• Korean Journal of Materials Research
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• v.15 no.4
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• pp.252-256
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• 2005

We removed the bluish of the natural ruby successfully by vacuum annealing, and measured the color evolution with annealing time and temperature. We varied the anneal temperature and time $800\~1500^{\circ}C$ and $3\~26$ hrs, respectively. The color evolution of rubies with annealing condition was recorded by a digital camera and a color coordination visible spectrometer. We determined the optimum bluish eliminating annealing condition was $1500^{\circ}C-3hr$, which conserving the natural inclusions. We suggest the bluish shrink with diffusion coefficient of $D=(5\times10^{-3}){\exp}(-200.000/RT)[cm^2/s]$. We propose the color of ruby may be determined as the identical red color if the color difference between two samples are less than 1.0, and the color difference nay be an auxiliary standard to evaluate the color of rubies.

• Journal of the Korean institute of surface engineering
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• v.30 no.1
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• pp.63-68
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• 1997

The effects of the post-deposition annealing on the structural optical properties of sputtered $TiO_2$ thin films were studied; annealing was carried out in air up to $1000^{\circ}C$ for different duration. The results of the X-ray diffraction and the raman spectroscopy showed the annealing-condition dependent structural transformation of $TiO_2$ films from the as-deposited amorphous phase to the anatase and rutil phases. The spectroscopic elliposometry was used to investigate the deposition-condition dependence of the as-deposted films optical constants and also the evolution of the optical constants correlated with the annealing-induced structural transformation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.120-123
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• 2007

The effects of annealing condition on the occurrence of the delamination in cold drawn hyper-eutectoid steel wires, were investigated. Annealing treatment was performed on cold drawn steel wires for temperature range of $425^{\circ}C\sim500^{\circ}C$ with the variation of annealing time from 30sec to 15min. The increase of annealing temperature and time would cause the decrease of tensile strength and the increase of ductility. However, the occurrence of the delamination, representing torsional ductility, showed the different way from the variation of ductility.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.469-470
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• 2006

The purpose of this research was to investigate and to find out the optimal annealing condition to mold an aspheric glass to be used for mobile phone module having 2 megapixel and $2.5{\times}$ zoom. Taking annealing rate and re-press temperature after molding as molding variables under the identical molding temperature and pressure, a glass lens was molded. And, Form Accuracy, Lens Thickness, Refractive Index, and Modulation Transfer Function(MTF) were measured in order to observe characteristics of molded lens, and then optimal annealing conditions were determined based on the resulting data. Properties of lens molded under the optimal conditions revealed Form Accuracy[PV] $0.2047\;{\mu}m$ in aspheric surface, and $0.2229\;{\mu}m$ in plane, and MTF value was 30.3 % under 80 lp/mm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.1016-1022
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• 2001

This study presents the microstructure-electrical property relationship of reactive-sputtered Ta$_2$O$_{5}$ MIM capacitor structure processed by annealing in a vacuum and $O_2$ ambience. A microstructural investigation showed the existence of amorphous phase in as-deposited condition and the formation of preferentially oriented-Ta$_2$O$_{5}$ in $700^{\circ}C$ annealing. On annealing under the $O_2$ atmosphere, the Ta$_2$O$_{5}$ film exhibited the trend of its composition\`s approaching to stoichiometry from off-stoichiometry, analyzed by EPMA, the leakage current decrease and the enhanced temperature-capacitance characteristic stability. In the case of low temperature vacuum-annealing treatment, the leakage current behavior was stable irrespective of applied electric field. In the high temperature-annealed film at a vacuum condition, the electrical properties was observed to deteriorate. The results state that in Ta$_2$O$_{5}$ film annealed at $O_2$ atmosphere, gives rise to improvement of electrical characteristics in the capacitor were improved by reducing oxygen-vacancy and dandling Ta-O bond.-O bond.

