• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.385-387
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• 1994

Optical interconnections are more attractive than electronic interconnections because of their higher speed, freedom from planar constraints, immunity to electromagnetic interference effects and higher interconnection capacity. Volume hologram is one of the best way to implement optical interconnections. Diffraction efficiency and crosstalk effect are very important things for ensuring independent interconnections. Recently, a general systematic method that can handle a large number of superposed volume gratings in anisotropic host material is presented. In this study for numerical analysis of diffraction, above method is programmed in general form near Bragg angle. Diffraction orders for variation of grating strength are determined by comparing with the coupled-mode method. The effects of parameter variation are considered. Parameters include vertical and azimuthal incident angle, wavelength and interaction length. Diffraction analyses are also performed for intra-mode and inter-mode diffractions.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.10-15
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• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

• Steel and Composite Structures
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• v.47 no.6
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• pp.693-707
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• 2023

This article investigates the static thermo-mechanical response of anisotropic thick laminated composite plates on Visco-Pasternak foundations under various thermal load conditions (linear, non-linear, and uniform) along the transverse direction (thickness) of the plate, while keeping the mechanical load constant. The governing equations, which represent the thermo-mechanical behavior of the composite plate, are derived from the principle of virtual displacements. Using Navier's type solution, these equations are solved for the composite plate with simply supported condition. The Visco-Pasternak foundation type is included by considering the impact of the damping on the classical foundation model, which is modeled by Winkler's linear modulus and Pasternak's shear modulus. The excellent accuracy of the present solution is confirmed by comparing the results with those available in the literature. The study investigates the impact of geometric ratios, thermal expansion coefficient ratio, damping coefficient and foundation parameters on the thermo-mechanical flexural response of the composite plate. Overall, this article provides insights into the behavior of composite plates on visco-Pasternak foundations and may be useful for designing and analyzing composite structures in practical applications.

• Polymer(Korea)
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• v.34 no.3
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• pp.191-197
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• 2010

To improve the curing method of anisotropic conductive film (ACF) at low temperature, it was studied to replace the thermal latent curing agent of imidazole compounds by the curing agent of cationically initiating type. Thermo-mechanical properties such as glass transition temperature, storage modulus, and coefficient of thermal expansion were investigated for the analysis of curing behavior. The reliability of ACF were observed in thermal cycle and high temperature-high humidity test. ACF using cationic initiator showed faster curing, lower CTE, and higher $T_g$ than the case of using imidazole curing agent, which is important for the high temperature stability. Furthermore, ACF using cationic initiator maintained a stable contact resistance in reliability test, although it was cured at low temperature and fast rate. With these results, it was confirmed that the curing method of epoxy had great effect on thermo-mechanical properties and reliability of ACF.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.4
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• pp.347-355
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• 2014

Thermal problems that are directly related to the lifetime of an electronic device are becoming increasingly important owing to the miniaturization of electronic devices. To solve thermal problems, it is essential to study thermal stability through thermal diffusion and insulation. A honeycomb sandwich plate has anisotropic thermal conductivity. To analyze the thermal deformation and temperature distribution of a system that employs a honeycomb sandwich plate, the thermal and elastic properties need to be determined. In this study, the thermal and elastic properties of a honeycomb sandwich plate, such as thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and shear modulus, are predicted. The properties of a honeycomb sandwich plate vary according to the hexagon size, thickness, and material properties.

• Composites Research
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• v.25 no.4
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• pp.117-125
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• 2012

Warpage of the film insert molded (FIM) part is caused by an asymmetric residual stress distribution. Asymmetric residual stress and temperature distribution is generated by the retarded heat transfer in the perpendicular direction to the attached film surface. Since warpage was not prevented by controlling injection molding conditions, glass fiber (GF) filled composites were employed as substrates for film insert molding to minimize the warpage. Distribution of short GFs was evaluated by using micro-CT equipment. Proper models for micro mechanics, anisotropic thermal expansion coefficients, and closure approximation should be selected in order to calculate fiber orientation tensor and warpage of the FIM part with the composite substrate. After six kinds of micro mechanics models, three models of the thermal expansion coefficient and five models of the closure approximation had been considered, the Mori-Tanaka model, the Rosen and Hashin model, and the third orthotropic closure approximation were selected in this study. The numerically predicted results on fiber orientation tensor and warpage were in good agreement with experimental results and effects of GF reinforcement on warpage of the FIM composite specimen were identified by the numerical results.

