${\Delta}$$H^{\circ}$ of hydrogen-bonded TPA with DMF, DMA and DMP have been found to be-12.5, -13.5 and -14.1 kJ/mol, respectively. The corresponding ${\Delta}$$S^{\circ}$for the above system were -15.2, -17.9 and -22.3 J/mol${\cdot}$deg, respectively.

  • PDF