• 제목/요약/키워드: baking process

검색결과 128건 처리시간 0.019초

Effects of Onion Powder and Baking Temperature on the Physicochemical Properties of Cookies

  • Kim, Hye-Ran;Seog, Eun-Ju;Lee, Jun-Ho
    • Preventive Nutrition and Food Science
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    • 제12권3호
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    • pp.160-166
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    • 2007
  • Response surface methodology (RSM) was used for the optimization of the baking process of cookies made with onion powders (onion cookie). Experiments were carried out according to a central composite design, selecting onion powder content $(1.15{\sim}8.86%)$ and baking temperature $(155.9{\sim}184.1^{\circ}C)$ as independent variables and pH, titratable acidity, moisture content, density, spread factor, CIE color parameters $(L^{\ast}-$, $a^{\ast}-$, and $b^{\ast}-values)$, and hardness as response variables. pH decreased with increasing amount of onion powder and baking temperature. Moisture content also decreased as the baking temperature increased. $L^{\ast}-$ and $b^{\ast}-values$ decreased but $a^{\ast}-values$ increased with increasing onion content and baking temperature. Most polynomial models developed by RSM were highly effective to describe the relationships between the studied factors and the responses. Overall optimization, conducted by overlaying the contour plots under investigation, was able to point out the optimal range of the independent variables within which the six responses were simultaneously optimized. The point chosen as representative of this optimal region corresponded to 4.01% onion powder content and $161.84^{\circ}C$ baking temperature. The predicted dependent or response values in the optimal region were: pH=6.87, moisture content=2.77%, $L^{\ast}-value=68.45$, $a^{\ast}-value=1.98$, $b^{\ast}-value=34.64$, and spread factor=9.41.

웨이퍼 레벨 진공 패키징된 MEMS 자이로스코프 센서의 파괴 인자에 관한 연구 (Study of Failure Mechanisms of Wafer Level Vacuum Packaging for MEMG Gyroscope Sensor)

  • 좌성훈;김운배;최민석;김종석;송기무
    • 마이크로전자및패키징학회지
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    • 제10권3호
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    • pp.57-65
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    • 2003
  • 본 연구에서는 웨이퍼 레벨 진공 패키징된 MEMS자이로스코프 소자의 신뢰성 시험 및 분석을 통하여 웨이퍼 레벨 진공 패키징의 파괴 메카니즘을 연구하였다. 진공 패키징의 주된 파괴 모드는 누설, 가스투과, 그리고 outgassing이다. 누설은 접합 계면이나 재질의 결함을 통하여 주로 발생되며, 접합폭을 증가시키거나 단결정 실리콘을 사용하면 누설이 감소한다. Outgassing은 실리콘 및 유리기판의 표면 및 내부에서 발생하며 주로 $H_2O$와, $CO_2$, $C_3H_5$ 및 유기 오염물질이었다. Epi-poly의 경우 SOI 웨이퍼보다 약 10배의 outgassing을 발생시킨다. 또한 유리기판을 샌드블라스트 공정을 사용하여 가공한 경우, 약 2.5배의 outgassing 양이 증가한다. Outgassing 제거를 위해서는 접합 전에 웨이퍼를 pre-baking하는 과정이 필수적이며, outgassing의 발생을 최대로 하기 위한 최적의 pre-baking조건은 실리콘과 유리 웨이퍼를 $400^{\circ}C$$500^{\circ}C$ 사이에서 pre-baking하는 것이다.

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Determination and Prediction of Partition Coefficient Values (Kp) for Printing Ink Solvents on Cookie from the Kp of Each Cookie Ingredient

  • An, Duek-Jun
    • Preventive Nutrition and Food Science
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    • 제14권3호
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    • pp.246-251
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    • 2009
  • The partitioning behavior of five printing ink solvents was studied in cookie ingredients and cookies to examine migration behavior, and to determine if one could predict Kp of a cookie from summing the Kp of each ingredient multiplied by its weight factor in the cookie formula. Solvents were ethyl acetate, hexane, isopropanol, methyl ethyl ketone, and toluene. Gas chromatography was used to measure Kp values on each raw and baked ($260^{\circ}C$ for 10 min) cookie ingredients, and lab-made cookies. The baking process-decreases in water content in each sample generally affected Kp of polar solvents, but did not affect that of the non-polar solvents. Structural changes in cookie ingredients during the baking process also caused some change of migration behavior. While the prediction of Kp of lab-made cookies using the Kp of raw ingredients showed significant differences between calculated and experimentally found values, predictions with baked ingredients showed much smaller differences. This suggests that loss of water and changes of crystallinity in cookies and cookie ingredients due to the baking process are important and affect the Kp.

