Fabrication Process and CTQ Analysis of Organic Solderability Preservatives(OSP) Finish on Cu Pad for SMT (SMT(Surface Mounting Technology)용 Cu 패드의 유기솔더보전제 처리공정 및 CTQ(Critical-to-Quality)분석)
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- Journal of the Microelectronics and Packaging Society
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- v.14 no.1
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- pp.1-9
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- 2007