• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.63-70
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• 2004

The structural, electrical properties of $(Ba, Sr)TiO_3[BSTO]/RuO_2$ thin films were examined by the addition of amorphous BSTO layer between crystlline BSTO film and $RuO_2$ substrate. We prepared BSTO films with double-layered structure, that is, amorphous layers deposited at $60^{\circ}C$ and crystalline films. Crystalline films were prepared at 550 on amorphous BSTO layer. The thickness of the amorphous layers was varied from 0 to 170 nm. During the deposition of crystalline films, the crystallization of the amorphous layers occurred and the structure was changed to circular while crystalline BSTO films showed columnar structure. Due to insufficient annealing effect, amorphous BSTO phase was observed when the thickness of the amorphous layers exceeded 30 nm. Amorphous BSTO layer could also prevent the formation of oxygen deficient region in $RuO_2$ surface. Leakage current of total BSTO films decreased with increasing amorphous layer thickness due to structural modifications. Dielectric constant showed maxi-mum value of 343 when amorphous layer thickness was 30 nm at which the improvement by grain growth and the degradation by amorphous phase were balanced.

• 전기학회논문지
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• 제65권10호
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• pp.1702-1705
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• 2016

We propose a novel hydrogen-reduced p-type amorphous silicon oxide buffer layer between $TiO_2$ antireflection layer and p-type silicon window layer of silicon thin film solar cells. This new buffer layer can protect underlying the $TiO_2$ by suppressing hydrogen plasma, which could be made by excluding $H_2$ gas introduction during plasma deposition. Amorphous silicon oxide thin film solar cells with employing the new buffer layer exhibited better conversion efficiency (8.10 %) compared with the standard cell (7.88 %) without the buffer layer. This new buffer layer can be processed in the same p-chamber with in-situ mode before depositing main p-type amorphous silicon oxide window layer. Comparing with state-of-the-art buffer layer of AZO/p-nc-SiOx:H, our new buffer layer can be processed with cost-effective, much simple process based on similar device performances.

• Journal of Ceramic Processing Research
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• 제13권spc2호
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• pp.336-340
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• 2012

Wide band gap p-type hydrogenated amorphous silicon oxide (a-SiO:H) buffer layer has been used at the interface of transparent conductive oxide (TCO) and hydrogenated amorphous silicon (a-Si:H) p-type layer of a p-i-n type a-Si:H solar cell. Introduction of 5 nm thick buffer layer improves in blue response of the cell along with 0.5% enhancement of photovoltaic conversion efficiency (η). The cells with buffer layer show higher open circuit voltage (Voc), fill factor (FF), short circuit current density (Jsc) and improved blue response with respect to the cell without buffer layer.

• 대한금속재료학회지
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• 제46권5호
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• pp.321-327
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• 2008

Cu based amorphous ($Cu_{54}Zr_{22}Ti_{18}Ni_6$) coating was produced by cold spraying as a new fabrication process. The microstructure and macroscopic properties of amorphous coating layer was investigated and compared with those of cold sprayed pure Cu coating. Amorphous powders were prepared by gas atomization and Al 6061 was used as the substrate plate. X-ray diffraction results showed that Cu based amorphous powder could be successfully deposited by cold spraying without any crystallization. The Cu based amorphous coating layer ($300{\sim}400{\mu}m$ thickness) contained 4.87% porosity. The hardness of Cu based amorphous coating represented $412.8H_v$, which was correspond to 68% of the hardness of injection casted bulk amorphous material. The wear resistance of Cu based amorphous coating was found to be three times higher than that of pure Cu coating. The 3-point bending test results showed that the adhesion strength of Cu based amorphous coating layer was higher than that pure Cu coating. It was also observed that hard Cu base amorphous particle could easily deform soft substrate by particle collisions and thus generated strong adhesion between coating and substrate. However, the amorphous coating layer unexpectedly represented lower corrosion resistance than pure Cu coating, which might be resulted from the higher content of porosity in the cold sprayed amorphous coating.