• The Bulletin of The Korean Astronomical Society
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• v.41 no.1
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• pp.38.2-38.2
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• 2016

The mapping of dark matter clustering from real to redshift spaces introduces the anisotropic property to the measured density power spectrum in redshift space, known as the Redshift Space Distortion (hereafter RSD) effect. The mapping formula is intrinsically non-linear, which is complicated by the higher order polynomials due to the indefinite cross correlations between the density and velocity fields, and the Finger-of-God (hereafter FoG) effect due to the randomness of the peculiar velocity field. Furthermore, the rigorous test of this mapping formula is contaminated by the unknown non-linearity of the density and velocity fields, including their auto- and cross-correlations, for calculating which our theoretical calculation breaks down beyond some scales. Whilst the full higher order polynomials remains unknown, the other systematics can be controlled consistently within the same order truncation in the expansion of the mapping formula, as shown in this paper. The systematic due to the unknown non-linear density and velocity fields is removed by separately measuring all terms in the expansion using simulations. The uncertainty caused by the velocity randomness is controlled by splitting the FoG term into two pieces, 1) the non-local FoG term being independent of the separation vector between two different points, and 2) the local FoG term appearing as an indefinite polynomials which is expanded in the same order as all other perturbative polynomials. Using 100 realizations of simulations, we find that the best fitted non-local FoG function is Gaussian, with only one scale-independent free parameter, and that our new mapping formulation accurately reproduces the observed power spectrum in redshift space at the smallest scales by far, up to k ~ 0.3 h/Mpc, considering the resolution of future experiments.

• Structural Engineering and Mechanics
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• v.7 no.2
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• pp.181-202
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• 1999

Dynamic response of axisymmetric arbitrary laminated composite cylindrical shell of finite length, using three-dimensional elasticity equations are studied. The shell is simply supported at both ends. The highly coupled partial differential equations are reduced to ordinary differential equations (ODE) with variable coefficients by means of trigonometric function expansion in axial direction. For cylindrical shell under dynamic load, the resulting differential equations are solved by Galerkin finite element method, In this solution, the continuity conditions between any two layer is satisfied. It is found that the difference between elasticity solution (ES) and higher order shear deformation theory (HSD) become higher for a symmetric laminations than their unsymmetric counterpart. That is due to the effect of bending-streching coupling. It is also found that due to the discontinuity of inplane stresses at the interface of the laminate, the slope of transverse normal and shear stresses aren't continuous across the interface. For free vibration analysis, through dividing each layer into thin laminas, the variable coefficients in ODE become constants and the resulting equations can be solved exactly. It is shown that the natural frequency of symmetric angle-ply are generally higher than their antisymmetric counterpart. Also the results are in good agreement with similar results found in literatures.

• Structural Engineering and Mechanics
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• v.63 no.3
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• pp.269-280
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• 2017

One major concern that has occupied the mind of the designers is a structural failure as result of stress concentration in the geometrical discontinuities. Understanding the effective parameters contribute to stress concentration and proper selection of these parameters enables the designer get to a reliable design. In the analysis of perforated isotropic and orthotropic plates, the effective parameters on stress distribution around holes include load angle, curvature radius of the corner of the hole, hole orientation and fiber angle for orthotropic materials. This present paper tries to examine the possible effects of these parameters on stress analysis of infinite perforated plates with central quasi-square hole applying grey wolf optimizer (GWO) inspired by the particular leadership hierarchy and hunting behavior of grey wolves in nature, and also the present study tries to introduce general optimum parameters in order to achieve the minimum amount of stress concentration around this type of hole on isotropic and orthotropic plates. The advantages of grey wolf optimizer are stout, flexible, simple, and easy to be enforced. The used analytical solution is the expansion of Lekhnitskii's solution method. Lekhnitskii applied this method for the stress analysis of anisotropic plates containing circular and elliptical holes. Finite element numerical solution is employed to examine the results of present analytical solution. Results represent that by selecting the aforementioned parameters properly, fewer amounts of stress could be achieved around the hole leading to an increase in load-bearing capacity of the structure.