• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 추계학술대회 논문집
• /
• pp.915-918
• /
• 1997

An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of pipe. In this paper, an abrasive circulation system was designed and manufactured. As a result, it was found that a fine inner surface abrasive of pipe was available by the use of this machining methods. The basic machining characteristics of pin-type magnetic tools were analyzed experimentally. In addition, the experimental results show that we can realize that pin-type magnetic tools have more machining efficiency than iron particles as magnetic tools.

• 한국콘크리트학회:학술대회논문집
• /
• 한국콘크리트학회 2005년도 추계 학술발표회 제17권2호
• /
• pp.757-760
• /
• 2005

In this study, glass abrasive sludge was utilized for a light weight material and graphite was used as expanding agent. The glass abrasive sludge with added expanding agent was formed into pellet by a pelletizer. When glass abrasive sludge is made as pellet, water glass is added as a binder(water : water glass = 8 : 2). The pellet was sintered at $700\~800^{\circ}C$ by rotary kiln composed of 4 segment temp. system. The absorption ratio of lightweight materials tended to increase in proportion to increasing content of graphite. The lowest value of specific gravity that was observed in this study was $1.8\%$.

• 한국정밀공학회지
• /
• 제14권10호
• /
• pp.68-74
• /
• 1997

The surface finishing system using the micro abrasive film was designed and manufactured to make the mirror surface of the cylindrical workpices. An experimental study of srface finishing was carried out to investigate the performance of mirror surface finishing system. The surface roughness value of stainless steel was about 0.2 .approx. 0.25 .mu. m Rmax, 0.02 .approx. 0.04 .mu. m Ra, using abrasive grain size of 12, 9 .mu. m. The surface roughness value of chrome coated workpiece was about 0.07 .approx. 0.11 .mu. m Ra using abrasive grain size 3 .mu. m. In the same condition, the chrome coated workpiece has obtained better surface roughness charateristics than the one of stainless steel.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
• /
• pp.140-143
• /
• 2004

Chemical mechanical polishing(CMP) is essential technology to secure the depth of focus through the global planarization of wafer. But a variety of defects such as contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects increase the resistance because they decrease the interconnect section area, and ultimately reduce the life time of the semiconductor. Due to this dishing and erosion must be prohibited. The pattern density and size in chip have a significant influence on dishing and erosion occurred over-polishing. Decreasing of abrasive concentration results in advanced pattern selectivity which can lead the uniform removal in chip and decrease of over-polishing. The fixed abrasive pad was applied and tested to reduce dishing and erosion in this paper. Consequently, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with proposed fixed abrasive pad and chemicals.

• 한국세라믹학회지
• /
• 제43권5호
• /
• pp.277-283
• /
• 2006

A porous material with a surface layer was fabricated from glass abrasive sludge and expanding agents. The glass abrasive sludges were mixed with expanding agents and compacted into precursors. These precursors were sintered in the range of $700-900^{\circ}C$ for 20 min. The sintered porous materials had a surface layer with smaller pores and inner parts with larger pores. The surface layer and closed pores controlled water absorption. As the expanding agent fraction and the sintering temperature increased, the porosity and pore size increased. The porous materials with $Fe_2O_3$ and graphite as the expanding agents had a low absorption ratio of about 3% or lower while the porous material with $CaCO_3$ as the expanding agent had a higher absorption ratio and more open pores.

• 한국전기전자재료학회논문지
• /
• 제17권10호
• /
• pp.1041-1048
• /
• 2004

Chemical mechanical polishing (CMP) process was studied in terms of tribology in this paper. CMP performed by the down force and the relative motion of pad and wafer with slurry is typically tribological system composed of friction, wear and lubrication. The piezoelectric quartz sensor for friction force measurement was installed and the friction force was detected during CMP process. Various friction signals were attained and analyzed with the kind of pad, abrasive and abrasive concentration. As a result of experiment, the lubrication regime is classified with ηv/p(η, v and p; the viscosity, relative velocity and pressure). The characteristics of friction and material removal mechanism is also different as a function of the kind of abrasive and the abrasive concentration in slurry. Especially, the material removal per unit distance is directly proportional to the friction force and the non~uniformity has relation to the coefficient of friction.

