• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권12호
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• pp.565-569
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• 2006

Plasma enhanced chemical vapor deposition(PECVD) is a well established technique for the deposition of hydrogenated film of silicon nitride (SiNx:H), which is commonly used as an antireflection coating as well as passivating layer in crystalline silicon solar cell. PECVD-SiNx:H films were investigated by varying the deposition and annealing conditions to optimize for the application in silicon solar cells. By varying the gas ratio (ammonia to silane), the silicon nitride films of refractive indices 1.85 - 2.45 were obtained. The film deposited at $450^{\circ}C$ showed the best carrier lifetime through the film deposition rate was not encouraging. The film deposited with the gas ratio of 0.57 showed the best carrier lifetime after annealing at a temperature of $800^{\circ}C$. The single crystalline silicon solar cells fabricated in conventional industrial production line applying the optimized film deposition and annealing conditions on large area substrate of size $125mm{\times}125mm$ (pseudo square) was found to have the conversion efficiencies as high as 17.05 %. Low cost and high efficiency silicon solar cells fabrication sequence has also been explained in this paper.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.469-470
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• 2006

The purpose of this research was to investigate and to find out the optimal annealing condition to mold an aspheric glass to be used for mobile phone module having 2 megapixel and $2.5{\times}$ zoom. Taking annealing rate and re-press temperature after molding as molding variables under the identical molding temperature and pressure, a glass lens was molded. And, Form Accuracy, Lens Thickness, Refractive Index, and Modulation Transfer Function(MTF) were measured in order to observe characteristics of molded lens, and then optimal annealing conditions were determined based on the resulting data. Properties of lens molded under the optimal conditions revealed Form Accuracy[PV] $0.2047\;{\mu}m$ in aspheric surface, and $0.2229\;{\mu}m$ in plane, and MTF value was 30.3 % under 80 lp/mm.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.692-695
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• 1999

This paper presents annealing characteristics of CrN thin-film strain gauges, which were deposited on glass by DC reactive magnetron sputtering in an argon-nitrogen atmosphere)Ar-(5-~25%)$N_2$. The physical and electrical characteristics of these films investigated with the thickness range 3500$\AA$ of CrN thin films, annealing temperature (100~30$0^{\circ}C$) and annealing time (24-72hr) . The optimized condition of CrN thin-film strain gauges were thickness range of 3500$\AA$ and annealing condition(30$0^{\circ}C$ , 48hr) in Ar-10%$N_2$ deposition atmosphere. Under optimum conditions, the CrN thin-films for strain gauge is obtained a high resistivity, $\rho$=1147.65$\Omega$cm a low temperature coefficient of 11.17. And change in resistance after annealing for the CrN thin film were quitely linear and stable.

• 한국진공학회지
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• 제4권S2호
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• pp.69-74
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• 1995

The effects of TCA incorporation during annealing process on the SIMOX quality is studied. Silicon wafers are implanted with heavy dose of oxygen ions, and are annealed at $1300^{\circ}C$ for 4 hours. The annealing process is splitted into three conditions due to some differences of low temperature preliminary annealing step which are without pre-annealing step. The specimens are analyzed by several methods, such as AES, XTEM, and TRXFA. TCA incorporation during pre-annealing step is effective in dislocation density reduction and heavy metal content reduction.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1272_1274
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• 2009

$MgF_2$ is a current material for the optical applications in the UV and deep UV range. Process variables for manufacturing the $MgF_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions, and then by changing a number of vapor deposition conditions and substrate temperature, Annealing conditions variously, structural and Optical characteristics were measured. Thereby, optimum process variables were derived. Nevertheless, modern applications still require improvement of the optical and structural quality of the deposited layers. In the present work, the composition and microstructure of $MgF_2$ single layers grown on slide glass substrate by Electro beam Evaporator(KV-660) processes, were analyzed and compared. The surface Substrate temperature having an effect on the quality of the thin film was changed from 200[$^{\circ}C$] to 350[$^{\circ}C$] at intervals of 50[$^{\circ}C$]. and annealing temperature an effect on the thin film was changed from 200[$^{\circ}C$] to 400[$^{\circ}C$] at intervals of 50[$^{\circ}C$]. Physical properties of the thin film were investigated at various fabrication conditions substrate temperature, annealing and temperature, annealing time by XRD, FE-SEM.

