• Title/Summary/Keyword: annealing condition

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Measurement of Material Properties for Miniature Stamping (미세 스탬핑용 박판소재의 물성치 측정)

  • Kim Y.S.;Shim H.B.
    • Transactions of Materials Processing
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    • v.15 no.3 s.84
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    • pp.247-254
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    • 2006
  • Rather than traditional manufacturing processes, miniature manufacturing processes usually require sophisticated equipments and characteristics of the processes of high cost and of low productivity. Contrarily, miniature stamping process can be realized in a low cost high productivity with relatively inexpensive equipments. In the meso scale, mechanical properties, especially work hardening characteristics, are discovered to be statically scattered and size dependent by intensive experimental and numerical investigations, which make the stamping process hard to apply to the miniature manufacturing. In this study, dual purpose experimental device that can be used for both miniature scale tensile test and miniature scale stamping by simple change of attachment has been developed. For the tensile test, the elongation has been measured with a combined use of a CCD camera and a linear encoder in order to account for the possibility of slippage between specimen and the grip and to ensure the accuracy of the measurement, while load has been measured with a load cell. To satisfy the required material properties for stamping, optimal annealing condition has been found by examining the microstructure of annealed specimen.

Effect of Sputtering and Post-Annealing Condition on The Orientation of SBN Thin Films (스퍼터링 및 후 열처리 조건변화에 따른 SBN 강유전체 박막의 배향성에 관한 연구)

  • Lee, Chae-Jong;Lee, Hee-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.05a
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    • pp.133-135
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    • 2006
  • SBN60 and SBN60/30 thin films were deposited by ion beam sputtering technique. Using the ceramic target of the same composition and Pt(100)/$TiO_2$/$SiO_2$/Si or Pt(111)/Ti/$SiO_2$/Si substrate, crystallization and orientation behavior as well as electric properties of the films were examined, Thickness was controlled to $3000{\AA}$ and the films were heat-treated at $650^{\circ}C{\sim}800^{\circ}C$. The orientation and crystallization behavior were observed which showed the dependence on processing condition($O_2$/Ar ratio, substrate temp, annealing temp...).

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Properties of MIM Ceramic Thin Film Structure (MIM 세라믹 박막 구조의 특성 분석)

  • Kim, Jin-Sa;Cho, Choon-Nam;Choi, Woon-Shick;Song, Min-Jong;So, Byeong-Mun;Kim, Chung-Hyeok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.333-334
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    • 2008
  • The SCT thin films were deposited on Pt-coated electrode using RF sputtering method according to the deposition condition. The crystallinity of SCT thin films were increased with increase of deposition temperature in the temperature range of 100~500[$^{\circ}C$]. The optimum conditions of RF power and Ar/$O_2$ ratio were 140[W] and 80/20, respectively. Deposition rate of SCT thin films was about 18.75[$\AA$/min] at the optimum condition. The maximum dielectric constant of SCT thin film was obtained by annealing at $600^{\circ}C$.

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Microstructure and Structural Properties of SCT Thin Film (SCT 박막의 미세구조 및 구조적인 특성)

  • Kim, Jin-Sa;Oh, Yong-Cheol
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.12
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    • pp.576-580
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    • 2006
  • The $(Sr_{0.85}Ca_{0.15})TiO_3(SCT)$ thin films were deposited on Pt-coated electrode $(Pt/TiN/SiO_2/Si)$ using RF sputtering method according to the deposition condition. The crystallinity of SCT thin films were increased with increase of deposition temperature in the temperature range of $100{\sim}500[^{\circ}C]$. The optimum conditions of RF power and $Ar/O_2$ ratio were 140[W] and 80/20, respectively. Deposition rate of SCT thin films was about $18.75[{\AA}/min]$ at the optimum condition. The composition of SCT thin films deposited on Si substrate is close to stoichiometry (1.102 in A/B ratio). The maximum dielectric constant of SCT thin film as obtained by annealing at $600^{\circ}C$.

Phase Transformation During Hot Consolidation and Heat Treatments in Mechanically Alloyed Iron Silicide (기계적 합금화 Iron Silicide의 열간성형 및 열처리에 의한 상변화)

  • Eo, Sun-Cheol;Kim, Il-Ho;Hwang, Seung-Jun;Jo, Gyeong-Won;Choe, Jae-Hwa
    • Korean Journal of Materials Research
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    • v.11 no.12
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    • pp.1068-1073
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    • 2001
  • An n-type iron$silicide(Fe_{0.98}Co_{0.02}Si_2)$has been produced by mechanical alloying process and consolidated by vacuum hot pressing. Although as-milled powders after 120 hours of milling did not show an alloying progress,${\beta}-FeSi_2$phase transformation was induced by isothermal annealing at$830{\circ}C$for 1 hour, and the fully transformed${\beta}-FeSi_2$phase was obtained after 4 hours of annealing. Near fully dense specimen was obtained after vacuum hot pressing at$ 1100{\circ}C$with a stress of 60MPa. However, as-consolidated iron silicides were consisted of untransformed mixture of ${\Alpha}-Fe_2Si_5$and ${\varepsilon-FeSi$phases. Thus, isothermal annealing has been carried out to induce the transformation to a thermoelectric semiconducting${\beta}-FeSi_2$phase. The condition for${\beta}-FeSi_2$transformation was investigated by utilizing DTA, SEM, and XRD analysis. The phase transformation was shown to be taken place by a vacuum isothermal annealing at$830{\circ}C$and the transformation behaviour was investigated as a function of annealing time. The mechanical properties of${\beta}-FeSi_2$materials before and after isothermal annealing were characterized in this study.

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The Effect of Annealing Heat Treatment by Anodic Polarization Impedance Experiments for Cu-10%Ni Alloy

  • Lee, Sung-Yul;Moon, Kyung-Man;Jeong, Jae-Hyun;Lee, Myeong-Hoon;Baek, Tae-Sil
    • Journal of Advanced Marine Engineering and Technology
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    • v.39 no.5
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    • pp.536-541
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    • 2015
  • Copper has been used extensively as an electric wire or as a base material in various types of machineries owing to its good electrical and thermal conductivity and good fabricating property, as well as its good corrosion resistance compared to iron. Furthermore, the copper-nickel alloy has significant corrosion resistance in severely corrosive environments. Although, cupro-nickel alloy shows better corrosion resistance than the brass and bronze series, this alloy also corroded in severely corrosive environments, including aggressive chloride ions, dissolved oxygen, and condition of fast flowing seawater. In this study, and annealing treatment at various annealing temperatures was carried out on the cupro-nickel (Cu-10%Ni) alloy, and the effects of annealing were investigated using electrochemical methods, such as measuring the polarization and impedance behaviors under flowing seawater conditions. The corrosion resistance increased by annealing compared to non heat treatment in the absence of flowing seawater. In particular, the sample annealed at $200^{\circ}C$ exhibited the best corrosion resistance. The impedance in the presence of flowing seawater showed higher values than in the absence of flowing seawater. Furthermore, the highest impedances was observed in the sample annealed at $800^{\circ}C$, irrespective of the present of flowing seawater. Consequently, the corrosion resistance of cupro-nickel (Cu-10%Ni) alloy in a severely corrosive environment can be improved somewhat by annealing.