• Journal of the Korean Society for Heat Treatment
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• v.19 no.4
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• pp.208-218
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• 2006

The effects of the grain size on the magnetic properties in extra-low carbon steel after strain annealing were investigated. Two kinds of sample were prepared. One is the annealed sheet, which was annealed at $670^{\circ}C$ and $850^{\circ}C$ for various time periods after cold rolling. The other is the strain annealed sheet, which was temper rolled by 0.4% and subsequently strain annealed at the temperature ranging between $670^{\circ}C$ and $850^{\circ}C$ for various time periods. The grains after strain annealing became more coarse than those after primary annealing. The grains were coarsened due to the strain induced grain boundary migration (SIGM). It was found that the permeability tended to be increased and coercivity tended to be decreased with the increase of grain size. The optimum magnetic properties was achieved after strain annealing at $850^{\circ}C$ for 30 minites. Under this condition, the coercivity was measured to be 0.6 and the permeability was measured up to be 13000.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.5
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• pp.42-49
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• 2007

This paper introduces a study on reliability-driven device placement using simulated annealing algorithm which can be applicable to MCM or electronic systems embedded in a spacecraft running at thermal conduction environment. Reliability of the unit's has been predicted with the devices' junction temperatures calculated from FDM solver and optimized by simulated annealing algorithm. Simulated annealing in this paper adopts swapping devices method as a perturbation. This paper describes and compares the optimization simulation results with respect to two objective functions: minimization of failure rate and minimization of average junction temperature. Annealing temperature variation simulation case and equilibrium coefficient variation simulation case are also presented at the two respective objective functions. This paper proposes a new approach for reliability optimization of MCM and electronic systems considering those simulation results.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.90-98
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• 2002

In this paper, the annealing heat treatments for the best corrosion resistant of Ti(Grade 2) were studied in a 3.5% NaCl solution by electrochemical methods. The annealing heat treatments were accomplished at 650, 700 and $750^{\circ}C$ with different time of 30min., 1hour and 2 hours in a vacuum condition. The obtained results are: 1) in the case of solution heat treated $930^{\circ}C$ for 2 hours in a vacuum and air, the corrosion potentials were -348.7 and -567. 1mV, and current densities 2.32 and $22.62\mu\textrm{A}$, respectively, 2) as increase both annealing heat treatment temperature 650, 700, $750^{\circ}C$ and time 30min., 1 hour, 2 hours, the corrosion potential were decreased, whereas corrosion current density increased, 3) in the case of cyclic polarization, the measured charges were increased as increasing solution heat treatment temperature and time, 4) on the bases of corrosion potential, current density and charge, the best annealing temperature and time were measured as $700^{\circ}C$ and 30min. for Ti(Grade 2) material.

• Journal of the Korean institute of surface engineering
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• v.23 no.1
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• pp.16-26
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• 1990

The standrd electrolyte for the electrodeposition of chromium were preparwith reagent grade chromic acid(200g/L), sulfuric acid(pH=1.8)and oxalic acalic acid(640g/L)as additive. Carbon content in chromium plating varied about2.0-3.8 wt% with current density and temperatures of the bath. The hardeness of chromium platings incresed with increasing the annealing temperatures and showed maximum value of about Hv 1700 after annealing at$ 700^{\circ}C$for 60min. But, decreased it as annealing at above $700^{\circ}C$. The reason for varing thee hardness of chromium codeposited with carbon gradually foumed chromium carbide(Cr7C3), but that changed to Cr23C6 as annealing temperature at above $^700{\circ}C$. The X-ray diffraction pattern indicated that chromium carbides, such as Cr7C3 or Cr3C2, formed at formed at above $300^{\circ}C$. titanium coating sputtered on the on surface of chromium plating had performed and determined the hardness after annealing at 500, 600, $700^{\circ}C$ for 60min. the maximum hardeness was about Hv 2400 as annealing at $700^{\circ}C$. The titanium carbide formed in layer was identified by X-ray diffraction. It was confirmed that chromium and titanium carbide has effect of increasing the hardness.

• Transactions on Electrical and Electronic Materials
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• v.5 no.2
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• pp.66-70
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• 2004

The Sr$\_$0.7/Bi$\_$2.3/Ta$_2$O$\_$9/(SBT)thin films are deposited on Pt-coated electrode (Pt/TiO$_2$/SiO$_2$/Si) using a RE magnetron sputtering method. The ferroelectric properties of SBT capacitors with annealing times were studied. As a result of conducting the X-ray diffraction analysis and the electron microscopy analysis, the perovskite phase began to grow from 10 minutes after annealing the specimen, and excellent crystallization was accomplished at 60 minutes after annealing the specimen. The remanet polarization (2P$\_$r/) value and the coercive electric field (E$\_$c/) of the SBT thin film specimen showed the most excellent characteristics at 60 minutes after annealing the specimen, which were approximately 12.40 C/$\textrm{cm}^2$ and 30 kV/cm, respectively. The leakage current density of the SBT thin film specimen as annealed for 60 minutes was approximately 2.81${\times}$10$\^$－9/A/$\textrm{cm}^2$.

