• 제목/요약/키워드: annealing.

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3527/4343 알루미늄 클래드재의 인장 및 침식특성에 미치는 미세조직 제어의 영향 (Effect of Microstructure Control on the Tensile and Erosion Properties of 3527/4343 Aluminum Clad)

  • 어광준;김수현;김형욱;김동배;오영미
    • 소성∙가공
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    • 제22권5호
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    • pp.264-268
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    • 2013
  • Aluminum clad sheets for brazing materials in the automotive heat exchangers are required to exhibit both high strength and excellent erosion resistance. In this study, the effects of microstructural changes on the property of clad sheets due to thermomechanical treatment were investigated. The clad sheets were fabricated by roll bonding of twin-roll-cast AA3527 and AA4343 alloys followed by cold rolling down to a thickness of 0.22mm. Partial or full annealing was conducted at the final thickness in order to improved the erosion resistance while keeping the proper strength. Since full annealing was achieved for a temperature of $400^{\circ}C$, annealing treatments were performed at 360, 380, and $400^{\circ}C$, respectively. The tensile strength of 3527/4343 clad material was found to be inversely proportional to the annealing temperature before the brazing heat treatment. After this latter treatment, however, the tensile strength of the clad material was about 195~200MPa regardless of the annealing temperature. The erosion depth ratio of the clad annealed at $400^{\circ}C$ was 8.8% (the lowest), while that of the clad annealed at $380^{\circ}C$ was 17% (the highest). The effect of annealing temperature on the tensile and erosion properties of 3527/4343 aluminum clad sheets was elucidated by means of microstructural analyses.

다결정 3C-SiC 버퍼층위 증착된 AlN 박막의 열처리 효과 (Effects of thermal annealing of AlN thin films deposited on polycrystalline 3C-SiC buffer layer)

  • 황시홍;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.112-112
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    • 2009
  • In this study, the effect of a long post-deposition thermal annealing(600 and 1000 $^{\circ}C$) on the surface acoustic wave (SAW) properties of polycrystalline (poly) aluminum-nitride (AlN) thin films grown on a 3C-SiC buffer layer was investigates. The poly-AlN thin films with a (0002) preferred orientation were deposited on the substrates by using a pulsed reactive magnetron sputtering system. Experimental results show that the texture degree of AlN thin film was reduced along the increase in annealing temperature, which caused the decrease in the electromechanical coupling coefficient ($k^2$). The SAW velocity also was decreased slightly by the increase in root mean square (RMS) roughness over annealing temperature. However, the residual stress in films almost was not affect by thermal annealing process due to small lattice mismatch different and similar coefficient temperature expansion (CTE) between AlN and 3C-SiC. After the AlN film annealed at 1000 $^{\circ}C$, the insertion loss of an $IDT/AlN/3C-SiC/SiO_2/Si$ structure (-16.44 dB) was reduced by 8.79 dB in comparison with that of the as-deposited film (-25.23 dB). The improvement in the insertion loss of the film was fined according to the decrease in the grain size. The characteristics of AlN thin films were also evaluated using Fourier transform-infrared spectroscopy (FT-IR) spectra and X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM) images.

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Effect of annealing temperature on Al2O3 layer for the passivation of crystalline silicon solar cell

  • Nam, Yoon Chung;Lee, Kyung Dong;Kim, JaeEun;Bae, Soohyun;Kim, Soo Min;Park, Hyomin;Kang, Yoonmook;Lee, Hae-Seok;Kim, Donghwan
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.335.2-335.2
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    • 2016
  • The fixed negative charge of the Al2O3 passivation layer gives excellent passivation performance for both n-type and p-type silicon wafers. For the best passivation quality, annealing is known to be a prerequisite step and a lot of studies concerning annealing effect on the passivation characteristics have been performed. Meanwhile, for manufacturing a crystalline silicon solar cell, firing process is applied to the Al2O3 passivation layer. Therefore, study on not only annealing effect but also on firing effect is necessary. In this work, Al2O3 passivation performance (minority carrier lifetime) for p-type silicon wafer was evaluated with Quasi-Steady-State Photoconductance(QSSPC) measurement after annealing at different temperatures. For the samples which showed different aspects, C-V measurement was performed for the cause - whether it is due to the chemical effect or field-effect. The change in Al2O3 passivation property after firing processes was investigated and the mechanism for the change could be estimated.

