The Adhesion of Abrasive Particle during Poly-Si, TEOS and SiN CMP (Poly-Si, TEOS, SiN 막질의 CMP 공정 중의 연마입자 오염 특성 평가.)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2006.06a
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- pp.561-562
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- 2006