• Journal of Advanced Marine Engineering and Technology
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• v.29 no.6
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• pp.654-661
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• 2005

Copper is a well known alloying element that is used to improve the resistance to general corrosion of stainless steel And also Cu cation have the anti-fouling effect to inhibit adhesion of the marine algae and shellfish to the surface of heat exchanger cooling pipe or outside wall of the ship, Therefore there are some anti-fouling methods such as anti-fouling Paint mixed with copper oxide or MGPS(Marine Growth Preventing System) by using Cu cation dissolved to the sea wather solution. Cu cation can be dissolved spontaneously by galvanic current due to Potential difference between Cu and cooling pipe of heat exchanger with Ti material, which may be one of the anti-fouling designs. In this study the effect of annealing heat treatment to galvanic current and Polarization behavior was investigated with a electrochemical points of view such as measurement of corrosion Potential, anodic polarization curve. cyclic voltammetric curve, galvanic current etc The grain size of the surface in annealed at $700^{\circ}C$ was the smallest than that of other annealing temperatures. and also the corrosion Potential showed more positive potential than other annealing temperatures. The galvanic current between Ti and Cu with annealed at $700^{\circ}C$ was the largest value in the case of static condition. However its value in the case of flow condition was the smallest than the other temperatures. Therefore in order to increase anti-fouling effect by Cu cation, the optimum annealing temperature in static condition of sea water is $700^{\circ}C$, however non- heat treated specimen in the case of flow condition may be desirable.

• Transactions of Materials Processing
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• v.28 no.6
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• pp.354-360
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• 2019

The plastic strain ratio is one of the factors that affect the deep drawability of metal sheets. The plastic strain ratio of fully annealed Cu sheet is low because its texture has {001}<100>. In order to improve the deep drawability of Cu sheet, it is necessary to increase the plastic strain ratio of Cu sheet. This study investigate the increase of plastic strain ratio of a Cu sheet after the first asymmetry rolling and annealing, and the second asymmetry rolling and annealing in air and Ar gas conditions. The average plastic strain ratio (R_m) was 0.951 and |ΔR| value was 1.27 in the initial Cu sheet. After the second 30.1% asymmetric rolling and annealing of Cu sheet at 1000℃ in air condition, the average plastic strain ratio (R_m) was 1.03 times higher. However, |ΔR| was 0.12 times lower than that of the initial specimen. After the second 18.8% asymmetric rolling and annealing of Cu sheet at 630℃ in Ar gas condition, the average plastic strain ratio (R_m) was 1.68 times higher and |ΔR| was 0.82 times lower than that of the initial specimen. These results are attributed to the change of the texture of Cu sheet due to the different annealing conditions.

• Journal of the Korean Society for Heat Treatment
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• v.31 no.2
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• pp.56-62
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• 2018

Many researchers have studied on the precipitation control after solution treatment to improve the damping capacity without decreasing the strength. However, studies on the damping capacity and microstructure changes after deformation in the solid solution strengthening alloys were inadequate, such as the Al-Zn series magnesium alloys. Therefore, in order to investigate the effect of annealing condition on microstructure change and damping a capacity of AZ61 magnesium alloy. In this study, it was confirmed that the microstructure changes affect the damping capacity and hardness when annealed AZ61 alloy. AZ61 magnesium alloy was rolled at $400^{\circ}C$ with rolling reduction of 30%. These specimens were annealed at $350^{\circ}C$ to $450^{\circ}C$ for 30-180 minutes. After annealing, microstructure was observed by using optical microscopy, and damping capacity was measured by using internal friction measurement machine. Hardness was measured by Vickers hardness tester under a condition of 0.3 N. In this study, static recrystallization was observed regardless of the annealing conditions. In addition, uniform equiaxed grain structure was developed by annealing treatment. Hardness is decreased with increasing grain size. This is associated with Hall-Petch equation and static recrystallization. In case of damping capacity, bigger grain size show the larger damping capacity.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.264-267
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• 2008

Through-doping conditions with higher energies and doses were intentionally chosen to understand reverse annealing behavior. We observed that the implantation condition plays a critical role on dopant activation. We found a certain implantation condition with which the sheet resistance is not changed at all upon activation annealing.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1424-1425
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• 2006

A four-step rapid thermal annealing (RTA) process is proposed in order to improve the throughput and stabilize the process, compared to the six-step RTA process. Effects of annealing on the properties of a structure mode of CMOS process in both cases were investigated. The implanted dopant(As, $BF_2$ and Ti/TiN) movement in silicon during different rapid thermal annealing conditions was studied using secondary ion mass spectroscopy (SIMS) technique. These results show that the four-step RTA process significantly improves time effect and throughput (15%) by the condition of ramping up compared to the six-step RTA process.