• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.152-152
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• 2017

Titanium and its alloys have been widely used for biomedical applications. However, the use of the Ti-6Al-4V alloy in biomaterial is then a subject of controversy because aluminum ions and vanadium oxide have potential detrimental influence on the human body due to vanadium and aluminum. Hence, recent works showed that the synthesis of new Ti-based alloys for implant application involves more biocompatible metallic alloying element,such as, Nb, Hf, Zr and Mo. In particular, Nb and Hf are one of the most effective Ti ${\beta}$-stabilizer and reducing the elastic modulus. Plasma electrolyte oxidation (PEO) is known as excellent method in the biocompatibility of biomaterial due to quickly coating time and controlled coating condition. The anodized oxide layer and diameter modulation of Ti alloys can be obtained function of improvement of cell adhesion. Silicon (Si) and magnesium (Mg) has a beneficial effect on bone. Si in particular has been found to be essential for normal bone and cartilage growth and development. In vitro studies have shown that Mg plays very important roles in essential for normal growth and metabolism of skeletal tissue in vertebrates and can be detected as minor constituents in teeth and bone. Therefore, in this study, Si and Mg coatings on the hydroxyapatite film formed Ti-29Nb-xHf alloys by plasma electrolyte oxidation has been investigated using several experimental techniques. Ti-29Nb-xHf (x= 0, 3, 7 and 15wt%, mass fraction) alloys were prepared Ti-29Nb-xHf alloys of containing Hf up from 0 wt% to 15 wt% were melted by using a vacuum furnace. Ti-29Nb-xHf alloys were homogenized for 2 hr at $1050^{\circ}C$. The electrolyte was Si and Mg ions containing calcium acetate monohydrate + calcium glycerophosphate at room temperature. The microstructure, phase and composition of Si and Mg coated oxide surface of Ti-29Nb-xHf alloys were examined by FE-SEM, EDS, and XRD.

• Journal of Electrochemical Science and Technology
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• v.6 no.2
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• pp.65-74
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• 2015

This work examines the characterization and corrosion behaviour of laser alloyed UNSG10150 steel with three different premixed composition Zn-Sn binary powders using a 4.4 kW continuous wave (CW) Rofin Sinar Nd:YAG laser processing system. The steel alloyed samples were cut to corrosion coupons, immersed in sulphuric acid (0.5 M H₂SO₄) solution at 30℃ using electrochemical technique and investigated for its corrosion behaviour. The morphologies and microstructures of the developed coated and uncoated samples were characterized by Optic Nikon Optical microscope (OPM) and scanning electron microscope (SEM/EDS). Moreover, X-ray diffractometer (XRD) was used to identify the phases present. An enhancement of 2.7-times the hardness of the steel substrate was achieved in sample A₁ which may be attributed to the fine microstructure, dislocations and the high degree of saturation of solid solution brought by the high scanning speed. At scanning speed of 0.8 m/min, sample A₁ exhibited the highest polarization resistance R_p (1081678 Ωcm² ), lowest corrosion current density i_corr (4.81×10⁻⁸A/cm² ), and lowest corrosion rate Cr (0.0005 mm/year) in 0.5 M H₂SO₄. The polarization resistance R_p (1081678 Ωcm² ) is 67,813-times the polarization of the UNSG10150 substrate and 99.9972% reduction in the corrosion rate.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.274-274
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• 2012

In-depth analysis by secondary ion mass spectrometry (SIMS) is very important for the development of electronic devices using multilayered structures, because the quantity and depth distribution of some elements are critical for the electronic properties. Correct determination of the interface locations is critical for the calibration of the depth scale in SIMS depth profiling analysis of multilayer films. However, the interface locations are distorted from real ones by the several effects due to sputtering with energetic ions. In this study, the determination of interface locations in SIMS depth profiling of multilayer films was investigated by Si/Ge and Ti/Si multilayer systems. The original SIMS depth profiles were converted into compositional depth profiles by the relative sensitivity factors (RSF) derived from the atomic compositions of Si-Ge and Si-Ti alloy reference films determined by Rutherford backscattering spectroscopy. The thicknesses of the Si/Ge and Ti/Si multilayer films measured by SIMS depth profiling with various impact energy ion beam were compared with those measured by TEM. There are two methods to determine the interface locations. The one is the feasibility of 50 atomic % definition in SIMS composition depth profiling. And another one is using a distribution of SiGe and SiTi dimer ions. This study showed that the layer thicknesses measured with low energy oxygen and Cs ion beam and, by extension, with method of 50 atomic % definition were well correlated with the real thicknesses determined by TEM.