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Effect of Magnetic Field Annealing on Microstructure and Magnetic Properties of FeCuNbSiB Nanocrystalline Magnetic Core with High Inductance

  • Fan, Xingdu;Zhu, Fangliang;Wang, Qianqian;Jiang, Mufeng;Shen, Baolong
    • Applied Microscopy
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    • 제47권1호
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    • pp.29-35
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    • 2017
  • Transverse magnetic field annealing (TFA) was carried out on $Fe_{73.5}Cu_1Nb_3Si_{15.5}B_7$ nano-crystalline magnetic core with the aim at decreasing coercivity ($H_c$) while keeping high inductance ($L_s$). The magnetic field generated by direct current (DC) was applied on the magnetic core during different selected annealing stages and it was proved that the nanocrystalline magnetic core achieved lowest $H_c$ when applying transverse field during the whole annealing process (TFA1). Although the microstructure and crystallization degree of the nanocrystalline magnetic core exhibited no obvious difference after TFA1 compared to no field annealing, the TFA1 sample showed a more uniform nanostructure with a smaller mean square deviation of grain size distribution. $H_c$ of the nanocrystalline magnetic core annealed under TFA1 decreased along with the increasing magnetic field. As a result, the certain size nanocrystalline magnetic core with low $H_c$ of 0.6 A/m, low core loss (W at 20 kHz) of 1.6 W/kg under flux density of 0.2 T and high $L_s$ of $13.8{\mu}H$ were obtained after TFA1 with the DC intensity of 140 A. The combination of high $L_s$ with excellent magnetic properties promised this nanocrystalline alloy an outstanding economical application in high frequency transformers.

용매열처리에 따른 PEDOT:PSS 암모니아 가스 감지막 특성 변화 (Effect of Solvent Annealing on the Characteristics of PEDOT:PSS as a Ammonia Gas Sensor Film)

  • 노왕규;염세혁;이왕훈;신한재;계지원;곽기섭;김세현;류시옥;한동철
    • 센서학회지
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    • 제26권2호
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    • pp.96-100
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    • 2017
  • Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) has been extensively studied as the active material in ammonia gas sensor because of its fast response time, high conductivity and environmental stability. It is well known that a post annealing process for organic devices based on PEDOT:PSS significantly increases the device performance. In this study, we propose the solvent annealing of PEDOT:PSS and investigated its effects. As a results, post solvent annealing on PEDOT:PSS lead to the surface chemical and physical properties change. These changes result in improved conductivity of the PEDOT:PSS. In additional, ammonia sensitivity of solvent annealed PEDOT:PSS become higher than pristine polymer film. The enhancement is mainly caused by the depletion of gas barrier PSS and structural re-forming PEDOT networks. We believe that the post solvent annealing is a promising method to achieve highly sensitivity PEDOT:PSS films for applications in efficient, low-cost and flexible ammonia gas sensor.

Types and Yields of Carbon Nanotubes Synthesized Depending on Catalyst Pretreatment

  • 고재성;이내성
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 추계학술발표대회
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    • pp.17.2-17.2
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    • 2011
  • Double-walled carbon nanotubes (DWCNTs) were grown with vertical alignment on a Si wafer by using catalytic thermal chemical vapor deposition. This study investigated the effect of pre-annealing time of catalyst on the types of CNTs grown on the substrate. The catalyst layer is usually evolved into discretely distributed nanoparticles during the annealing and initial growth of CNTs. The 0.5-nm-thick Fe served as a catalyst, underneath which Al was coated as a catalyst support as well as a diffusion barrier on the Si substrate. Both the catalyst and support layers were coated by using thermal evaporation. CNTs were synthesized for 10 min by flowing 60 sccm of Ar and 60 sccm of H2 as a carrier gas and 20 sccm of C2H2 as a feedstock at 95 torr and $750^{\circ}C$. In this study, the catalyst and support layers were subject to annealing for 0~420 sec. As-grown CNTs were characterized by using field emission scanning electron microscopy, high resolution transmission electron microscopy, Raman spectroscopy, and atomic force microscopy. The annealing for 90~300 sec caused the growth of DWCNTs as high as ~670 ${\mu}m$ for 10 min while below 90 sec and over 420 sec 300~830 ${\mu}m$-thick triple and multiwalled CNTs occurred, respectively. Several radial breathing mode (RBM) peaks in the Raman spectra were observed at the Raman shifts of 112~191 cm-1, implying the presence of DWCNTs, TWCNTs, MWCNTs with the tube diameters 3.4, 4.0, 6.5 nm, respectively. The maximum ratio of DWCNTs was observed to be ~85% at the annealing time of 180 sec. The Raman spectra of the as-grown DWCNTs showed low G/D peak intensity ratios, indicating their low defect concentrations. As increasing the annealing time, the catalyst layer seemed to be granulated, and then grown to particles with larger sizes but fewer numbers by Ostwald ripening.

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폴리 실리콘을 이용한 금속-반도체-금속 광 검출기의 열처리에 따른 전기적 특성 (Post Annealing Effects on the Electrical Properties of Polysilicon Metal-Semiconductor-Metal Photodetectors)

  • 김경민;김정열;이유기;최용선;이재성;이영기
    • 한국재료학회지
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    • 제28권4호
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    • pp.195-200
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    • 2018
  • This study investigated the effects of the post annealing temperatures on the electrical and interfacial properties of a metal-semiconductor-metal photodetector(MSM-PD) device. The interdigitate type MSM-PD devices had the structure Al(500 nm) / Ti(200 nm) / poly-Si(500 nm). Structural analyses of the MSM-PD devices were performed by employing X-ray diffraction(XRD), scanning electron microscopy(SEM) and transmission electron microscope(TEM). Electrical characteristics of the MSM-PD were also examined using current-voltage(I-V) measurements. The optimal post annealing condition for the Schottky contact of MSM-PD devices are $350^{\circ}C$-30minutes. However, as the annealing temperature and time are increased, electrical characteristics of MSM-PD device are degraded. Especially, for the annealing conditions of $400^{\circ}C$-180minutes and $500^{\circ}C$-30minutes, the I-V measurement itself was impossible. These results are closely related to the solid phase reactions at the interface of MSM-PD device, which result in the formation of intermetallic compounds such as $Al_3Ti$ and $Ti_7Al_5Si_{12}$.

