• International Journal of Korean Welding Society
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• v.5 no.1
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• pp.15-28
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• 2005

The ball shear test was investigated in terms of the effects of test parameters, i.e., shear height and shear speed, with an experimental and non-linear finite element analysis for evaluating the solder joint integrity of area array packages. Two representative Pb-free solder compositions were examined in this work: Sn-3.5Ag-0.75Cu and In-48Sn. The substrate was a common SMD type with solder bond pad openings of 460 $\mu$m in diameter. The microstructural investigations were carried out using SEM, and the IMCs were identified with EDS. Shear tests were conducted with the two varying test parameters. It could be observed that increasing shear height, at fixed shear speed, has the effect of decreasing shear force for both Sn-3.5Ag-0.75Cu and In-48Sn solder joints, while the shear force increased with increasing shear speed at fixed shear height. Too high shear height could cause some undesirable effects on the test results such as unexpected high standard deviation values or shear tip sliding from the solder ball. The low shear height conditions were favorable for screening the type of brittle interfacial fractures or the degraded layers in the interfaces. The shear speed conditions were discussed with the stress analyses of the solder ball, and we cannot find any conspicuous finding which is related to optimum shear speed from the stress analyses.

• Journal of the Korean Society of Safety
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• v.25 no.6
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• pp.14-21
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• 2010

A miniature single solder ball joint is designed to mimic the actual solder joints used in the micro-electric industries. Shear tests were conducted to evaluate the mechanical behavior of miniature single solder joints at intermediate strain rates from $0.019\;s^{-1}$ to $2.16\;s^{-1}$ at room temperature. The shear fracture strength of the present solder ball joints generally increased with increasing shear strain rate, ranging from 32 to 51MPa. This behavior is affected by the sensitivity of bulk solder strength to strain rate. Shear fracture mode changed from brittle to partial ductile (failure inside the bulk solder) with an increase of shear speed. The unloading shear fracture toughness is generally consistent with the measure of the amount of bulk solder on the fractured surface.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.5
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• pp.449-454
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• 2009

This paper presents an experimental study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag(1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue lift becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively, Reasons for these observations will be further investigated In the future work.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.463-468
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• 2002

This study investigates the variations of shear force, displacement, and fracture surface with the shear speed and the number of reflows. The experimental data of shear tests indicate that the shear force increases as increasing the number of reflows and the shear speed due to the formation of a kind of intermetallic compound, Ni$_3$Sn$_4$, on Au/Ni/Cu pad, and the work-hardening. However, general trends show that the shear force decreases due to increasing the thickness of the intermetallic compound over 4x reflow. It is observed that the intermetallic compound which is formed between solder and pad increases according to increasing the number of reflows, and the growth rate of the intermetallic compound at central region on the interface is faster than one at edge part. The general tendencies of shear force and displacement with different shear speeds are almost identical as an increase of the number of reflows.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.19-21
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• 2005

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

• Journal of the Korean Vacuum Society
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• v.13 no.3
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• pp.127-131
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• 2004

Package reliability test was conducted to investigate the effect of solder composition on the ball fatigue strength for BGA (Ball Grid Array) packaging. The test pieces are assembled using eutectic composition 63Sn/37Pb, 62Sn/36Pb/2Ag, and 63Sn/34.4Pb/2Ag/0.5Sb solder after pre-conditioning at MRT Lv 3 (Moisture Resistance Test Level) and then conducted under T/C (Temperature Cycle test). For each case, the ball shear strength was obtained and micro structure photos were taken. SEM (scanning electron microscope) and EDX (Energy Dispersive X-ray) were used to the analyze failure mechanism. The growth rate of Au-Sn intermetallic compound in Sn63Pb34.5Ag2Sb0.5 solder was slow when compared to 63Sn/37Pb solder and 62Sn/36Pb/2Ag solder. The degradation of shear strength of solder balls caused by solder composition was discussed.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.580-585
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• 2009

The effects of shear speed and tip height on the high speed shear test of Sn-3.0wt.%Ag-0.5wt.%Cu ball joints were investigated. Solder balls of $450{\mu}m$ in diameter were reflowed at $245^{\circ}C$ on a FR4 PCB (Printed Circuit Board) in order to obtain a sample for the high-speed shear test. The UBM was comprised of Cu/Ni/Au, and the shear speed and tip height varied from 0.5 to 3.0 m/s, and from 10 to $135{\mu}m$, respectively. According to the experimental results, faster shear speed enhanced the shear strength of the solder joints, regardless of the tip height. The fraction of ductile (solder) fracture decreased when the shearing speed was raised from 0.5 to 3.0 m/s. With an increasing tip height from 10 to 50 and $135{\mu}m$, the fracture mode changed from pad lift to mixed (ductile and brittle) and ductile fracture, respectively, while the shearing energy also increased in the same order. The shear energy had a proportional relationship with the fraction of the solder fracture.

• Transactions of the Korean hydrogen and new energy society
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• v.25 no.5
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• pp.550-559
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• 2014

Hydraulic performance of the 1 inch ball valve have been analyzed based on the three-dimensional Reynolds-averaged Navier-Stokes analysis and an experiment. The experimental test rig of the 1 inch ball valve has been developed to investigate pressure drop for the 1 inch ball valve. The numerical model, which has reliability and effectiveness, has been constructed through the grid dependency test and validation with the results of the experiment. Shear stress transport turbulence model has been used to enhance an accuracy of the turbulence prediction in the pipeline and ball valve, respectively. Effects of the ball valve angle on the flow characteristics and friction performance have been evaluated.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.47-54
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• 2002

Powder type Ag system insert metals were manufactured by ball milling process. The variables of milling process such as milling media, revolution speed and powder/ball weight ratio were constant except the milling time. The milling times were selected for 24, 48 and 72 hours. The insert metals made by milling process were evaluated by performing scanning electron microscope, x-ray and DSC(differential scanning calorimetry) analysis, and further in terms of wettability test. The selected insert metals that have the good characteristics compared to commercial insert metals were applied to make the brazed joints of the steel/steel and the steel/WC superhard particles. The characterizations of those brazed joints were also conducted by microstructural observations, shear tensile tests and microhardness measurements. The results indicated that milling time of 48 hours for making powder type insert metals was the best condition showing the small amount of oxides residue, low wetting angle and stable microstructure. The brazed joints that applied the 48 hours milled insert metal were very sound condition indicating the shear tensile value of $2.29{\times}102$ MPa and the microhardness of 138VHN. Further, the amount of the porosity was appeared to be lower than that of the commercial insert metals.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.35-39
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• 2011

Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.