• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.15 no.2
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• pp.101-116
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• 2017

The interaction of U(VI) (hexavalent uranium) species with natural organic matter (NOM) in KURT (KAERI Underground Research Tunnel) groundwater is investigated using a laser spectroscopic technique. The luminescence spectra of the NOM are observed in the ultraviolet and blue wavelength regions by irradiating a laser beam at 266 nm in groundwater. The luminescence spectra of U(VI) species in groundwater containing uranium concentrations of $0.034-0.788mg{\cdot}L^{-1}$ are measured in the green-colored wavelength region. The luminescence characteristics (peak wavelengths and lifetime) of U(VI) in the groundwater agree well with those of $Ca_2UO_2(CO_3)_3(aq)$ in a standard solution prepared in a laboratory. The luminescence intensities of U(VI) in the groundwater are weaker than those of $Ca_2UO_2(CO_3)_3(aq)$ in the standard solution at the same uranium concentrations. The luminescence intensities of $Ca_2UO_2(CO_3)_3(aq)$ in the standard solution mixed with the groundwater are also weaker than those of $Ca_2UO_2(CO_3)_3(aq)$ in the standard solution at the same uranium concentrations. These results can be ascribed to calcium-U(VI)-carbonate species interacting with NOM and forming non-radiative U(VI) complexes in groundwater.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.6
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• pp.268-273
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• 2014

$Y_2O_3$ ceramic specimens were fabricated from the granular powder, obtained by spray drying process from the slurry. The slurry was prepared by mixing PVA binder, NaOH for Ph control, PEG and $Y_2O_3$ powder. The $Y_2O_3$ specimen was shaped in size of ${\phi}14mm$ and then sintered at $1650^{\circ}C$. The characteristics, microstructure, densities and plasma resistance of the $Y_2O_3$ specimens were investigated with the function of forming pressure and sintering time. $Y_2O_3$ specimens were exposed under the $CHF_3/O_2/Ar$ plasma, the dry etching treatment of specimens was carried out by the physical reaction etching of $Ar^+$ ion beam and the chemical reaction etching of $F^-$ ion decomposed from $CHF_3$. With increasing sintering time, $Y_2O_3$ specimens showed relatively high density and strong resistance in plasma etching test.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.9
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• pp.914-923
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• 2009

Helix antennas have been widely applied to satellite TT&C, data communication and GPS receiver systems onboard military, remote sensing and communication purpose satellites. The helix antennas are known to be convenient to control impedance and radiation coverage characteristics with a maximum directivity in satellite z-axis. Waveguide horn is commonly used for radar system that needs ultra-wideband pulse for exploration ground radar and electromagnetic disability measurement etc. It has high efficiency and low reflection characteristics provided by the low-profile shape and suppressed radiation distortion. In this paper, a waveguide horn structure incorporated with helix antenna design is proposed for satellite applications that require ultra-wideband pulse radar and high rate RF data communication link to ground station over wide coverage area. The main design concern is to synthesize variable beam forming pattern based on modified horn-helix combination helicone structure such that multi-mission antenna is implemented applicable for TT&C, earth observation, high data rate transmission. Waveguide horn helps to reduce the overall antenna structure size by introduction fold type reflector connected to the tapered helix antenna. The next generation KOMPSAT satellite currently under development requires high-performance precision attitude control system. We present an initial design of a hybrid hern-helix antenna structure suitable for efficient RF communication module design of multi-purpose satellite systems.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1261-1262
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• 2008

Laser-based crystallization techniques are ideally-suited for forming high-quality crystalline Si films on active-matrix display backplanes, because the highly-localized energy deposition allows for transformation of the as-deposited a-Si without damaging high-temperature-intolerant glass and plastic substrates. However, certain significant and non-trivial attributes must be satisfied for a particular method and implementation to be considered manufacturing-worthy. The crystallization process step must yield a Si microstructure that permits fabrication of thin-film transistors with sufficient uniformity and performance for the intended application and, the realization and implementation of the method must meet specific requirements of viability, robustness and economy in order to be accepted in mass production environments. In recent years, Low Temperature Polycrystalline Silicon (LTPS) has demonstrated its advantages through successful implementation in the application spaces that include highly-integrated active-matrix liquid-crystal displays (AMLCDs), cost competitive AMLCDs, and most recently, active-matrix organic light-emitting diode displays (AMOLEDs). In the mobile display market segment, LTPS continues to gain market share, as consumers demand mobile devices with higher display performance, longer battery life and reduced form factor. LTPS-based mobile displays have clearly demonstrated significant advantages in this regard. While the benefits of LTPS for mobile phones are well recognized, other mobile electronic applications such as portable multimedia players, tablet computers, ultra-mobile personal computers and notebook computers also stand to benefit from the performance and potential cost advantages offered by LTPS. Recently, significant efforts have been made to enable robust and cost-effective LTPS backplane manufacturing for AMOLED displays. The majority of the technical focus has been placed on ensuring the formation of extremely uniform poly-Si films. Although current commercially available AMOLED displays are aimed primarily at mobile applications, it is expected that continued development of the technology will soon lead to larger display sizes. Since LTPS backplanes are essentially required for AMOLED displays, LTPS manufacturing technology must be ready to scale the high degree of uniformity beyond the small and medium displays sizes. It is imperative for the manufacturers of LTPS crystallization equipment to ensure that the widespread adoption of the technology is not hindered by limitations of performance, uniformity or display size. In our presentation, we plan to present the state of the art in light sources and beam delivery systems used in high-volume manufacturing laser crystallization equipment. We will show that excimer-laser-based crystallization technologies are currently meeting the stringent requirements of AMOLED display fabrication, and are well positioned to meet the future demands for manufacturing these displays as well.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.77-77
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• 2017

