• Structural Engineering and Mechanics
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• v.32 no.5
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• pp.649-665
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• 2009

This paper reports part of a comprehensive research study conducted at the University of Queensland on the ability of CFRP web-bonded systems in strengthening an exterior beam-column joint subjected to monotonic loads. One 1/2.2 scaled plain and four CFRP repaired/retrofitted joints subjected to monotonic loads were analysed using the nonlinear finite-element program ANSYS and the results were calibrated against experiments. The ANSYS model was employed in order to account for tension stiffening in concrete after cracking and a modified version of the Hognestad's model was used to model the concrete compressive strength. The stress-strain properties of main steel bars were modelled using multilinear isotropic hardening model and the FRPs were modelled as anisotropic materials. A perfect bond was assumed as nodes were shared between adjacent elements irrespective of their type. Good agreement between the numerical predictions and the experimental observation of the failure mechanisms for all specimens were observed. Closeness of these results proved that the numerical analysis can be used by design engineers for the analysis of web-bonded FRP strengthened beam-column joints with confidence.

• Structural Engineering and Mechanics
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• v.63 no.3
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• pp.269-280
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• 2017

One major concern that has occupied the mind of the designers is a structural failure as result of stress concentration in the geometrical discontinuities. Understanding the effective parameters contribute to stress concentration and proper selection of these parameters enables the designer get to a reliable design. In the analysis of perforated isotropic and orthotropic plates, the effective parameters on stress distribution around holes include load angle, curvature radius of the corner of the hole, hole orientation and fiber angle for orthotropic materials. This present paper tries to examine the possible effects of these parameters on stress analysis of infinite perforated plates with central quasi-square hole applying grey wolf optimizer (GWO) inspired by the particular leadership hierarchy and hunting behavior of grey wolves in nature, and also the present study tries to introduce general optimum parameters in order to achieve the minimum amount of stress concentration around this type of hole on isotropic and orthotropic plates. The advantages of grey wolf optimizer are stout, flexible, simple, and easy to be enforced. The used analytical solution is the expansion of Lekhnitskii's solution method. Lekhnitskii applied this method for the stress analysis of anisotropic plates containing circular and elliptical holes. Finite element numerical solution is employed to examine the results of present analytical solution. Results represent that by selecting the aforementioned parameters properly, fewer amounts of stress could be achieved around the hole leading to an increase in load-bearing capacity of the structure.

• Journal of Welding and Joining
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• v.6 no.3
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• pp.43-55
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• 1988

An experimental study was carried out to identify the fatigue fractue behavior of weld zone in generally rolled steel for marine structure. The bending an shear loads were applied simultaneously on the specimens to simulate real load condition for marine structure. The effect of the stress intensity factor under mode I with II loading condition on the initiation and the propagation of a crack were investigated, with particular emphaiss on mode II. When the $K_{II}$ stress intensiy factor in mode II was applied under mode I load condition, the growth behavior of a crack seems to be affected mainly by the anisotropic characteristic of materials. Especially, when the crack was located in and near the weld zone and parallel to th weld line, the propagation behaviour was turned out to be quite different from that of the base metal along the direction transverse to the weld line. In general, the propagation veiocity of the cracks in and near the weld zone was found to be slower that the velocity in base metal.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.649-652
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• 1992

ECR(Electron Cyclotron Resonance) occure at ${\omega}_c$=${\omega}$, ${\omega}_c$:electron cycltron frequency, ${\omega}$:electromagnetic wave frequency. ECR system have several merit, 1) power transefer efficiency 2) low neutral gas pressure (below 1 mTorr) 3) high plasma density($10^{12}$ $cm^{-3}$). It is applicated variously in the field of semiconductor and new materials as the manufacturing equipment. Magnetic field in ECR system contruct resonance layer (${\omega}$=2.45GHz, $B_z$=875 Gauss) and control plasma. Plasma is almost generated at resonance layer. If the distance between substrate and resonance layer is short, uniformity of plasma is related with profile of resonance layer. Plasma have the property "Cold in Field", so directonality of magnetic field is one of the control factors of anisotropic etching. In this study, we calculate B field and flux line distribution, optimize geometry and submagnet current and improve of magnetic field directionality (99.9%) near substrate. For the purpose of calculation, vector potential A(r,z) and magnetic field B(r,z), green function and numerical integration is used. Object function for submagnet optimization is magnetic field directionality on the substrate and Powell method is used as optimization skim.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.1
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• pp.13-18
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• 2000

