• 동력기계공학회지
• /
• 제10권1호
• /
• pp.46-51
• /
• 2006

Present study was investigated the effect of the particle of the counterface of unidirectional carbon fiber reinforced composite. The friction coefficient of composite and the specific wear rate different sliding velocity were measured for this materials. The friction track of counterface was observed by an optical microscope and scanning electron microscope. There were insignificant effects of the specific wear rate under lower Sic abrasive particle, however it showed high effect on $30{\mu}m$ abrasive particle size. There were significant effects of friction and wear behavior of the fiber direction under 0.3m/s sliding speed. Major failure mechanisms can be classified such as microfracture, plowing, microcutting, cutting and cracking.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2002년도 추계학술대회 논문집
• /
• pp.241-244
• /
• 2002

Deburring is conducted using MAF(magnetic abrasive finishing) method. Magnetic inductor is designed and manufactured to generate proper magnetic induction far deburring the burr formed in drilling SM45C. Rotational speed, table feed rate, grain size of powder and working gap are changed to investigate the effect on deburring.

• 소성∙가공
• /
• 제15권7호
• /
• pp.518-523
• /
• 2006

Wet wire drawing of brass coated steel wire, used for tire reinforcement, is realized with Tungsten Carbide(WC) dies sintered with a cobalt(Co) binder. Dies wear represents an important limitation to the production process and cost savings. Several parameters, such as Co content, WC grain size of tungsten carbide, sintering conditions, and so on, affect on the wear of the drawing die. In this study, the effect of the diamond abrasive particle size on the life of the WC centered dies of the wet wire drawing was investigated. Wet wire drawing experiments were carried out on a wet wire drawing machine. From the experiments, the dies life, dies fracture, wire surface roughness, and wire breaks were investigated. From the results, it was found that the wear of the WC dies increased with the increase in the diamond abrasive particle size.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2002년도 춘계학술대회 논문집
• /
• pp.964-967
• /
• 2002

An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of pipe. In this paper, another method of magnetic abrasive machining in which the N and S magnetic poles are feed and a workpiece is rotated only is tried in a fine-pipe, and its finishing characteristics is experimently investigated by various effective factors such as feeding amplitude. From the experimental results, it is found that the feed effects of magnetic poles on the finishing characteristics are large in internal finishing.

• Journal of Welding and Joining
• /
• 제27권3호
• /
• pp.80-84
• /
• 2009

The Plasma Transferred Arc (PTA) overlay welding method is lately introduced as one of the most useful surface overlay method of the engine component. In this paper, the overlay welding on the SNCrW heat resisting alloy was conducted by the PTA overlay welding process using the super alloy powder. The characteristics of the overlay layers were investigated through the metallurgical and abrasive test. Experimental results showed that the overlay on the SNCrW heat resisting alloy surface was successfully made without hot cracking. The friction wear characteristics of the Co-base Stellite 6 overlayer were most superior. However the abrasive wear characteristics were most inferior in the Co-base Stellite 6 overlayer.

• 한국정밀공학회지
• /
• 제15권2호
• /
• pp.53-60
• /
• 1998

In this study, it is experimented to find factors effecting surface roughness using the system of experiments. in the mirror surface finishing system. (1) The film feed and oscillation frequency in $40{\mu}m$ abrasive film, grinding speed in $30{\mu}m$, and machining time in $15{\mu}m$15 are the main factors effecting the surface roughness. (2) Applying the optimal finishing condition to $40{\mu}m$, $30{\mu}m$, $15{\mu}m$ abrasive finishing film in sequence, it is possible to obtian about Ra 10 nm surface roughness on SM45C workpiece. (3) Application of the system of experments to the micro abrasive grain film finishing was very effective method in the extraction of main factor and optimal condition.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2003년도 춘계학술대회 논문집
• /
• pp.1873-1876
• /
• 2003

Magneto-rheological polishing is a new technology used in precision polishing. It utilizes magneto-rheological fluid. nonmagnetic polishing abrasive, aqueous carrier fluids in magnetic field to remove material from a part surface. Silicon micro channel as work piece is fixed in the slurry which is made of MR fluid and CeO$_2$(10 vol%) abrasive particles. And permanent magnet rotate in the slurry to transfers magnetic force to abrasive particles by increasing yield strength of MR fluid. so, the obtained bottom surface roughness of micro channel by experiment reduced to Ra 0.010 $\mu\textrm{m}$ Rmax 0.103 $\mu\textrm{m}$ and finwall surface roughness of micro channel reduced to Ra 0.018 $\mu\textrm{m}$ Rmax 0.468 $\mu\textrm{m}$. At optimum conditions of variables, the workpiece as silicon micro channel have about 24 times smaller surface roughness than before polishing.

• 반도체디스플레이기술학회지
• /
• 제10권3호
• /
• pp.49-52
• /
• 2011

This paper shows the results of classical molecular dynamics modeling for the interaction between spherical nano abrasive and substrate in chemical mechanical polishing processes. Atomistic modeling was achieved from 3-dimensional molecular dynamics simulations using the Morse potential functions for chemical mechanical polishing. The abrasive dynamics was modeled by three cases, such as slipping, rolling, and rotating. Simulation results showed that the different dynamics of the abrasive results the different features of surfaces. The simulation concerning polishing pad, abrasive particles and the substrate has same results.

• Tribology and Lubricants
• /
• 제35권5호
• /
• pp.274-285
• /
• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• 한국전기전자재료학회논문지
• /
• 제18권9호
• /
• pp.803-809
• /
• 2005

Cerium ammonium nitrate (CAN) and nitric acid was used an etchant and an additive for Ru etching and polishing. pH and Eh values of the CAN and nitric acid added chemical solution satisfied the Ru etching condition. The etch rate increased linearly as the concentration of CAN increased. Nitric acid added solution had the high etch rate. But micro roughness of etched surfaces was not changed before and after etching, The removal rate of Ru film was the highest in $1wt\%$ abrasive added slurry, and not increased despite the concentration of alumina abrasive increased to $5wt\%$. Even Ru film was polished by only CAN solution due to the friction. The highest removal rate of 120nm/min was obtained in 1 M nitric acid and $1wt\%$ alumina abrasive particles added slurry. The lowest micro roughness value was observed in this slurry after polishing. From the XPS analysis of etched Ru surface, oxide layer was founded on the etched Ru surface. Therefore, Ru was polished by chemical etching of CAN solution and oxide layer abrasion by abrasive particles. From the result of removal rate without abrasive particle, the etching of CAN solution is more dominant to the Ru CMP.