• Journal of the Semiconductor & Display Technology
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• v.15 no.2
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• pp.11-15
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• 2016

This paper, Ga-doped ZnO (GZO) thin films which were deposited on Corning glass substrate using an magnetron sputtering deposition technology and then the post deposition annealing process was conducted for 30 minutes at different temperature of 100, 200, 300, and $400^{\circ}C$, respectively. So as to investigate the properties for the relevant the Concentration and Oxygen Vacancy with Annealing temperature of Ga-doped ZnO thin films by RF Sputtering method. The Carrier concentration is enhanced as annealing temperature decreases, and also the oxygen vacancy concentration is enhanced as annealing temperature decreased. Oxygen vacancy will decrease along with Carrier concentration. This change in Carrier concentration is related to changes in oxygen vacancy concentration. The figure of merit obtained in this study means that Ga-doped ZnO films which annealed at $400^{\circ}C$ have the lowest Carrier concentration and Oxygen vacancy, which have the highest optoelectrical performance that it could be used as a transparent electrode.

• Journal of Powder Materials
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• v.25 no.4
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• pp.331-335
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• 2018

This study investigates the directional recrystallization behavior of Ni based oxide dispersion strengthened (ODS) alloy according to the zone annealing velocity. The zone annealing temperature is set as $1390^{\circ}C$, while the zone velocities are set as 2.5, 4, 6, and 10 cm/h, respectively. The initial microstructure observation of the as-extruded sample shows equiaxed grains of random orientation, with an average grain size of 530 nm. On the other hand, the zone annealed samples show a large deviation in grain size depending on the zone velocities. In particular, grains with a size of several millimeters are observed at 2.5-cm/h zone velocity. It is also found that the preferred orientation varies with the zone annealing velocity. On the basis of these results, this study discusses the role of zone velocities in the directional recrystallization of Ni base ODS alloy.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.126-134
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• 1996

Tungsten silicide films were deposited on the phosphorus-doped poly-Si/SiO$_{2}$/Si-substrates by LPCVD (low pressue chemical vapor deposition). The formation and various properties of tungsten silicide processed by furnace annealing in N$_{2}$ ambient were evaluated by using XRD. AFM, 4-point probe and SEM. And the redistribution of phosphorus atoms has been observed by SIMS. The crystal structure of the as-deposited tungsten silicide films were transformed from the hexagonal to the tetragonal structure upon annealing at 550.deg. C. The surface roughness of tungsten polycide films were found to very smoothly upon annelaing at 850.deg. C and low phosphorus concentration in polysilicon layer. The sheet resistance of tungsten polycide low phosphorus concentration in polysilicon layer. The sheet resistance of tungsten polycide films are measured to be 2.4 .ohm./ㅁafter furnace annealing at 1100.deg. C, 30min. It was found that the sheet resistance of tungsten polycide films upon annealing above 1050.deg. C were independant on the phosphorus concentration of polysilicon layer and furnace annealing times. An out-diffusion of phosphorus impurity through tungsten silicide film after annealing in $O_{2}$ ambient revealed a remarkably low content of dopant by oxide capping.

• Bulletin of the Korean Chemical Society
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• v.32 no.3
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• pp.939-942
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• 2011

Conductive carbon films were prepared at room temperature by unbalanced magnetron sputtering (UBMS) on silicon substrates using argon (Ar) gas, and the effects of post-annealing temperature on the structural, tribological, and electrical properties of carbon films were investigated. Films were annealed at temperatures ranging from $400^{\circ}C$ to $700^{\circ}C$ in increments of $100^{\circ}C$ using a rapid thermal annealing method by vacuum furnace in vacuum ambient. The increase of annealing temperature contributed to the increase of the ordering and formation of aromatic rings in the carbon film. Consequently, with increasing annealing temperature the tribological properties of sputtered carbon films are deteriorated while the resistivity of carbon films significantly decreased from $4.5{\times}10^{-3}$ to $1.0{\times}10^{-6}\;{\Omega}-cm$ and carrier concentration as well as mobility increased, respectively. This behavior can be explained by the increase of sp2 bonding fraction and ordering $sp^2$ clusters in the carbon networks caused by increasing annealing temperature.

• Journal of the Korean Ceramic Society
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• v.35 no.1
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• pp.88-96
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• 1998

The structural and electrical properties of titanium dioxide(TiO2) thin films deposited on p-type (100) si and 4$^{\circ}$off(100) Si substartes by metalorganic chemical vapor deposition (MOCVD) have been studied with post rapid thermal annealing. TiO2 thin films of anatase phase were grown at 300-500$^{\circ}C$ using titanium post rapid thermal annealing at a temperature of 800$^{\circ}C$ for 30sec. rutile phase was observed in the condition of the deposition temperature over 350$^{\circ}C$ in the ambient air atmosphere and at 500$^{\circ}C$ in cacuu,. SEM and AFM study show-ed surface roughness were increased slightly from 40${\AA}$to 55${\AA}$ after annealing due to grain growth and phase transformation. From capacitane-voltage measurement of Al/TiO2./p-Si structure after annealing we obtained ideal capacitance-voltage characteristics of MOS structure with dielectric constant of 16-22 in case of (100) Si and about 30- in case of 4$^{\circ}$off(100) Si but showed the higher leakage current.