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.883-889
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• 1999

The pure Al or-(1,2,3wt%)Cu alloy internal chill with 4,6,8,12 and 15mm ø, respectively, was inserted at the center of a graphite mold with the size of 95mm ø$\times$200mm H. The molten metal with the same composition as the internal chill was poured into the mold at the pouring temperature of $750^{\circ}C$ and the cooling rates, solidified structures and chemical segregation were analyzed. The results represented that there was remarkable increased in cooling rate as well as decrease in grain size, secondary dendrite arm spacing and chemical segregation as the ratio of ingot to internal chill diameter was increased to 8. However there was a considerable drop of the internal chill effect when this ratio exceeded 8, resulting from incomplete melting of internal chills. The optimum ratio for the maximum internal chill effect of pure Al and-(1,2,3wt%)Cu allolys was 8 at the given pouring temperature.

• Journal of Korea Foundry Society
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• v.6 no.1
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• pp.12-19
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• 1986

This study was undertaken to understand the formation mechanism of the hard spots in high strength brass. To investigate the behavior of the hard spots in the isothermal liquid state with varying silicon content, the rapidly quenched specimens were obtained by suctioning the melt into the silica tube and water quenching. To examine the growth process of the hard spots with holding time, the unidirectional solidification technique was used. The results of this study are summarized as follows: 1) With the addition of Fe in order to get the effects of grain refinement in high strength brass, the two different type of Fe-rich phases are occurred, which are defined as dendritic and globular phase. The chemical composition of the globular phase was different from that of the dendritic phase in that the globular phase contained Si. 2) With increasing Si content, the Fe-rich phase had a tendency to form globular phase. 3) As the holding time increased in the liquid state, globular was also prone to coalesce. The further growth of globular phase to large size was due to reducing the interfacial energy. 4) The primary phase of copper alloy was nucleated preferentially on the dendritic phase. It was noticeable that the dendritic phase acted as a grain refiner. However, the agglomerate (hard spots) which was composed of the globular phase decreased the mechanical properties of high strength brass. 5) Once the hard spots formed in the high strength brass casting, it was very difficult to remove them. This is due to the fact that their meting temperature is higher than the pouring temperature of high strength brass.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.391-394
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• 2002

There has recently been much interest and research in developing digital x-ray systems based on using amorphous selenium(a-Se) photoconductors as the image receptor. The amorphous selenium layer that is currently being studied for use as an x-ray photoconductor is not pure a-Se but rather amorphous selenium alloyed with arsenic. We fabricated samples using the selenium and arsenic alloy with various concentrations of the arsenic. In this work, x-ray photoconductor using amorphous selenium alloyed with arsenic were fabricated with different concentrations of the arsenic (0.1 wt.%, 0.3wt.%, 0.5wt.%, 1wt.%, 1.5wt.%, 3wt.%, 5wt.%). The seven kind of samples was fabricated with a-Se alloyed with arsenic through vacuum thermal evaporation. We also investigate the arsenic concentration dependence on the device performance in radiation detector. The electric characteristics of radiation detector devices with changing additive ratio of the arsenic is performed by measuring the x-ray induced photocurrent and integrating it over time to find the total charge. The thickness of a-Se is $100{\mu}m$. Bias voltages $3V/{\mu}m$, $6V/{\mu}m$， $9V/{\mu}m$ are applied at the samples. As results, the net charge of a-Se 0.3% As sample is $526.0pC/mR/cm^2$ at $9V/{\mu}m$ bias. The net charge is decreased as with the increasing additive ratio of arsenic.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.436-439
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• 2002

