• Structural Engineering and Mechanics
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• v.63 no.3
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• pp.361-370
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• 2017

Through the use of finite element analysis and acoustic emission techniques we have evaluated the interfacial failure of a carbon fiber reinforced polymer (CFRP) repair patch on a notched aluminum substrate. The repair of cracks is a very common and widely used practice in the aeronautics field to extend the life of cracked sheet metal panels. The process consists of adhesively bonding a patch that encompasses the notched site to provide additional strength, thereby increasing life and avoiding costly replacements. The mechanical strength of the bonded joint relies mainly on the bonding of the adhesive to the plate and patch stiffness. Stress concentrations at crack tips promote disbonding of the composite patch from the substrate, consequently reducing the bonded area, which makes this a critical aspect of repair effectiveness. In this paper we examine patch disbonding by calculating the influence of notch tip stress on disbond area and verify computational results with acoustic emission (AE) measurements obtained from specimens subjected to uniaxial tension. The FE results showed that disbonding first occurs between the patch and the substrate close to free edge of the patch followed by failure around the tip of the notch, both highest stress regions. Experimental results revealed that cement adhesion at the aluminum interface was the limiting factor in patch performance. The patch did not appear to strengthen the aluminum substrate when measured by stress-strain due to early stage disbonding. Analysis of the AE signals provided insight to the disbond locations and progression at the metal-adhesive interface. Crack growth from the notch in the aluminum was not observed until the stress reached a critical level, an instant before final fracture, which was unaffected by the patch due to early stage disbonding. The FE model was further utilized to study the effects of patch fiber orientation and increased adhesive strength. The model revealed that the effectiveness of patch repairs is strongly dependent upon the combined interactions of adhesive bond strength and fiber orientation.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.31-35
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• 2000

The stress state developed in a thin adhesive layer bonded between the semiconductor chip and the leadframe and subjected to a shear loading is investigated. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. Within the context of a linear elastic theory, a stress singularity of type $\gamma^{\lambda=1}$(0<1<1) exists at the point where the interface between one of the rigid adherends and the adhesive layer intersects the free surface. Such singularity might lead to edge crack or delamination.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.87-90
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• 2003

In this paper, the electromechanical displacements of curved actuators such as THUNDER are calculated by finite element method to design the optimal configuration of curved actuators. To predict the pre-stress in the device due to the mismatch in coefficients of thermal expansion, the adhesive as well as metal and PZT ceramic is also numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers causes the numbers of degree of freedom to increase, large-scale structural analyses are performed in a cluster system in this study. The curved shape and pre-stress in the actuator are obtained by the cured curvature analysis. The displacement under the piezoelectric force by an applied voltage is also calculated to compare the performance of curved actuator. The thickness of metal and adhesive, the number of metal layer are chosen as design factors.

• Magazine of the Korea Concrete Institute
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• v.9 no.6
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• pp.157-164
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• 1997

최근 손상된 구조물에 탄소섬유쉬트 보강공법이 많이 사용되고 있다. 탄소섬유쉬트 보강에 따른 휨내력의 증진이 이루어지기 위해서는 보와 탄소섬유쉬트의 일체거동이 이루어져야 하며, 쉬트단부에서 부착파괴가 발생하지 않아야 한다. 따라서 이번 실험에서는 탄소섬유쉬트의 보강매수에 따른 부착파괴의 거동을 살펴보았다. 전시험체에서 부착파괴가 발생하였으며 부착파괴가 발생한 하중의 크기는 보강매수에 관계없이 비슷하였다. 부착파괴의 거동은 순수부착파괴와 피복박리파괴로 구분될 수 있었으며 부착응력은 단부에서 집중현상이 나타났고 집중된 응력의 크기는 15.39~41.42kg/$\textrm{cm}^2$로 나타났다. 정착길이내의 평균부착응력은 6.85~8.99kg/$\textrm{cm}^2$으로서 평균 7.38kg/$\textrm{cm}^2$이고 이 값은 이론치인 6.19kg/$\textrm{cm}^2$보다 약간 높으며 설계부착응력인 6kg/$\textrm{cm}^2$에 부합되는 것으로 나타났다. 따라서 설계부착응력 6kg/$\textrm{cm}^2$은 정착길이의 설계시 합리적 값으로 평가되었다.

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.102-105
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• 2000

• Proceedings of the KWS Conference
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• 1999.05a
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• pp.260-263
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• 1999

• Proceedings of the KACD Conference
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• 2006.05a
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• pp.250-250
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• 2006

• Transactions of the Korean Society of Mechanical Engineers
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• v.5 no.3
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• pp.217-222
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• 1981

The stress analysis of two-orthotropic layer, adhesively bonded structures is considered. An orthotropic plate has a through-crack of finite length and is adhesively bounded by a sound orthotropic plate. The problem is resuced to a pair of Fredholm integral equations ofthe second kind. Using a numerical integration scheme to evaluate the intgrals, The integral equations are reduced to a system of algebraic equations. By solving these equations some numerical results for stress intensity factors are presented for various crack lengths.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2436-2441
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• 2002

Finite element technique considering adhesive forces is proposed and applied to analyze the behavior of elastic hemispherical asperity adhesively contacting the plane surface of semi -infinite rigid body. It is demonstrated that the finite element model simulates interfacial phenomena such as jump -to-contact and adhesion hysteresis that cannot be simulated with the currently available adhesive contact continuum models. This simulation aiso provides valuable information on contact pressure, contact region and stress distributions. This technique is anticipated to be utilized in designing a low-adhesion surface profile for MEMS/NEMS applications since various contact geometries can be analyzed with this technique.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2001.11a
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• pp.8-13
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• 2001

In recently, polishing tile(porcelain homogeneous polished tile) was used in the construction field as a finishing material. But, there happened some problems such as tile exfoliation by construction condition in early ages. Also, in the dry wall system which used to lightweight wall, for use of polishing tile on dry wall, the examination of adhesive stability of polishing tile is needed. In this Paper, adhesive strength of Polishing tile was investigated by tile bond types on gypsum board and non asbestos board coated by tar-urethane and polymer modified cementitious waterproofing membrane(Series I). Then, the effect of heat stress and vibration was estimated on gypsum and non asbestos board(Series II).