• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.9
• /
• pp.794-797
• /
• 2002

Piezoelectric properties of PZT-PSN ceramics were investigated as a function of WO$_3$ addition from 0 wt% to 6.0 wt%. The dielectric and piezoelectric characteristics of PZT-PSN ceramics have been investigated at different calcination (80$0^{\circ}C$~90$0^{\circ}C$) and sintering (110$0^{\circ}C$~130$0^{\circ}C$) temperatures. The grain size was increased with the addition of WO$_3$and the sintering temperatures. Anisotropic properties of electromechanical coupling coefficient and piezoelectric coefficient are proven to be dependent on processing temperatures and amount of addition. At the specimen with 0.6 wt% WO$_3$ addition, using calcination temperature of 80$0^{\circ}C$ and sintering temperature of 110$0^{\circ}C$ , mechanical quality factor(Q$_{m}$) and electromechanical coupling coefficient(k$_{p}$) showed the excellent results of 1560 and 0.48, respectively Experimental results indicated that the PZT-PSN system ceramics with WO$_3$impurity could be effectively used for the microtransformer and actuator applications, etc.etc.

• Applied Microscopy
• /
• v.50
• /
• pp.25.1-25.11
• /
• 2020

Scanning acoustic microscopy (SAM) or Acoustic Micro Imaging (AMI) is a powerful, non-destructive technique that can detect hidden defects in elastic and biological samples as well as non-transparent hard materials. By monitoring the internal features of a sample in three-dimensional integration, this technique can efficiently find physical defects such as cracks, voids, and delamination with high sensitivity. In recent years, advanced techniques such as ultrasound impedance microscopy, ultrasound speed microscopy, and scanning acoustic gigahertz microscopy have been developed for applications in industries and in the medical field to provide additional information on the internal stress, viscoelastic, and anisotropic, or nonlinear properties. X-ray, magnetic resonance, and infrared techniques are the other competitive and widely used methods. However, they have their own advantages and limitations owing to their inherent properties such as different light sources and sensors. This paper provides an overview of the principle of SAM and presents a few results to demonstrate the applications of modern acoustic imaging technology. A variety of inspection modes, such as vertical, horizontal, and diagonal cross-sections have been presented by employing the focus pathway and image reconstruction algorithm. Images have been reconstructed from the reflected echoes resulting from the change in the acoustic impedance at the interface of the material layers or defects. The results described in this paper indicate that the novel acoustic technology can expand the scope of SAM as a versatile diagnostic tool requiring less time and having a high efficiency.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.48 no.5
• /
• pp.363-372
• /
• 2020

Dynamic compressive material properties at high strain rates is essential for improving the reliability of finite element analysis in dynamic environments, such as high-speed collisions and high-speed forming. In general, the dynamic compressive material properties for high strain rates can be obtained through SHPB equipment. In this study, SHPB equipment was used to acquire the dynamic compressive material properties to cope with the collision analysis of Woven tpye CFRP material, which is being recently applied to unmanned aerial vehicles. It is also used as a pulse shaper to secure a constant strain rate for materials with elastic-brittle properties and to improve the reliability of experimental data. In the case of CFRP material, since the anisotropic material has different mechanical properties for each direction, experiments were carried out by fabricating thickness and in-plane specimens. As a result of the SHPB test, in-plane specimens had difficulty in securing data reproducibility and reliability due to fracture of the specimens before reaching a constant strain rate region, whereas in the thickness specimens, the stress consistency of the specimens was excellent. The data reliability is high and a constant strain rate range can be obtained. Through finite element analysis using LS-dyna, it was confirmed that the data measured from the pressure rod were excessively predicted by the deformation of the specimen and the pressure rod.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.28 no.9
• /
• pp.1408-1414
• /
• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• The Journal of the Acoustical Society of Korea
• /
• v.36 no.4
• /
• pp.247-253
• /
• 2017

Generally, the vibration characteristics of refractory ceramics are identified by assuming them as isotropic materials. However, in practice, refractory ceramics exhibit anisotropic properties as they are manufactured by pressing ceramic powders along a particular direction. Therefore, in this research, the frequency responses of a refractory ceramic brick along its width, length, and height directions were acquired using finite element analysis by assuming that the ceramics had tetragonal symmetry in their material properties. The validity of the numerical analysis results was verified by comparing them with those from experimental measurements. Based on the frequency response, the thicknesses of the refractory brick along three different directions were estimated using the impact-echo technique. The maximum difference between the estimated and actual thicknesses was observed to be less than 5 %. This result confirms the effectiveness of the impact-echo technique along with anisotropic property characterization to evaluate the thickness of the refractory ceramic.

• Textile Coloration and Finishing
• /
• v.26 no.4
• /
• pp.305-310
• /
• 2014

In this study, we presented a newly synthesized pyrene-naphthalene diimide(NDI)-pyrene triad. The optical and structural properties were examined using various characterization techniques. A donor-acceptor-donor triad molecule exhibited a strong charge transfer, though there existed neither intramolecular nor intermolecular hydrogen bonding sites, due to the formation of preferential complementary complex between pyrene and NDI. Powder XRD measurement revealed a sharp and distinctive X-ray patterns, indicating the presence of microcrystalline-like structure. POM images showed anisotropic fingerprint texture similar to that of cholesteric phase, and SEM images showed numerous columnar structures with length of 1 to $10{\mu}m$. Above observation clearly demonstrated that ${\pi}$-complementary NDI-pyrene interactions in the traid was strong enough to form columnar aggregates in the long range.

• Tribology and Lubricants
• /
• v.33 no.3
• /
• pp.106-111
• /
• 2017

Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.

• Journal of Powder Materials
• /
• v.18 no.5
• /
• pp.443-448
• /
• 2011

The HDDR(hydrogenation-disproportionation-desorption-recombination) process can be used as an effective way of converting no coercivity Nd-Fe-B material, with a coarse $Nd_2Fe_{14}B$ grain structure to a highly coercive one with a fine grain. Careful control of the HDDR process can lead to an anisotropic $Nd_2Fe_{14}B$ without any post aligning process. In this study, the effect of hydrogen gas input at various temperature in range of $200{\sim}500^{\circ}C$ of hydrogenation stage (named Modified-solid HDDR, MS-HDDR) on the magnetic properties has been investigated. The powder from the modified-solid HDDR process exhibits Br of 11.7 kG and iHc of 10.7 kOe, which are superior to those of the powder prepared using the normal HDDR process.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.21 no.1
• /
• pp.154-163
• /
• 1997

Thermally-induced deformation in SMC(Sheet Molding Compound) products is analyzed using three dimensional finite element method. Planar fiber orientation, which causes the anisotropic material properties, is calculated through the flow analysis during the compression stage of the mold. Also curing process is analyzed to predict temperature profile which has significant effects on warpage of SMC products. Through the developed procedure, effects of various process conditions such as charge location, mold temperature, fiber contents, and fiber orientations on deformation of final products are studied. and processing strategies are proposed to reduce the warpage and the shrinkage.

• Proceedings of the KSR Conference
• /
• 2003.10b
• /
• pp.579-584
• /
• 2003

In this study, anisotopic yield function is proposed for the numerical analysis of reinforced tunnel ground with grouting. For this, material properties of the reinforced ground both by equilibrium as well as kinematic condition along the interface and by the mean field theory of Eshelby (1957) and Zhao (1990) are compared with each other and, as a result, the advantage/disadvantage of the proposed models are summarized. Finally, reinforced ground around tunnel with grouting is analyzed numerically. A new anisotropic yield function model is shown to be more reliable than the previous one and the predicted result is agreeable with the experimental data available.