• Transactions of Materials Processing
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• v.4 no.4
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• pp.353-364
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• 1995

An inhomogeneous rolling texture of high purity aluminum has been observed by a multilayered rolling. The shear texture of (100)[110] component developed in the surface layer, and the copper type rolling texture developed in the middle and center layers. The through-thickness texture variation has been calculated by the full-constraint Taylor model combined with FEM. The calculated results are in good agreement with the measured data.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.555-559
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• 2005

An oxygen free copper severely-deformed by eight cycles (an equivalent strain of $\~6.4$) of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to $300^{\circ}C$. The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to $150^{\circ}C$, however above $200^{\circ}C$ they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. Tensile strength and hardness of the copper decreased slightly with the annealing temperature up to $150^{\circ}C$, however they dropped largely above $200^{\circ}C$. Annealing characteristics of the copper were compared with those of a commercially pure aluminum processed by ARB and subsequently annealed.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.705-706
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• 2008

There has been, in recent years, effort to make cast copper rotors for industrial use of induction motors. Because the incorporation of copper for the conductor bars and end rings of the induction motor in place of aluminum would result in attractive improvements in motor energy efficiency. The purpose of this method is a reducing the copper loss as using higher conductivity of copper. In this paper as the single phase induction motor is studied, the stator slots and coil turn number is designed for adjusting the slot fill factor and improving its efficiency. At this time design is basis on calculation of reducing loss. And finally this paper shows that the before and after result is compared and analyzed.

• Corrosion Science and Technology
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• v.21 no.6
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• pp.476-486
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• 2022

Recently, aluminum 6061 instead of copper alloy is used for cooling heat exchangers used in the internal combustion of engines due to its economic feasibility, lightweight, and excellent thermal conductivity. In this study, aluminum 6061 alloy was anodized with oxalic acid, phosphoric acid, or chromic acid as an anodizing electrolyte at the same concentration of 0.3 M. After the third anodization, FDTS, a material with low surface energy, was coated to compare hydrophobic properties and anti-icing characteristics. Aluminum was converted into an anodization film after anodization on the surface, which was confirmed through Energy Dispersive X-ray Spectroscopy (EDS). Pore distance, interpore distance, anodization film thickness, and solid fraction were measured with a Field Emission Scanning Electron Microscope (FESEM). For anti-icing, hydrophobic surfaces were anodized with oxalic acid, phosphoric acid, or chromic acid solution. The sample anodized in oxalic acid had the lowest solid fraction. It had the highest contact angle for water droplets and the lowest contact hysteresis angle. The anti-icing contact angle showed a tendency to decrease for specimens in all solutions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.927-930
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• 2001

We studied the electrical properties of Copper(II)-phthalocyanine (Cu-Pc) as a hole transport layer in organic light emitting devices (OLEDs). OLEDs were constructed with ITO/CU-Pc/triphenyl-diamine (TPD)/tris-(8-hydroxyquinoline) aluminum ( Alq$_3$) + 4- (Dicyanomethylene)-2-methyl-6-(4-dimethylaminostyryl)-4H-pyran (DCM)/Al. It was consisted of a thin DCM in Alq$_3$emission layer. We observed that the change of recombination zone was moved toward the cathode as the hole mobility increased due to the heat-treatment temperature of Cu-Pc layer increased.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2008.11a
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• pp.173-178
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• 2008

This is green roof bottom system which composed by aluminum valve and glass fiber together as major reinforcement, so the cooper sheet can have root proof, and using recycled tire gel-type membrane waterproofing system which dost not contains VOCs. The copper sheet reduce the plants' root growing, so it helpes to maintain the waterproofing layer and stability of root proofing. Gel type membrane waterproofing system can do waterproofing, stress dispersion, and reducing leakage expansion. So those two materials can help each other to make green roof bottom layer would have the stability and durability.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.76-85
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• 2013

This study was carried out to investigate the relation between surface roughness and heat absorption capability of materials for solar collector. For this purpose, 3 kinds of materials (copper, aluminum, iron), 5 kinds of surface roughness (scrubber, alumina sand #80, #200, #400, glass bead) and 2 kinds of surface treatment (black chrome plating, copper black coating) were used for finding optimal conditions to apply solar collector. As the results, it was confirmed that the optimal relations between surface roughness and surface treatment as well as optimal materials were necessary. Further, heat absorption capability was showed good results in cases of copper materials, glass bead and black chrome plating.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.2
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• pp.113-119
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• 2003

We report the electrical properties of copper(II)-phthalocyanine(Cu-Pc) as a hole injaction layer in organic light-emitting diode (OLED). OLEDs were constructed by the following material structure : indium tin oxaide (ITO)/ CuPc/ triphenyl-diamine (TPD)/ tris-(8-hydroxyquinoline)aluminum (Alq3)/4-(Dicyanomethlene)-2-methyl-6-(4-dimethylaminostyryl)-4H-pyran (DCM)/ Al. we observed that the change of recombination zone by using a DCM detection thin layer (6 ${\AA}$) in a Alq$_3$ emitting layer. layer. Recombination zone was moved toward the cathode as the hole mobility increased due to the heat-treatment temperature of cupc layer increased.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.151-152
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• 2012

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.229-229
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• 2012

Adhesion of Copper film on the aluminum oxide layer formed by anodizing an aluminum plate was enhanced by applying ion beam mixing method. Forming an conductive metal layer on the insulating oxide surface without using adhesive epoxy bonds provide metal-PCB(Printed Circuit Board) better thermal conductivities, which are crucial for high power electric device working condition. IBM (Ion beam mixing) process consists of 3 steps; a preliminary deposition of an film, ion beam bombardment, and additional deposition of film with a proper thickness for the application. For the deposition of the films, e-beam evaporation method was used and 70 KeV N-ions were applied for the ion beam bombardment in this work. Adhesions of the interfaces measured by the adhesive tape test and the pull-off test showed an enhancement with the aid of IBM and the adhesion of the ion-beam-mixed films were commercially acceptable. The mixing feature of the atoms near the interface was studied by scanning electron microscopy, Auger electron spectroscopy, and X-ray photoelectron spectroscopy.