Recently, It has performed that the basic research of the photoconductive material and the development and application of the digital radiograph detector which is divided into the direct and indirect method. The objective of this study investigate the effect of the electric characteristic about changing the composition of Arsenic in hybrid detector system for compensating a defect of conventional. We fabricated samples using the amorphous Selenium and Arsenic alloy with various concentrations of the Arsenic{seven step 0.1%, 0.3%, 0.5%, 1%, 1.5%, 3%, 5%). And using EFIRON optical adhesives the formed multi-layer$(Gd_{2}O_{2}S(Eu^{2+}))$ composed phosphor layer. X-ray and light sensitivity was measured to study x-ray response characteritics. As results, highest value was measured as output net charge and SNR were $315.7pC/cm^2/mR$ and 99.4 at 0.3%As doping ratio.

• Corrosion Science and Technology
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• v.8 no.4
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• pp.143-147
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• 2009

In biomedical implants and dental fields, titanium has been widely utilized for excellent corrosion resistance and biocompatibility. However, Ti and its alloys are nonbioactive after being implanted in bone. In this study, for the purpose of improvement in biocompatibility the anodic $TiO_2$ layer on Ti-xNb alloys were fabricated by electrochemical method in phosphate solution, and the effect of Nb content on the pore size, the morphology and crystallinity of Ti oxide layer formed by the anodic oxidation method was investigated. The Ti containing Nb up to 3 wt%, 20 wt% and 40 wt% were melted by using a vacuum furnace. The sample were cut, polished, and homogenized for 24 hr at $1050^{\circ}C$ for surface roughness test and anodizing. Titanium anodic layer was formed on the specimen surface in an electrolytic solution of 1 M phosphoric acid at constant current densities ($30mA/cm^2$) by anodizing method. Microstructural morphology, crystallinity, composition, and surface roughness of oxide layer were observed by FE-SEM, XRD, EDS, and roughness tester, respectively. The structure of alloy was changed from $\alpha$-phase to $\beta$-phase with increase of Nb content. From XRD results, the structure of $TiO_2$ formed on the Ti-xNb surface was anatase, and no peaks of $Nb_2O_5$ or other Nb oxide were detected suggesting that Nb atoms are dispersed in $TiO_2$-based solid solution. Surface roughness test and SEM results, pore size formed on surface and surface roughness decreased as Nb content increased. From the line analysis results, intensity of Ti peak was high in the center of pore, whereas, intensity of O peak was high in the outside of pore center.

• Journal of the Korean Ceramic Society
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• v.35 no.1
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• pp.79-87
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• 1998

Melt spun YbBa2Cu3Agx(x=0, 5, 12, 16 and 53) precursor alloy ribbons were oxidized at 263-330$^{\circ}C$ and treated at 820$^{\circ}C$, 855$^{\circ}C$ and 885$^{\circ}C$ under 1.0 atm oxygen pressure. In the ribbons treated at 820$^{\circ}C$, 855$^{\circ}C$and 885$^{\circ}C$ 1-2-4 phase (YbBa2Cu4O8) and 1-2-3 phase (YbBa2Cu3O{{{{ OMICRON _7-$\delta$ }})were formed respectively. The shape of 1-2-4 phase was distorted or ellipsoid. The 2-4-7 and 1-2-3 phases tooked the shape of bar. All the ribbons showed zero critical current density Jc at 77K in zero magnetic field. By considering the shape and the highest critical temperature (among the three phases) of the 1-2-3 phase we tried to increase the critical current density of the ribbons treated at 885$^{\circ}C$ by press deformation. About tenribbons were stacked and coupled by press deformation and then treated at 885$^{\circ}C$ These 1-2-3 phase did not show any texture in any of the ribbons. However they exhibited weak texture in the multilayered specimens. Among the multilayered specimens YbBa2Cu3Ag16 exhibited a Jc of 180 A/cm2 Among the above ribbons YbBa2Cu3Ag16 ribbon has the optimum composition to produce textured superconducting oxide with improved Jc by press deformation. Onset critical temperatures Ton of the multilayered YbBa2Cu3Agx(x=5, 12, 16 and 53) were measured as 88-90 K.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.