Statistical Modeling of Pretilt Angle Control on the Homogeneous Polyimide Surface as a Function of Rubbing Strength and Baking Temperature

  • Kang Hee-Jin;Lee Jung-Hwan;Hwang Jeoung-Yeon;Yun Il-Gu;Seo Dae-Shik
    • Transactions on Electrical and Electronic Materials
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    • 제7권2호
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    • pp.81-86
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    • 2006
  • In this paper, the response surface modeling of the control of the pretilt angle in the nematic liquid crystal on the homogeneous polyimide surface with different surface treatment is investigated. The pretilt angle is one of the main factors to determine the alignment of the liquid crystal display. The pretilt angle is measured to analyze the variation of the characteristics on the various process conditions. The rubbing strength and the hard baking temperature are considered as input factors. After the design of experiments is performed, the process model is then explored using the response surface methodology. The analysis of variance is used to analyze the statistical significance and the effect plots are also investigated to examine the relationship between the process parameters and the response.

고장력강 SNCM8재의 표면처리에 따른 피로강도 변화 (A Study on Fatigue Strength Influence of Surface Treatment on High Strength Steel SNCM8)

  • 강신현;차정환;배성인
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 춘계학술대회 논문집
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    • pp.697-703
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    • 1996
  • Fatigue strength of high strengthsteels are variable with many different surface treatment. It is well known that residual compressive stress retard fatigue crack growth rate(or arrest crack). High strngth steels are manufactured by following process. Heat treatment, shot peening and chromium plating process. High strength steel(HRC40 or above) which are subjected to fatigue load and dynamic load, chromium plated parts shall be peened in accordance with requirements and baked after plating. The purpose of this paper is to compare and discuss the influence of surface treatment and hydrogen embrittlement on fatigue strength of high strength steel. Therefore, fatigue test was performed to investigate influence of surface treatment. The results shows that shot peening is very effect method in creasing fatigue life and after plating, baking process is essential to prevent hydogen failure. In this paper, the experimental investigation is made to clarify the influence of shot peening conditions and baking process on fatigue strength of high strength steel.

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기능성 빵의 반죽 특성 및 재구매 의도 연구 - 한약재 청폐사간탕 첨가 - (Rheological Properties of Dough and Qualities of Functional Bread Flour Added with Chungpesagan-tang Extracts & Re-Procurement Attitude)

  • 강석우;이병구
    • 한국조리학회지
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    • 제10권4호
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    • pp.165-177
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    • 2004
  • This study was accomplished to examine possibilities to apply Korean medicine to breamaking. Extracts of Chungpesagan-tang prepared by the prescription of Korean medicine were used for baking, instead of water among ingredients of baking. Effects of addition of extracts of Chungpesagan-tang on various baking properties were analyzed during the process of baking. Changes in pH values and volumes of doughs during fermentation and pH values of bread showed no differences among samples. Loaf volumes and specific loaf volumes were increased somewhat on addition. The values of cohesiveness, springness, gumminess and brittleness of breads, which were measured by rheometer, were increased on addition while those of hardness were decreased a little. Lightness values of sections of loaves were decreased on addition, but their color differences were increased largely on color difference meter. There were nearly little differences among samples in all the values of parameters of external and internal characteristics and eating qualities of breads by sensory evaluation. Re-purchasing attitude of pullman bread added with Chungpesagan-tang had a high in the gender and age.

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Enhancing the Viability Rate of Probiotic by Co-Encapsulating with Prebiotic in Alginate Microcapsules Supplemented to Cupcake Production

  • Dong, Lieu My;Luan, Nguyen Thien;Thuy, Dang Thi Kim
    • 한국미생물·생명공학회지
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    • 제48권2호
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    • pp.113-120
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    • 2020
  • The objective of the study was to assess the survival of microencapsulated Lactobacillus plantarum ATCC8014 produced using the emulsion technique in alginate gel combined with pectin and maltodextrin components. The microcapsules were then added to cupcake dough that was further baked at 200℃ for 12 min. The viability of L. plantarum was assessed during baking and the 10 days of storage at 4℃ as well as in simulated gastrointestinal conditions. In addition, yeast-mold and water activity were investigated. After baking, the samples with microencapsulated L. plantarum contained more than 5 log CFU/g, which was higher compared to the bacterial concentration of the control samples. The concentration of L. plantarum was more than 6 logs CFU/g after the end of the storage; therefore, the probiotic functioned as a biopreservative in the cake. The prebiotic component strengthened the microcapsules network and helped protect the viability of L. plantarum in simulated gastric fluid (SGF) and simulated intestinal fluid (SIF) media. The results show that the addition of L. plantarum microencapsules did not affect the sensory scores of the cupcake while ensuring the viability of the probiotic during baking and storing.