Titanium and its alloys offer attractive properties in a variety of applications. These are widely used for the field of biomedical implants because of its good biocompatibility and high corrosion resistance. Titanium anodizing is often used in the metal finishing of products, especially those can be used in the medical devices with dense oxide surface. Based on SAE/AMS (Society of Automotive Engineers/Aerospace Material Specification) 2488D, it has the specification for industrial titanium anodizing that have three different types of titanium anodization as following: Type I is used as a coating for elevated temperature forming; Type II is used as an anti-galling coating without additional lubrication or as a pre-treatment for improving adherence of film lubricants; Type III is used as a treatment to produce a spectrum of surface colours on titanium. In this study, we have focused on Type II anodization for the medical (dental and orthopedic) application, the anodized surface was modified with gray color under alkaline electrolyte. The surface characteristics were analyzed with Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), surface roughness, Vickers hardness, three point bending test, biocompatibility, and corrosion (potentiodynamic) test. The Ti-6Al-4V alloy was used for specimen, the anodizing procedure was conducted in alkaline solution (NaOH based, pH>13). Applied voltage was range between 20 V to 40 V until the ampere to be zero. As results, the surface characteristics of anodic oxide layer were analyzed with SEM, the dissecting layer was fabricated with FIB method prior to analyze surface. The surface roughness was measured by arithmetic mean deviation of the roughness profile (Ra). The Vickers hardness was obtained with Vickers hardness tester, indentation was repeated for 5 times on each sample, and the three point bending property was verified by yield load values. In order to determine the corrosion resistance for the corrosion rate, the potentiodynamic test was performed for each specimen. The biological safety assessment was analyzed by cytotoxic and pyrogen test. Through FIB feature of anodic surfaces, the thickness of oxide layer was 1.1 um. The surface roughness, Vickers hardness, bending yield, and corrosion resistance of the anodized specimen were shown higher value than those of non-treated specimen. Also we could verify that there was no significant issues from cytotoxicity and pyrogen test.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.348-348
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• 2011

Carbon nanotube (CNT) field effect transistors and sensors use CNT as a current channel, of which the resistance varies with the gate voltage or upon molecule adsorption. Since the performance of CNT devices depends very much on the CNT/metal contact resistance, the CNT/electrode contact must be stable and the contact resistance must be small. Depending on the geometry of CNT/electrode contact, it can be categorized into the end-contact, embedded-contact (top-contact), and side-contact (bottom-contact). Because of difficulties in the sample preparation, the end-contact CNT device is seldom practiced. The embedded-contact in which CNT is embedded inside the electrode is desirable due to its rigidness and the low contact resistance. Fabrication of this structure is complicated, however, because each CNT has to be located under a high-resolution microscope and then the electrode is patterned by electron beam lithography. The side-contact is done by depositing CNT electrophoretically or by precipitating on the patterned electrode. Although this contact is fragile and the contact resistance is relatively high, the side-contact by far has been widely practiced because of its simple fabrication process. Here we introduce a simple method to embed CNT inside the electrode while taking advantage of the bottom-contact process. The idea is to utilize a eutectic material as an electrode, which melts at low temperature so that CNT is not damaged while annealing to melt the electrode to embed CNT. The lowering of CNT/Au contact resistance upon annealing at mild temperature has been reported, but the electrode in these studies did not melt and CNT laid on the surface of electrode even after annealing. In our experiment, we used a eutectic Au/Al film that melts at 250$^{\circ}C$. After depositing CNT on the electrode made of an Au/Al thin film, we annealed the sample at 250$^{\circ}C$ in air to induce eutectic melting. As a result, Au-Al alloy grains formed, under which the CNT was embedded to produce a rigid and low resistance contact. The embedded CNT contact was as strong as to tolerate the ultrasonic agitation for 90 s and the current-voltage measurement indicated that the contact resistance was lowered by a factor of 4. By performing standard fabrication process on this CNT-deposited substrate to add another pair of electrodes bridged by CNT in perpendicular direction, we could fabricate a CNT cross junction. Finally, we could conclude that the eutectic alloy electrode is valid for CNT sensors by examine the detection of Au ion which is spontaneously reduced to CNT surface. The device sustatined strong washing process and maintained its detection ability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.16-16
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• 2010