자기장 내 열처리에 의한 퍼멀로이 박막의 일축 이방성 자기장의 회전에 관한 연구 (A Study on the Rotation of Uniaxial Anisotropy Field of NiFe Thin Film by Magnetic Annealing)

  • 송용진;김기출;이충선
    • 한국자기학회지
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    • 제11권4호
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    • pp.163-167
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    • 2001
  • DC 마그네트론 스퍼터링법으로 증착된 700 $\AA$의 NiFe 박막을 박막 증착시 형성시킨 자화용이축에 수직한 자기장을 인가하여 열처리한 후 일축 이방성 자기장의 회전을 조사하였다. NiFe 박막은 열처리온도 160 $^{\circ}C$에서 자화용이축과 자화곤란축을 구분할 수 없는 등방적인 상태가 되었고, 열처리온도가 증가함에 따라 다시 일축 이방성을 갖는 상태가 되었다. 열처리 온도가 400 $^{\circ}C$ 이상인 경우에 급격한 보자력의 증가를 보였다. 열처리 온도가 400 $^{\circ}C$인 경우에 XRD 분석과 AES depth profile은 NiFe 박막 내에서 (111) 방향으로 결정성장이 활발히 일어나며 인접한 전극 Au와 상호화산 현상도 광범위하게 일어남을 보여주었다.

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RF 마그네트론 스퍼터를 이용한 ATO 박막의 열처리 효과 (The effects of annealing of the ATO films prepared by RF magnetron sputtering)

  • 박세용;이성욱;박미주;김영렬;홍병유
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.270-271
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    • 2008
  • Antimony (6 wt%) doped tin oxide (ATO) films to improve conductivity were deposited on 7059 coming glass by RF magnetron sputtering method for application to transparent electrodes. The ATO film was deposited at a working pressure of 5 mTorr and RF power of 175 W. We investigated the effects of the post-annealing temperature on structural, electrical and optical properties of the ATO films. The films were annealed at temperatures ranging from $300^{\circ}C$ to $600^{\circ}C$ in step of $100^{\circ}C$ using RTA equipment in vacuum ambient. X-ray diffraction (XRD) measurements showed the ATO films to be crystallized with a strong (101) preferred orientation as the annealing temperature increased. Electrical resistivity decreased significantly with annealing temperatures up to $600^{\circ}C$. ATO film annealed at temperature of $600^{\circ}C$ showed the lowest resistivity of $5.6\times10^{-3}\Omega$-cm. Optical transmittance increased significantly with annealing temperatures up to $600^{\circ}C$. The highest transmittance was 90.8 % in the visible range from 400 to 800 nm.

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구리의 내식성에 미치는 어닐링 열처리의 영향 (Effect of Annealing Heat Treatment to Corrosion Resistance of a Copper)

  • 김진경;문경만;이진규
    • Journal of Advanced Marine Engineering and Technology
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    • 제29권6호
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    • pp.654-661
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    • 2005
  • Copper is a well known alloying element that is used to improve the resistance to general corrosion of stainless steel And also Cu cation have the anti-fouling effect to inhibit adhesion of the marine algae and shellfish to the surface of heat exchanger cooling pipe or outside wall of the ship, Therefore there are some anti-fouling methods such as anti-fouling Paint mixed with copper oxide or MGPS(Marine Growth Preventing System) by using Cu cation dissolved to the sea wather solution. Cu cation can be dissolved spontaneously by galvanic current due to Potential difference between Cu and cooling pipe of heat exchanger with Ti material, which may be one of the anti-fouling designs. In this study the effect of annealing heat treatment to galvanic current and Polarization behavior was investigated with a electrochemical points of view such as measurement of corrosion Potential, anodic polarization curve. cyclic voltammetric curve, galvanic current etc The grain size of the surface in annealed at $700^{\circ}C$ was the smallest than that of other annealing temperatures. and also the corrosion Potential showed more positive potential than other annealing temperatures. The galvanic current between Ti and Cu with annealed at $700^{\circ}C$ was the largest value in the case of static condition. However its value in the case of flow condition was the smallest than the other temperatures. Therefore in order to increase anti-fouling effect by Cu cation, the optimum annealing temperature in static condition of sea water is $700^{\circ}C$, however non- heat treated specimen in the case of flow condition may be desirable.