• 한국정밀공학회지
• /
• 제22권2호
• /
• pp.38-45
• /
• 2005

Chemical mechanical polishing(CMP) has been widely accepted for the planarization of multi-layer structures in semiconductor fabrication. But a variety of defects such as abrasive contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects increase the metal resistance because they decrease the interconnect section area, and ultimately reduce the lift time of the semiconductor. Due to this reason dishing and erosion must be prohibited. The pattern density and size in chip have a significant influence on dishing and erosion occurred by over-polishing. The fixed abrasive pad(FAP) was applied and tested to reduce dishing and erosion in this paper. The abrasive concentration decrease of FAP results in advanced pattern selectivity which can lead the uniform removal in chip and declining over-polishing. Consequently, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with proposed FAP and chemicals.

• Advances in concrete construction
• /
• 제9권4호
• /
• pp.367-374
• /
• 2020

Concrete surfaces, industrial floors, sidewalks, roads and parking lots are typically subjected to abrasions. Many studies indicated that the abrasion resistance is directly related to the ultimate strength of the cured concrete. Chemical reactions, freeze-thaw cycles, and damages under abrasion are among many factors negatively affecting the concrete strength and durability. One of the major solutions to address the abrasive resistance of the concrete is to use fibers. Fibers are used in the concrete mix to improve the mechanical properties, strength and limit the crack propagations. In this study, implementation of the steel fibers in concrete to enhance the abrasive resistance of the concrete is investigated in details. The abrasive resistance of the concrete with and without steel fibers is studied with the sandblasting technique. For this purpose, different concrete samples are made with various hooked steel fiber ratios and investigated with the sandblasting method for two different strike angles. In total, 144 ASTM verified cube samples are investigated and it is shown that those samples with the highest steel fiber ratios have the highest abrasive resistance. In addition, the experiments determine that there is a meaningful correlation between the steel fiber percentage in the mix, strike angle and curing time which could be considered for improving structural behavior of the fiber-reinforced concrete.

• 박물관보존과학
• /
• 제6권
• /
• pp.31-37
• /
• 2005

국립중앙박물관에서 2002년도에 구입한 동제금은입사향로는 전체적으로 표면의 부식이 심하여 은상감된 부분의 식별이 어려운 상태였으나, 알루미나를 이용한 Abrasive method로 상감된 화려한 문양들을 표출해 주었다. Abrasive method를 적용하기에 앞서 대상물질에 대한 조사를 실시하였고 유물에 손상이 적고 표면을 균일하게 표출할 수 있는 물질을 적용하였다. 또한 X-선 조사를 통하여 전체적인 향로의 상태를 점검하였고, 비파괴X-선형광분석을 실시하여 금·은입사 등의 성분조성을 확인하였다. 이러한 결과는 향후 우리나라 금은입사향로를 연구하는데 귀중한 자료가 될 것이다.

• 한국정밀공학회지
• /
• 제27권8호
• /
• pp.91-97
• /
• 2010

Micro-abrasive Jet Machining is one of the new technology which enables micro-scale machining on the surface of high brittle materials. In this technology it is very important to fabricate a mask that prevents excessive abrasives not to machine un-intend surface. Our previous work introduced the micro-stereolithography technology for the mask fabrication. And is good to not only planar material but also for non-planar materials. But the technology requires a 3 dimensional mask CAD model which is perfectly matched with the surface topology of parent material as an input. Therefore there is strong need to develop an automated modeling technology which produce adequate 3D mask CAD model in fast and simple way. This paper introduces a fast and simple mask modeling algorithm which represents geometry of models in voxel. Input of the modeling system is 2D pattern image, 3D CAD model of parent material and machining parameters for Micro-abrasive Jet Machining. And the output is CAD model of 3D mask which reflects machining parameters and geometry of the parent material. Finally the suggested algorithm is implemented as software and verified by some test cases.