GaN-based light-emitting diodes (LEDs) are attracting great interest as candidates for next-generation solid-state lighting, because of their long lifetime, small size, high efficacy, and low energy consumption. However, for general illumination applications, the external quantum efficiency of LEDs, determined by the internal quantum efficiency (IQE) and the light extraction efficiency, must be further increased. The IQE is determined by crystal quality and epitaxial layer structure and high value of IQE more than 70% for blue LEDs have been already reported. However, there is much room for improvement of light extraction efficiency because most of the generated photons from active layer remain inside LEDs by total internal reflection at the interface of semiconductor with air due to the high refractive index difference between LEDs epilayer (for GaN, n=2.5) and air (n=1). The light confining in LEDs will be reabsorbed by the metal electrode or active layer, reducing the efficacy of LEDs. Here, we present the first demonstration of enhanced light extraction by forming a MgO nano-pyramids structure on the surface of vertical-LEDs. The MgO nano-pyramids structure was successfully fabricated at room temperature using conventional electron-beam evaporation without any additional process. The nano-sized pyramids of MgO are formed on the surface during growth due to anisotropic characteristics between (111) and (200) plane of MgO. The ZnO layer with quarter-wavelength in thickness is inserted between GaN and MgO layers to increase the critical angle for total internal reflection, because the refractive index of ZnO (n=1.94) could be matched between GaN (n=2.5) and MgO (n=1.73). The MgO nano-pyramids structure and ZnO refractive-index modulation layer enhanced the light extraction efficiency ofV-LEDs with by 49%, comparing with the V-LEDs with a flat n-GaN surface. The angular-dependent emission intensity shows the enhanced light extraction through the side walls of V-LEDs as well as through the top surface of the n-GaN, because of the increase in critical angle for total internal reflection as well as light scattering at the MgO nano-pyramids surface.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Explosives and Blasting
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• v.40 no.4
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• pp.15-26
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• 2022

With the recent increase in old and dangerous buildings, the demand for technology in the field of structure demolition is rapidly increasing. In particular, in the case of structures with severe deformation of damage, there is a risk of deterioration in stability and disaster due to changes in the load distribution characteristics in the structure, so rapid structure demolition technology that can be efficiently dismantled in a short period of time is drawing attention. However, structural deformation such as unauthorized extension or illegal remodeling occurs frequently in many old structures, which is not reflected in structural information such as building drawings, and acts as an obstacle in the demolition design process. In this study, as an effective way to overcome the discrepancy between the structural information of old structures and the actual structure, access to actual structures through 3D modeling was considered. 3D point cloud data inside and outside the building were obtained through LiDAR and drone photography for buildings scheduled to be blasting demolition, and precision matching between the two spatial data groups was performed using an open-source based spatial information construction system. The 3D structure model was completed by importing point cloud data matched with 3D modeling software to create structural drawings for each layer and forming each member along the structure slab, pillar, beam, and ceiling boundary. In addition, the modeling technique proposed in this study was verified by comparing it with the actual measurement value for selected structure member.

• The Journal of the Acoustical Society of Korea
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• v.43 no.3
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• pp.361-367
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• 2024

Ultrasound in the air is widely used in industry as a measurement technique to prevent abnormalities in the machinery. Recently, the use of airborne ultrasound imaging techniques, which can find the location of abnormalities using an array transducers, is increasing. A beamforming method that uses the phase difference for each sensor is used to visualize the location of the ultrasonic sound source. We exploit a random sparse ultrasonic array and obtain beamforming power distribution on the source in a certain distance away from the array. Conventional beamforming methods inevitably have limited spatial resolution depending on the number of sensors used and the aperture size. A high-resolution ultrasound imaging technique was implemented by applying functional beamforming as a method to overcome the geometric constraints of the array. The functional beamforming method can be expressed as a generalized beam forming method mathematically, and has the advantage of being able to obtain high-resolution imaging by reducing main-lobe width and side lobes. As a result of observation through computer simulation, it was verified that the resolution of the ultrasonic source in the air was successfully increased by functional beamforming using the ultrasonic sparse array.