• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.44 no.2
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• pp.141-147
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• 2024

In this study, micro CT images were used to confirm the tensile fracture strength according to the pore distribution characteristics of 3D printed concrete. Unlike general specimens, concrete structures printed by 3D printing techniques have the direction of pores (voids) depending on the stacking direction and the presence of filaments contact surfaces. Accordingly, the pore distribution of 3D printed concrete specimens was analyzed through quantitative and qualitative methods, and the tensile strength by direction was analyzed through a finite element technique. It was confirmed that the pores inside the 3D printed specimen had directionality, resulting in their anisotropic behavior. This study aims to analyze the characteristics of 3D concrete printing specimen and correlate them with simulation-based mechanical properties to improve performance of 3D printed material and structure.

• Journal of the Korean Magnetics Society
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• v.26 no.3
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• pp.76-80
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• 2016

CoSiB is the amorphous ferromagnetic material and multilayer consisting of CoSiB and Pd has perpendicular magnetic anisotropic property. PMA has strong advantages for STT-MRAM. Moreover, amorphous materials have two advantages more than crystalline materials: no grain boundary and good thermal stability. Therefore, we studied the magnetic properties of multilayers consisting of the $Co_{75}Si_{15}B_{10}$ with PMA. In this study, we investigated the magnetic property of the [CoSiB (3, 4, 5, and 6) ${\AA}$/Pd(11, 13, 15, 17, 19,and $24{\AA})]_5$ multilayers and found the annealing temperature dependence of the magnetic property. The annealing temperature range is from room temperature to $500^{\circ}C$. The coercivity and the saturation magnetization of the CoSiB/Pd multilayer system have a close association with the annealing temperature. Moreover, the coercivity especially shows a sudden increasing at the specific annealing temperature.

• Composites Research
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• v.12 no.5
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• pp.31-39
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• 1999

Glass-fiber reinforced polymeric composites provide the desitable properties of high stiffness and strength as well as specific weight. Hence, they have become some of the most important materials in several industries. These composites can be grouped into thermoplastic and thermoset composites, with thermoplastic composites having several advantages over thermoset composites in mechanical properties and processing. As a result, the study of the material behavior and forming techniques of such composites has attracted considerable attention in recent years. When the continuous fiber-reinforced polymeric composites are molded by flow molding, the molded parts leads to be nonhomogeneity and anisotropic because of the separation and orientation of fibers. As the characteristics of the products are greatly dependent on the separation, it is very important to clarify the separation in relarion to molding conditions, fiber mat structures and mold geometry. In this study, the effects of the mold geometry and the fiber mat structure on the compression moldability are studied using the cup-type molding.

• Composites Research
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• v.36 no.1
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• pp.48-52
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• 2023

Fiber-reinforced composites have anisotropic material properties, so the mechanical properties of composite structures can vary depending on the stacking sequence. Therefore, it is essential to design the proper stacking sequence of composite structures according to the functional requirements. However, depending on the manufacturing condition or the shape of the structure, there are many cases where the designed stacking angle is out of range, which can affect structural performance. Accordingly, it is important to analyze the stacking angle in order to confirm that the composite structure is correctly fabricated as designed. In this study, the stacking angle was predicted from real cross-sectional images of fiber-reinforced composites using convolutional neural network (CNN)-based deep learning. Carbon fiber-reinforced composite specimens with several stacking angles were fabricated and their cross-sections were photographed on a micro-scale using an optical microscope. The training was performed for a CNN-based deep learning model using the cross-sectional image data of the composite specimens. As a result, the stacking angle can be predicted from the actual cross-sectional image of the fiber-reinforced composite with high accuracy.

• Journal of the Korean Geotechnical Society
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• v.24 no.1
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• pp.81-89
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• 2008

The purpose of this study is to develop a new technique to quickly assess the quantitative stability of a tunnel by using measured displacement at the tunnel construction site. To achieve this purpose, in this study, a critical strain concept was introduced for the first time and applied to an assessment of a tunnel under construction. The new technique calculates numerically the strains of the surrounding ground by using displacements measured during tunnel excavation. The techniques considering the relative displacement, shotcrete, and anisotropic characteristics of ground were newly introduced after reinvestigating the existing analysis technique. In addition, an analysis module was developed based on the proposed analysis technique in this study, and the applicability of the developed module was verified. To verify the module, first of all, the calculated excavation displacements of a cylindrical tunnel by analytic method and commercial programs (Pentagon-3D, Flac-2D) were compared for the confirmation of applicability of commercial programs. Then, the calculated excavation displacements under the same initial condition, both with and without a shotcrete lining, by two commercial programs were compared. finally, we assess the load condition and material properties of in-situ ground by inputting tunnel excavation displacement, which was calculated by a commercial program, into the developed analysis module (FAST-Ver. 1.2, feedback Analysis System for Tunneling), and checked whether the assessed results conform to the originally assumed values.