We have fabricated LB ultra-thin films of maleate system by LB technique and evaluated the deposited status of LB ultra-thin films by I-V characteristics such as capacitance. It was found that the thickness of LB ultra-thin per layer is $27~30[{\AA}]$ by XRD. And, we have known that the conductivity along the horizontal direction of LB ultra-thin films was about $10^{-8}[S/cm]$, it corresponds to the semiconducting materials. Also, the I-V characteristics along the vertical direction of LB ultra-thin films was dominated by Schottky type current, the activation energy obtained by current-temperature characteristics was about 0.84[eV] and the conductivity was about $10^{-14}[S/cm]$, it corresponds to the insulator. And, the anisotropic conduction mechanism of the LB ultra-thin films in vertical direction and horizontal direction is determined by the hydrophilic group and the hydrophobic group in LB ultra-thin films. The above results are applicable to the semiconductor devices such as switching device, which function at the molecular level.

• Transactions of Materials Processing
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• v.27 no.5
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• pp.301-313
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• 2018

In this paper, tensile test was performed on pure titanium sheet (CP Ti sheet) with HCP structure in each direction to evaluate mechanical and surface properties and analyze microstructural changes during plastic deformation. We also evaluated forming limits of Ti direction in dome-type punch stretching test using a non-contact three-dimensional optical measurement system. As a result, it was revealed the pure titanium sheet has strong anisotropic property in yield stress, stress-strain curve and anisotropy coefficient according to direction. It was revealed that twinning occurred when the pure titanium sheet was plastic deformed, and tendency depends differently on direction and deformation mode. Moreover, this seems to affect the physical properties and deformation of the material. In addition, it was revealed the pure titanium sheet had different surface roughness changes in 0 degree direction and 90 degree direction due to large difference of anisotropy, and this affects the forming limit. It was revealed the forming limit of each direction obtained through the punch stretching test gave higher value in 90 degree direction compared with forming limit in 0 degree direction.

• Journal of the Korean Vacuum Society
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• v.21 no.5
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• pp.279-285
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• 2012

We report on the measurements of electronic transport properties of CVD graphene placed on a pre-patterned substrate with periodic nano trenches. A strong anisotropy has been observed between the transport parallel and perpendicular to the trenches. Characteristically different weak localization corrections have been also observed when the transport was perpendicular to the trench, which is interpreted as due to a density inhomogeneity generated by the potential modulations.

• Journal of the Korean Magnetics Society
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• v.13 no.2
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• pp.76-81
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• 2003

Non-linear anisotropic materials were used to simulate the effects of tensile stress in 3D finite element analysis (FEA). FEA was used to calculate the effects of far and near-side pit depth and tensile stress on magnetic flux leakage (MFL) signals. The axial and radial MFL signals were depended on far and near-side double circular pit depth and on the stress, but the circumferential MFL signal was not depended on them. The axial and radial MFL signals increased with greater pit depth and applied stress, but the circumferential MFL signal was scarcely changed.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.5-8
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• 2009

In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.5
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• pp.113-120
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• 1994

Silicon flow sensor that can detect the velocity and direction of air flow was designed and fabricated by integrated circuit process and bulk micromachining technique. The flow sensor consists of three-layered dielectric diaphragm, a heater at the center of the diaphragm, and four thermopiles surrounding the heater at each side of diaphragm as sensing elements. This diaphragm structure contributes to improve the sensitivity of the sensor due to excellent thermal isolation property of dielectric materials and their tiny thickness. The flow sensor has good axial symmetry to sense 2-D air flow with the optimized sensing position in the proposed structure. The sensor is fabricated using CMOS compatible process followed by the anisotropic etching of silicon in KOH and EDP solutions to form I$\mu$ m thick dielectric diaphragm as the last step. TCR(Temperature Coefficient of Resistance) of the heater of the fabricated sensors was measured to calculate the operating temperature of the heater and the output voltage of the sensor with respect to flow velocity was also measured. The TCR of the polysilicon heater resistor is 697ppm/K, and the operating temperature of the heater is 331$^{\circ}C$ when the applied voltage is 5V. Measured sensitivity of the sensor is 18.7mV/(m/s)$^{1/2}$ for the flow velocity of smaller than 10m/s.