• 한국전기전자재료학회논문지
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• 제20권7호
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• pp.600-605
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• 2007

Process variables for manufacturing the $CuInSe_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1 : 1, while the surface temperature having an effect on the quality of the thin film was changed from $100^{\circ}C\;to\;300^{\circ}C$ at intervals of $50^{\circ}C$. The diffract fringe of X-ray, which depended upon the substrate temperature and the Annealing temperature of the manufactured $CuInSe_2$ thin film, was investigated. scanning electron microgaphs of represents a case that a sample manufactured at the substrate temperature of $100^{\circ}C$ was thermally treated at $200{\times}350^{\circ}C$. As a result, at $500^{\circ}C$ of the Annealing temperature, their chemical composition was measured in the proportion of 1 : 1 : 2. It could be known that under this condition, the most excellent thin film was formed, compared with the other conditions.

• Progress in Superconductivity
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• 제5권2호
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• pp.124-127
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• 2004

Many of research efforts have been focused on the improvement of critical current density (Jc) of silver-sheathed Bi-2223 tapes far practical applications. In this study, the transformation of Bi-2212 phase was investigated, which was transformed to orthorhombic from tetragonal through pre-annealing during powder packing and drawing process. The relationship between hardness of Bi-2212 orthorhombic phase and workability of Bi-2223/Ag tape was investigated. Bi-2223 superconducting wires with 55 filaments were fabricated by stacking and drawing process with different heat-treatment histories. Before rolling process, round wires were pre-annealing at 76$0^{\circ}C$ and in a low oxygen partial pressure. We confirmed that pre-annealing step was to transform to Bi-2212 orthorhombic structure from Bi-2212 tetragonal structure and to reduce the formation of second phases. However the breakages were created at Ag-alloy clad during rolling for pre-annealed Bi-22231Ag tapes. Several pre-annealing scenarios were introduced to reduce the breakages during rolling process. Microstructure and critical current density of pre-annealed Bi-2223 superconducting tapes were investigated. We could achieve proper pre-annealing conditions for Ag-alloy clad Bi-2223 superconducting tapes.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.589-592
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• 2002

The $Sr_{0.7}Bi_{2.3}Ta_2O_9$(SBT) thin films are deposited on Pt-coated electrode(Pt/TiO2/SiO2/Si) using RF magnetron sputtering method. The structural and electric properties of SBT capacitors were influenced with annealing atmosphere. In the XRD pattern, the SBT thin films in all annealing atmosphere had (105) orientation. In the SEM images, Bi-layered perovskite phase was crystallized in all annealing atmosphere and grains largely grew in oxygen annealing atmosphere. The maximum remanent polarization and the coercive electric field in oxygen annealing atmosphere are $12.40{\mu}C/cm^2$ and 48kV/cm respectively. The dielectric constant and leakage current density annealing in oxygen atmosphere are 340 and $6.81{\times}10^{-10}A/cm^2$ respectively. The fatigue characteristics of SBT capacitors did not change up to $10^{10}$ switching cycles.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2544-2546
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• 1998

The electrical and physical charateristics of Pt-Co alloy thin films on $Al_2O_3$ substrate, deposited by r.f cosputtering respectively, were analyzed with thickness of thin films ($1700{\sim}10000{\AA}$) and increasing annealing temperature ($800{\sim}1000^{\circ}C$). At input power of Pt : 4.4 W/$cm^2$, Co : 6.91 W/$cm^2$, working vacuum of 10 mTorr and annealing conditions of $1000^{\circ}C$) and 60 min, the resistivity and sheet resistivity of Pt-Co thin films with thickness of $3000{\AA}$ was $15{\mu}{\Omega}{\cdot}cm$ and 0.5 ${\Omega}/{\square}$, respectively. The TCR value of Pt-Co alloy thin films was measured with various thickness of thin films and annealing conditions. The optimum TCR value of 3850 ppm/$^{\circ}C$ in temperature range($200{\sim}400^{\circ}C$) is gained under conditions $3000{\AA}$ of thin films thickness and $1000^{\circ}C$ of annealing temperature. The thermal charateristics of Pt-Co micro heaters were analysed with Pt-Co RTD integrated on the same substrate. In the analysis of characteristics of Pt-Co micro heaters, the Pt-Co micro heaters with thickness of $3000{\AA}$ and annealing temperature of $1000^{\circ}C$ had a good linearity and temperature is up to $468.2^{\circ}C$ with 2.1 watts of the heating power.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2000년도 추계학술대회논문집
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• pp.17-20
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• 2000

This study is about a retrograde triple well employed in the Cell tr. of next DRAM and flash memory. triple well structure is formed deep n-well under the light p-well using MeV ion implantation. MeV P implanted deep n-well was observed to show greatly improved characteristics of electrical isolation and soft error. Junction leakage current, however, showed a critical behavior as a function of implantation and annealing conditions. {311} defects were observed to be responsible for the leakage current. {311} defects were generated near the R$\sub$p/ (projected range) region and grown upward to the surface during annealing. This is study on the defect behavior in device region as a function of implantation and annealing conditions.