• Journal of the Korean Ceramic Society
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• v.35 no.4
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• pp.406-412
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• 1998

The reaction bonded alumina ceramics was prepared through the addition of each SiC and ZrO2 powder to the mixture of Al metal powder and Al2O3 The mono sized (3mm) and biodal sized (3mm+5mm) balls were used in attrition milling of Al and starting powders. The milling efficiency of both cases was compared by the analysis of particle size and X-ray diffraction. After the forming and sintering of each powder batchs the weight gains dimensional changes and densities were determined. The specimens were investigated by X-ray diffraction analysis and scanning electron microscope. Bimodal sized balls had better milling effect than single ball size in the milling of Al powder. However in the milling which ceramic powders mono sized the green body during the reaction sintering at 1$600^{\circ}C$ for 5 hour was about 10% The densities attained the values of 92-98% theoretical. The SiC added specimen that was milled with 3mm ball media had 96% theoretical density and dense microstructure.

• Journal of Powder Materials
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• v.10 no.5
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• pp.337-343
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• 2003

Nanostructured Cu-$Al_2O_3$ composite powders were synthesized by thermochemical process. The synthesis procedures are 1) preparation of precursor powder by spray drying of solution made from water-soluble copper and aluminum nitrates, 2) air heat treatments to evaporate volatile components in the precursor powder and synthesis of nano-structured CuO + $Al_2O_3$, and 3) CuO reduction by hydrogen into pure Cu. The suggested procedures stimulated the formation of the gamma-$Al_2O_3$, and different alumina formation behaviors appeared with various heat treating temperatures. The mean particle size of the final Cu/$Al_2O_3$ composite powders produced was 20 nm, and the electrical conductivity and hardness in the hot-extruded bulk were competitive with Cu/$Al_2O_3$ composite by the conventional internal oxidation process.

• Journal of Powder Materials
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• v.13 no.6 s.59
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• pp.432-438
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• 2006

Aluminum nitride (AlN) nanopowders with low degree of agglomeration and uniform particle size were synthesized by carbothermal reduction of alumina and subsequent direct nitridization. Boehmite powder was homogeneously admixed with carbon black nanopowders by ball milling. The powder mixture was treated under ammonia atmosphere to synthesize AlN powder at lour temperature. The effect of process variables such as boehmite/carbon black powder ratio, reaction temperature and reaction time on the synthesis of AlN nanopowder was investigated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.227-230
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• 2002

New polishing technique for small parts has been tried out using the principle of particle electromechanics. Common fine abrasives such as alumina, diamond, silicon carbide are dielectric materials which are polarized under an electric field, and a non-uniform electric field makes abrasive particles translate along the field line. Using this principle, We make abrasive particles aggregate in the vicinity of the micro tool which is fir the surface finishing of a small part without contact with it. The behavior of particles is optically measured, and the machined depth of glass is examined.

• 연구논문집
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• s.33
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• pp.147-155
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• 2003

In order to fabricate porous materials having an anisotropic thermal conductivity by aligning plate-shaped pores structure, alumina powder (AM-21, mean particle size $4\mum$) and flake crystalline graphite was used. The aligned pore structure was realized using multi-pressing process. Degree of pore orientation increased with the number of pressing and thermal conductivity, parallel to the pressing direction, decreased with the number of pressing. Thermal conductivity decreased significantly to the addition of 30vol% crystalline graphite, however, in the case of 60vol%, thermal conductivity did not decrease significantly due to the breakage of crystalline graphite. An anisotropy of the thermal conductivity increased with the content of crystalline graphite up to 30vol%. Graded pore structure was fabricated by controlling the content and size of crystalline graphite, which provides, possibly, the enhancement in mechanical strength and thermal insulation properties of the insulating bricks.

• The Korean Journal of Ceramics
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• v.1 no.4
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• pp.219-223
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• 1995

Ceramic membranes of the supported $TiO_2-CeO_2$ were prepared by dip-coating method on an $\alpha-Al_2O_3$ porous substrate. The mean pore diameter of an alumina support was 0.125 um. The mean particle diameter of $TiO_2-CeO_2$ top layer varied with firing temperature and ranged from 20 to 85 nm. The thermal stability of the composite membranes was studied from their surface microstructure after calcination at $600-900^{\circ}C$. The supported $TiO_2-CeO_2$ composite membranes exhibited much higher heat resistance than the $TiO_2$ membrane.

• Transactions on Electrical and Electronic Materials
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• v.5 no.6
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• pp.233-236
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• 2004

Copper metallization has been used in high-speed logic ULSI devices instead of the conventional aluminum alloy metallization. One of the key issues in copper CMP is the development of slurries that can provide high removal rates. In this study, the effects of slurry chemicals and pH for slurry dispersion stability on Cu CMP process characteristics have been performed. The experiments of copper slurries containing each different alumina and colloidal silica particles were evaluated for their selectivity of copper to TaN and $SiO_{2}$ films. Furthermore, the stability of copper slurries and pH are important parameters in many industries due to problems that can arise as a result of particle settling. So, it was also observed about several variables with various pH.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• Journal of ILASS-Korea
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• v.17 no.1
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• pp.9-13
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• 2012

This study investigates experimentally evaporation characteristics of nanofluid droplets containing 50 nm alumina($Al_2O_3$) particles and the wettability changes on a hydrophilic glass surfaces. From the captured digital images by using a CMOS camera and a magnifying lens, we examined the effect of particle concentration on droplet evaporation rate which can be indirectly deduced from the measured droplet volumes varying with time. In particular, with the use of a digital image analysis technique, the present study measured droplet perimeters and the contact angles to study the wetting dynamics during evaporating process. In addition, we compared the measured total evaporation time with theoretically estimated values. It was found that as the volume fractions of nanofluid increased, the total evaporation time and the initial contact angles decreased, while the droplet perimeters increased.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.274-278
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• 2002

The purpose of this study was to characterize the reaction of Cu surface with Cu slurry and CMP performance as a function of additives in CMP slurry. The polish rate of Cu was dependent on the kind of organic acids added in slurry. It was considered that polish rate of Cu was dependent on the concentration of carboxylates and mean particle size. When the etchant and oxidant were added in slurry, the highest removal rate and lower etch rate were measured at neutral pH. The addition of etchant, oxidant and pH adjustor played key roles of CMP ability in slurry. As the pH increased, polish rate of Cu was increased by the enhanced the mechanical effects due to effective dispersion of slurry particles. Alumina abrasives was more desirable for 1st step slurry because of high removal rate of Cu and high selectivity ratio among TaN and Cu.