• Title/Summary/Keyword: anisotropic material properties

Search Result 157, Processing Time 0.02 seconds

Al2TiO5-machinable Ceramics Made by Reactive Sintering of Al2O3 and TiO2 (Al2O3와 TiO2의 반응소결로 제조한 Al2TiO5-기계가공성 세라믹스)

  • Park, Jae-Hyun;Lee, Won-Jae;Kim, Il-Soo
    • Journal of the Korean Ceramic Society
    • /
    • v.47 no.6
    • /
    • pp.498-502
    • /
    • 2010
  • Aluminium titanate($Al_2TiO_5$) has extremely anisotropic thermal expansion properties in single crystals, and polycrystalline material spontaneously microcracks in the cooling step after sintering process. These fine intergranular cracks limit the strength of the material, but provide an effective mechanism for absorbing strain energy during thermal shock and preventing catastrophic crack propagation. Furthermore, since machinable BN-ceramics used as an insulating substrate in current micro-electronic industry are very expensive, the development of new low-cost machinable substrate ceramics are consistently required. Therefore, cheap $Al_2TiO_5$-machinable ceramics was studied for the replacement of BN ceramics. $Al_2O_3-Al_2TiO_5$ ceramic composite was fabricated via in-situ reaction sintering. $Al_2O_3$ and $TiO_2$ powders were mixed with various mol-ratio and sintered at 1400 to $1600^{\circ}C$ for 1 h. Density, hardness and strength of sintered ceramics were systematically measured. Phase analysis and microstructures were observed by XRD and SEM, respectively. Machinability of each specimens was tested by micro-hole machining. The results of research showed that the $Al_2TiO_5$-composites could be used for low-cost machinable ceramics.

Optimization of Lightened Fiber-Reinforced Composite City & Trekking Bicycle Frame (섬유강화복합재료를 사용한 일반용 경량화 자전거 프레임의 최적설계)

  • Yoon, Won Sok;Kim, Do Hyung;Kim, Hak Sung
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.40 no.2
    • /
    • pp.147-156
    • /
    • 2016
  • In this paper, optimal designs of bicycle frame were studied for weight reduction of bicycle using carbon-fiber-reinforced plastic (CFRP), glass-fiber-reinforced plastic (GFRP) and Kevlar-fiber-reinforced plastic (KFRP), respectively. Based on the anisotropic properties of FRP material, stacking angle and thickness optimization were performed under the safety reference of European committee for standardization (CEN) to ensure the stability of bicycle frame. Finally, performances of FRP bicycle frame was evaluated by digital logic method based on the optimized results of weight, strength properties and cost. Then, the optimized bicycle frame composed of each FRPs were evaluated and ranked by total performance values.

Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding

  • Kim, Yoo-Sun;Zhang, Shuye;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.22 no.1
    • /
    • pp.35-41
    • /
    • 2015
  • In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

Study on the Prediction of the Occurrence and Distribution of the Microcracks in Rock (암석의 미세균열의 발달과 분포의 예측방법에 관한 연구)

  • 백환조;김덕현;최성범
    • Tunnel and Underground Space
    • /
    • v.8 no.3
    • /
    • pp.226-233
    • /
    • 1998
  • Microcracks in rock materials, whether natural or induced, provide useful information on the engineering performance of in situ rockmasses. A population of preferentially oriented microcracks has observable effects on the physical properties of a rockmass, but their effects may not be evident if the rock material is highly anisotropic due to other causes. An experimental program was undertaken to investigate the effect of rock fabrics on the physical properties of rock materials. In this study, anisotropy in the circumferential wave velocity and the direction of induced fractures under axial point loading were measured. Rock specimens (NX-size) of the leucocractic Pocheon granite were cored from rock blocks, retaining the relative directions of each specimen. Another set of specimens was prepared from the rock cores of the same meterial, obtained in the field. The master orientation line (MOL) was set to be the representative direction of the microcracks in the specimen. Variation of the circumferential wave velocity of each specimen was then measured along the core, keeping the MOL as reference. The direction of the minimum wave velocity was nearly perpendicular to the direction of the MOL. Coring of smaller-sized (EX-size), concentric specimens from the NX specimens were then followed, and axial point loading was applied. The direction of induced fractures due to axial point loading was closely related to the MOL direction, confirming the prior test result.