SU-8 레진을 이용한 이광자 흡수 광조형 공정에서 고강성 3 차원 마이크로 형상 제작을 위한 공정 변수 분석 (Study on Process Parameters of a SU-8 Resin in Two-photon Streolithography for the Fabrication of Robust Three-dimensional Microstructures)

  • 손용;임태우;이신욱;공홍진;박상후;양동열
    • 한국정밀공학회지
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    • 제25권1호
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    • pp.130-137
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    • 2008
  • Two-photon stereolithography (TPS) is recognized as a useful process for the fabrication of three-dimensional microstructures. Recently, the need for a two-photon curable resin with high strength increases as 3-D moicrostructures of high aspect ratio or large scale of several hundreds micrometers are required for applications of nano/micro devices in IT/BT. In this work, process parameters of TPS employing the SU-8 which is a representative two-photon curable resin with high strength have been studied for the precise fabrication of 3-D microstructures with high strength. The pre-baking and post-baking processes are studied and the parameter study of the SU-8 in TPS is conducted. Through this work, very small roughness of 12 nm and the minimum aspect ratio of ${\sim}1$ which provides a precise accumulation of layers could be obtained. Using the conditions studied in this work, some 3-D examples are fabricated.

Ultrahigh Vacuum Technologies Developed for a Large Aluminum Accelerator Vacuum System

  • Hsiung, G.Y.;Chang, C.C.;Yang, Y.C.;Chang, C.H.;Hsueh, H.P.;Hsu, S.N.;Chen, J.R.
    • Applied Science and Convergence Technology
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    • 제23권6호
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    • pp.309-316
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    • 2014
  • A large particle accelerator requires an ultrahigh vacuum (UHV) system of average pressure under $1{\times}10^{-7}$ Pa for mitigating the impact of beam scattering from the residual gas molecules. The surface inside the beam ducts should be controlled with an extremely low thermal outgassing rate under $1{\times}10^{-9}Pa{\cdot}m^3/(s{\cdot}m^2)$ for the sake of the insufficient pumping speed. To fulfil the requirements, the aluminum alloys were adopted as the materials of the beam ducts for large accelerator that thanks to the good features of higher thermal conductivity, non-radioactivity, non-magnetism, precise machining capability, et al. To put the aluminum into the large accelerator vacuum systems, several key technologies have been developed will be introduced. The concepts contain the precise computer numerical control (CNC) machining process for the large aluminum ducts and parts in pure alcohol and in an oil-free environment, surface cleaning with ozonized water, stringent welding process control manually or automatically to form a large sector of aluminum ducts, ex-situ baking process to reach UHV and sealed for transportation and installation, UHV pumping with the sputtering ion pumps and the non-evaporable getters (NEG), et al. The developed UHV technologies have been applied to the 3 GeV Taiwan Photon Source (TPS) and revealed good results as the expectation. The problems of leakage encountered during the assembling were most associated with the vacuum baking which result in the consequent trouble shootings and more times of baking. Then the installation of the well-sealed UHV systems is recommended.

폴리이미드 표면에서의 네마틱 액정의 틸트 제어를 이용한 High Tilted OCB(HTOCB) 모드 (A Hight Tilted OCB(HTOCB) Mode using Control of Tilt Angle for Hematic Liquid Crystal on Polyimide Surface)

  • 황정연;정연학;서대식
    • 한국전기전자재료학회논문지
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    • 제18권7호
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    • pp.635-640
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    • 2005
  • In this paper, we have improved a novel high tilted optically compensated bend (OCB) (HTOCB) mode by using high tilt angle that was generated by the unique baking condition on the homeotropic alignment layer. The high tilt angle of liquid crystal (LC) was generated by new alignment process that tilt angle changed homeotropic state to homeogenous state using Hot-plate equipment; we obtained about $40\~50^{\circ}$ tilt angle with negative and positive dielectric anisotropy on the homeotropic polyimide (PI), and then LC tilt angle decreased as increasing baking temperature and time. At last, we obtained about $10^{\circ}$ with positive type NLC $({\Delta}n>0)$. Also, the LC tilt angle of positive type NLC $({\Delta}n>0)$ decreased as increasing rubbing strength at the same baking temperature and time. The novel LC operating mode (HTOCB) that used the high tilt angle by the new alignment method was improved. The response time of the novel HTOCB cell was faster than that of conventional OCB cell. We suggest that the developed the novel HTOCB cell using control of tilt angle on the homeotropic surface is a promising technique for the achievement of a fast response time and a high contrast ratio.