• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.5
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• pp.1073-1081
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• 2005

This paper describes a 3.3 V 10 bit CMOS digital-to-analog converter with a divided architecture of a 7 MSB and a 3 LSB, which uses an optimal Thermal-to-Binary Decoding method. Most of Dfh converters with hiか speed current drive are an architecture choosing current switch cell, column, row decoding method but this decoding circuit is complicated, occupies a large chip area. For these problems, this paper describes a D/A converter using an optimal Thermal-to-Binary Decoding method. The designed D/A converter with an active chip area of $0.953\;mm^2$ is fabricated by using a 0.35um process. The simulation data shows that the rise/fall time, settling time, and INL/DNL are 1.92/2.1 ns, 12.71 ns, and a less than ${\pm}2.3/{\pm}58$ LSB, respectively. The power dissipation of the D/A converter with a single power supply of 3.3 V is about 224 mW.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.187-191
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• 2007

This paper describes a 3.3V 10 bit CMOS digital-to-analog converter with a divided architecture of a 7 MSB and a 3 LSB, which uses an optimal Thermal-to-Binary Decoding method with monotonicity, glitch energy. The output stage utilizes here implements a return-to-zero circuit to obtain the dynamic performance. Most of D/A converters in decoding circuit is complicated, occupies a large chip area. For these problems, this paper describes a D/A converter using an optimal Thermal-to-Binary Decoding method. the designed D/A converter using the CMOS n-well $0.35{\mu}m$ process0. The experimental data shows that the rise/fall time, settling time, and INL/DNL are 1.90ns/2.0ns, 12.79ns, and a less than ${\pm}2.5/{\pm}0.7$ LSB, respectively. The power dissipation of the D/A converter with a single power supply of 3.3V is about 250mW.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.4
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• pp.691-698
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• 2008

This paper describes a 3.3V 10 bit CMOS digital-to-analog converter with a divided architecture of a 7 MSB and a 3 LSB, which uses an optimal Thermal-to-Binary Decoding method with monotonicity, glitch energy. The output stage utilizes here implements a return-to-zero circuit to obtain the dynamic performance. Most of D/A converters in decoding circuit is complicated, occupies a large chip area. For these problems, this paper describes a D/A converter using an optimal Thermal-to-Binary Decoding method. the designed D/A converter using the CMOS n-well $0.35{\mu}m$ process0. The experimental data shows that the rise/fall time, settling time, and INL/DNL are 1.90ns/2.0ns, 12.79ns, and a less than ${\pm}2.5/{\pm}0.7\;LSB$, respectively. The power dissipation of the D/A converter with a single power supply of 3.3V is about 250mW.