• 한국정보통신학회논문지
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• 제13권6호
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• pp.1123-1127
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• 2009

본 연구는 비정질실리콘 박막트랜지스터를 비휘발성 메모리소자로 제작함으로써 스위칭 소자로 사용되는 박막 트랜지스터(TFT)의 응용범위를 확대시키고, 비정질 실리콘 사용에 따라 대면적화에 적합하고 아울러 값싼 기판을 사용할 수 있게 한 비정질 실리콘 비휘발성 메모리소자에 관한 것이다. 이와 같은 본 연구는 유리기판과 그 유리기판위에 증착시켜 패터닝한 게이트, 그 게이트를 덮어씌운 제1 절연층, 그 제1 절연층위에 증착시켜 패터닝한 플로우팅 게이트와 그 플로우팅 게이트를 덮어씌운 제2 절연층, 그 제2 절연층위에 비정질실리콘을 증착시킨 액티브층과 그 액티브층위에 n+ 비정질실리콘을 증착시켜 패터닝한 소오스/드레인층 그리고 소오스/드레인층 위에 증착시킨 소오스/드레인층 전극으로 비정질실리콘 박막트랜지스터 비휘발성 메모리소자를 구성한다.

• Applied Microscopy
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• 제43권4호
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• pp.173-176
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• 2013

The oxidation behavior of the crystallized $Al_{87}Ni_3Y_{10}$ alloy has been investigated with an aim to compare with that of the amorphous $Al_{87}Ni_3Y_{10}$ alloy. The oxidation at 873 K occurs as follows: (1) growth of an amorphous aluminum-yttrium oxide layer (~10 nm) after heating up to 873 K; and (2) formation of $YAlO_3$ crystalline oxide (~220 nm) after annealing for 30 hours at 873 K. Such an overall oxidation step indicates that the oxidation behavior in the crystallized $Al_{87}Ni_3Y_{10}$ alloy occurs in the same way as in the amorphous $Al_{87}Ni_3Y_{10}$ alloy. The simultaneous presence of aluminum and yttrium in the oxide layer significantly enhances the thermal stability of the amorphous structure in the oxide phase. Since the structure of aluminum-yttrium oxide is dense due to the large difference in ionic radius between aluminum and yttrium ions, the diffusion of oxygen ion through the amorphous oxide layer is limited thus stabilizing the amorphous structure of the oxide phase.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.125-126
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• 2007

Polycrystalline silicon thin-film-transistors (Poly-Si TFT's) with a amorphous-$Si_xGe_y$ seed layer have been fabricated to improve the performance of TFT. The dependence of crystal structure and electrical characteristics on the the Ge fractions in $Si_xGe_y$ seed layer were investigated. As a result, the increase of grain size and enhancement of electrical characteristics were obtained from the poly-Si TFT's with amorphous-SixGey seed layer.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.28.1-28.1
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• 2011

We deposited the carbon films on Ni substrates by thermal atomic layer deposition (th-ALD), for the first time, using carbon tetrabromide ($CBr_4$) precursors and H2 reactants at two different temperatures (573 K and 673 K). Morphology of carbon films was characterized by scanning electron microscopy (SEM). The carbon films having amorphous carbon structures were analyzed by X-ray photoemission spectroscopy (XPS) and Raman spectroscopy. As the working temperature was increased from 573 K to 673 K, the intensity of C1s spectra was increased while that of O1s core spectra was reduced. That is, the purity of carbon films containing bromine (Br) atoms was increased. Also, the thin amorphous carbon films (ALD 3 cycle) were transformed to multilayer graphene segregated on Ni layer, through the post-annealing and cooling process.

• Transactions on Electrical and Electronic Materials
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• 제12권5호
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• pp.197-199
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• 2011

In this paper, the bottom-gate thin-film transistors (TFTs) were fabricated with an amorphous/microcrystalline Si double layer (DL) as an active layer and the variations of the electrical characteristics were investigated according to the DC bias stresses. Since the fabrication process of DL TFTs was identical to that of the conventional amorphous Si (a-Si) TFTs, it creates no additional manufacturing cost. Moreover, the amorphous/microcrystalline Si DL could possibly improve stability and mass production efficiency. Although the field effect mobility of the typical DL TFTs is similar to that of a-Si TFTs, the DL TFTs had a higher reliability with respect to the direct current (DC) bias stresses.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.80-82
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• 2009

The dependence of the efficiency characteristics of hydrogenated amorphous silicon single junction solar cells on the various intrinsic layer thickness has been investigate in the glass/$SnO_2$:F/p,i,n a-Si:H/Al type of amorphous silicon solar cells by cluster PECVD system. The open circuit voltage, short circuit current, fill factor and conversion efficiency have been measured under AM 1.5 condition. The result of the cell performance was improved about 8.2% due to an increase in the short circuit current.