  • PDF

Finite Element Analysis of a Customized Eyeglass Frame Fabricated by 3D Printing (3 차원 프린팅으로 제작된 개인맞춤형 안경테의 유한요소해석)

  • Lee, Ji-Eun;Im, Young-Eun;Park, Keun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.40 no.1
    • /
    • pp.65-71
    • /
    • 2016
  • In recent years, 3D printing has received increasing attention due to releases of low-cost 3D printers based on open-source platform. 3D printing is expected to reduce the barrier to entry in the traditional manufacturing processes by increasing flexibility and creating an advantage to manufacture customized products at low costs. In this study, a unique eyeglass frame was designed to have a snake shape, which has an asymmetric geometry unlike traditional frames. The eyeglass frame was designed in a customized manner by reflecting dimensional characteristics of a customer's face. Finite element analysis was performed to investigate the structural safety of the 3D printed frames during the assembly process. The analysis also considered the effect of anisotropic material properties as determined by tensile tests. The eyeglass frame was then printed using the customized sizes and the best building process. The eyeglass frame was successfully assembled with lenses and without structural failure during its assembly procedure.

Recognition of damage pattern and evolution in CFRP cable with a novel bonding anchorage by acoustic emission

  • Wu, Jingyu;Lan, Chengming;Xian, Guijun;Li, Hui
    • Smart Structures and Systems
    • /
    • v.21 no.4
    • /
    • pp.421-433
    • /
    • 2018
  • Carbon fiber reinforced polymer (CFRP) cable has good mechanical properties and corrosion resistance. However, the anchorage of CFRP cable is a big issue due to the anisotropic property of CFRP material. In this article, a high-efficient bonding anchorage with novel configuration is developed for CFRP cables. The acoustic emission (AE) technique is employed to evaluate the performance of anchorage in the fatigue test and post-fatigue ultimate bearing capacity test. The obtained AE signals are analyzed by using a combination of unsupervised K-means clustering and supervised K-nearest neighbor classification (K-NN) for quantifying the performance of the anchorage and damage evolutions. An AE feature vector (including both frequency and energy characteristics of AE signal) for clustering analysis is proposed and the under-sampling approaches are employed to regress the influence of the imbalanced classes distribution in AE dataset for improving clustering quality. The results indicate that four classes exist in AE dataset, which correspond to the shear deformation of potting compound, matrix cracking, fiber-matrix debonding and fiber fracture in CFRP bars. The AE intensity released by the deformation of potting compound is very slight during the whole loading process and no obvious premature damage observed in CFRP bars aroused by anchorage effect at relative low stress level, indicating the anchorage configuration in this study is reliable.

The Electrochemical Properties on the Silver Doped Vanadium Oxide Xerogel (미량의 은이 첨가된 바나듐산화물 전극)

  • Park Heai-Ku;Kim, Gun-Tae;Lee, Man-Ho
    • Journal of the Korean Electrochemical Society
    • /
    • v.5 no.1
    • /
    • pp.1-6
    • /
    • 2002
  • Silver doped vanadium pentoxides with a doping ratio Ag/V ranging from 0.03 to 0.11 were synthesized by sol-gel process, and $Li/Ag_xV_2O_5$ cell was investigated by the electrochemical methods. It appears to be amorphous layered material and entangled fibrous textures has been grown to form anisotropic corrugated fibrils. NMR measurements revealed that several different kinds of $Li^+$ ions exist in the lithium intercalated xerogel electrodes and the average cell potential was about 3.0V vs. $Li/Li^+$. The cell capacity of the silver doped $Ag_xV_2O_5$ xerogel cathodes was more than 359 mAh/g at discharge current 10mA/g and cycle efficiency $94\%$ was achieved.

Strength Prediction Model of Rapid Prototyping Parts - Fused Deposition Modeling (FDM) (쾌속조형재료의 강도예측모델 - Fused Deposition Modeling (FDM))

  • 안성훈;이선영;백창일;추원식
    • Composites Research
    • /
    • v.15 no.6
    • /
    • pp.38-43
    • /
    • 2002
  • Rapid Prototyping(RP) technologies provide the ability to fabricate initial prototypes from various model materials. Stratasys' Fused Deposition Modeling(FDM) is a typical RP process that can fabricate prototypes out of plastic materials, and the parts made from FDM were often used as load-carrying elements. Because FDM deposits materials in about 300$\mu$m thin filament with designated orientation, parts made from FDM show anisotropic material properties. In this paper an analytic model was proposed to predict the tensile strength of FDM parts. Applying the Classical Lamination Theory, which was developed for laminated composite materials, a computer code was implemented. Tsai-Wu failure criterion was added to the code to predict the failure of the FDM parts. The tensile strengths predicted by the analytic model were compared with experimental data. The data and prediction agreed reasonably well to prove the validity of the model. In addition, a web-based advisory service(FDMAS) was developed to provide strength prediction and design rules for FDM parts.

Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions

  • Paik, Kyung-Wook;Yim, Myung-Jin
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 2000.04a
    • /
    • pp.9-15
    • /
    • 2000
  • Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

  • PDF

Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions

  • Paik, Kyung-Wook;Yim, Myung-Jin
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.7 no.1
    • /
    • pp.41-49
    • /
    • 2000
  • Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

  • PDF